Intel Q370 MIL-STD Fanless Rugged System with Intel 8th Core i7-8700T Coffee Lake processor, Extended range of Temperature -40°C to 60°C
- MIL-STD 810G Compliance
- 8th Gen Intel Core i7-8700T Processor
- Up to 32GB DDR4 RAM
- Multi display with displayport, HDMI & DVI
- 1 x 2.5” SSD
- 2 x Intel gigabit Ethernet
- 6 x USB ports, 3 x COM port
- 12V to 24V DC-in
- Extended temperature -20°C to 60°C
- Technical Profile
SR10-SCHX3 is a high efficiency and powerful computing system driven by the Intel 8th Gen, 6 Core, 12 Thread processor, that can successfully operate with a high speed efficiency processing program. Besides, there are three independent display output ports supporting the system, including one Display Port, one HDMI, and one DVI-D. What’s more, SR10-SCHX3 is equipped with two USB2.0 and four USB3.1, provide the best input and output efficiency. The system also supports a wide range DC-in from 12V to 24V, and accepts the extend range of temperature from -20°C to 60°C. SR10-SCHX3 passes the MIL-STD 810G compliance which can operate successfully in any harsh environments.
- Thermal solution for fanless system design
7starlake designs a unique enclosure that is able to stack together both horizontally and vertically. The aluminum heat sink enclosure allows perfect heat dissipation. 7starlake exclusively adopts special heat radiating material and combining with special CNC cutting, further forged into a lavish sophisticated metal. Apart from the special heat sink enclosure, SR10-SCHX3 innovatively adopts two kinds of copper heat spreader. The shape and the size of the spreader are tailor-made based on the heat sources placement of CPU module and graphic module. In view of the gap difference between motherboard and heat sink, 7starlake builds two heat spreaders in different thicknesses. Combining all these exclusive thermal designs can alternatively replace traditional fan, and also ensures high reliability and stability while working under wide range temperature from -20°C up to 60°C.
- MIL-STD-810G standard designed for shock and vibration
SR10-SCH-X3 is designed to meet MIL-STD-810G standard for shock and vibration. MIL-STD-810G standard is considered the upmost principle, which guarantees the system achieves superior quality and stability when operate under extreme harsh environment. We have conducted the test with series of testing procedures for resistance to shock, vibration, dust, humidity, and extreme temperatures.
1. Intel 8th Gen processor, 6 Core, 12 Thread supports
Intel 8th Core i7-8700T Coffee Lake processor with Intel Turbo Boost Technology that the operating Frequency can increase up to 4.0 GHz. The processor equipped with 12MB SmartCache to decrease the overall cache miss rate. The Intel 8th Core i7-8700T processor effectively operates with 6 Core and 12 Thread, which supports the best high speed operations and processes.
2. Flexible display output & triple display
The various display output ports of SR10-SCHX3 supports 1 x DisplayPort, 1 x HDMI, and 1 x DVI-D with Full HD 1080P resolution display. The system can not only provide the single desktop display but also allow triple screens display. The high flexible display output can accept diverse applications and provide the best display performance.
The integrated UHD Graphics supports three independent displays with 4k resolution each, and comes with hardware-based video encoding and decoding up to 4k. It features DVI, HDMI and DisplayPort outputs to provide advanced solutions for imaging, machine vision, infotainment, medical and gaming machines.
3. USB 3.1 Gen 2
SR10-SCHX3 is equipped with USB 3.1 Gen 2, which dramatically enhance the transfer rate up to 10 Gbps, which means it efficiently saves the data transfer processing time. For example, USB 3.1 Gen 2 only needs to spend 4.13s for transferring a 5GB document, but USB 3.0 needs to spend 10s for transferring a 5GB document. Besides, USB 3.1 Gen 2 improves the Encoded Mode to 128b/132b, successfully decrease the dissipation rate of data transfer to 3%.
|USB 2.0||HiSpeed||500mA||480 Mbps||8b/10b||-20%||48 MB/s|
|USB 3.0/ 3.1 Gen 1||SuperSpeed||900mA||5.0 Gbps||8b/10b||-20%||500 MB/s|
|USB 3.1 Gen 2||SuperSpeed+||5000mA||10 Gbps||128b/132b||-3.03%||1.21 GB/s|
|-20°C to 60°C ( ambient with air flow )|
|CPU||Intel® 8th Gen Core™ i7-8700T (Frequency 2.4GHz, Turbo Boost Frequency up to 4.0GHz),
6-Core, 12 Thread Support, 12MB SmartCache. Build-in UHD Graphics 630 for excellent 3D,
Turbo Boost Technology 2.0, VPro and Hyper-Threading support
|Memory||Up to 32GB DDR4 RAM|
|GPU||Intel® UHD Graphics 630|
|Display Port||Resolution up to 4096x2304@60Hz|
|HDMI||Resolution up to 4096×2160@30Hz|
|DVI-D||Resolution up to 1920x1200 @ 60Hz|
|Storage Device||1 x 2.5" Solid State Disk (SSD)
1 x mSATA Rugged Industrial NAND Flash mSATA Storage w/ Rugged -40/+85C
High Capacity, optional Pre-loaded with Linux or Windows OS.
64 / 128 / 256 / 512GB /1TB / 2TB Innodisk 3MG2-P Series MLC SATA III 6Gb/s Flash
SSD, Rated for 520 MB/sec Sequential Read ; 350 MB/sec Write Max.
|2 x Intel Gigabit Ethernet LAN Interfaces (10/100/1000 Mbps)|
|DisplayPort||1 x 20Pin DisplayPort connector (Female)|
|HDMI||1 x 19Pin HDMI connector (Female)|
|DVI-D||1 x 20Pin DVI-D connector (Female)|
|Ethernet||2 x RJ45 Gigabit Ethernet LAN Interfaces|
|USB Port||4 x USB3.1 Gen2 standard-A connectors|
|Serial Port||1 x DB9 connector (RS-232)|
|Audio Port||1 x Line-Out, 1 x MIC-In connector|
|DC-IN||4P Rugged Terminal connector|
|Button||1 x Power Button w/Indicator LED|
|Indicator LED||1 x HDD LED|
|USB Port||2 x USB2.0 standard-A connectors|
|Serial Port||2 x DB9 connectors (1 x RS-232, 1 x RS232/422/485)|
Applications, Operating System
|Applications||Commercial and Military Platforms Requiring Compliance to MIL-STD-810G
Embedded Computing, Process Control, Intelligent Automation and manufacturing
applications where Harsh Temperature, Shock, Vibration, Altitude, Dust and
Used in all aspects of the military.
|Operating System||Windows 10 64bit
Ubuntu16.04, Ubuntu14.04, Fedora 28
|Dimension (W x D x H)||308 x 149 x 65.2 mm|
|Chassis||Aluminum Alloy, Corrosion Resistant.|
|Finish||Anodic aluminum oxide (Color Iron gray)|
|Cooling||Natural Passive Convection/Conduction. No Moving Parts|
|Connectors||DC-IN : PHOENIX CONTACT 1776715 RJ45 Ethernet :
COM: FEN YING SM10-09P
DVI : FOXCONN QH11121-DA4E-4F
HDMI + DP : JKCR Display and HDMI Female
|Ingress Protection||Dust Proof (Similar to IP50)|
|MIL-STD-810G Test||Method 507.5, Procedure II (Temperature ® Humidity)
Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)
Method 516.6 Shock-Procedure I Operating (Mechanical Shock)
Method 514.6 Vibration Category 24/Non-Operating (Category 20 ® 24, Vibration)
Method 514.6 Vibration Category 20/Operating (Category 20 ® 24, Vibration)
Method 501.5, Procedure I (Storage/High Temperature)
Method 501.5, Procedure II (Operation/High Temperature)
Method 502.5, Procedure I (Storage/Low Temperature)
Method 502.5, Procedure II (Operation/Low Temperature)
Method 503.5, Procedure I (Temperature shock)
|Operating Temperature||-20°C to 60°C (ambient with 0.7m/s airflow)|
|Storage Temperature||-40°C to 85°C|
|EMC||CE and FCC compliance|
The rugged MIL-STD compliant system, SR10-SCH-X3 is equipped with highly effectively heat conductive and heat convective thermal solutions to meet extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system via 8.0 mm copper heat pipes. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.
|Test Temperature||High 0°C~70°C / Low –40°C~0°C|
|Test Time||9 Hours / 1 Hour|
|Test Standard||Reference IEC60068-2|
|Test Software||Burnin test v8.1|
|Criteria||After testing, system can't halt.|
- Test Configuration
Intel® Core i7-8700T (2.4Ghz, 35W, 12MB)
DSL 16GB DDR4-2400
Innodisk 128GB SSD 2.5"
Intel® i210 Gigabit Ethernet
Intel® i219 Gigabit Ethernet
Burnin test 8.1, CPU-Z,
HW monitor 1.38, AS SSD bench
KSON THS-b4t-150, Chipeng SMO-3
- Thermal Measurement
7starlake provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus 7starlake conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, 7starlake is able to analyse the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 9 hours which at each temperature point we burn in SR10-SCH-X3 for one hour, from -40 to 75°C.
SR10-SCH-X3 System - IO Performance
Point -40°C -20°C 0°C 25°C 55°C 60°C 65°C 70°C 75°C CPU T-J 1 10 28 67 82 87 92 98 99 CPU Die -22.7 -3.9 16.1 57.4 79.5 85.4 91.1 93.5 97.3 Heatsink -26.1 -7.5 12.7 53.5 73.5 78.4 83.5 88.5 92.3 Δ1=(TJ-Die) 23.7 13.9 11.9 9.6 2.5 1.6 0.9 4.5 1.7 Δ2=(Die-Sink) 3.4 3.6 3.4 3.9 6 7 7.6 5 5 CPU Frenquency (GHz) 2.1 2.1 2.2 2.0 2.0 1.9 1.9 2.0 2.0
SR10-SCH-X3 MB HeatSink - IO Performance
|Innodisk 128GB SSD ( Read ) MB/s||472.2||475.7||472.1||471.6||472.3||473.9||471.9||468.6||471.1|
|Innodisk 128GB SSD ( Write ) MB/s||369.9||376.6||374.3||384.1||382.5||381.9||381.9||385.6||383.4|