ROC286A
1U Fanless System with Intel® Coffee Lake 9th Processor (Up to 65W), 9V~36V DC-IN, Extended Temp. -30°C to 70°C
- 1U Fanless MIL-STD Xeon Server
- Intel® Coffee Lake 9th Gen. Xeon E-2278GEL (8C,16T) 2.0/3.9GHz
- 2x SO-DIMM DDR4 2400/2666 MHz up to 64GB
- Front IO: 2x 2.5”SATA HDD/SSD Swap Tray, 2x USB2.0
- Back IO: 2x COM, 4x USB3.1, 2x DP, 2x LAN, 1x Line-out/Mic
- Wide Range 9V~36V DC-IN
- Extended Operating Temperature -30°C to 70°C
- Technical Profile
- Specifications
- Thermal Solution
Introduction
ROC286A is an industrial 19” 1U Rack-mount rugged fanless server. Based on Intel® Coffeelake 14nm Core™ Q370 Chipset, ROC286A can be processed by 8th/9th Processor (up to 65W). It supports up to 64GB of memory capacity, 1 x PCIe x16 Slot 1 x M.2(Key M, PCIe x4 and SATA) Expansion Slot, 6 x USB, 2 x DisplayPort, 1 x HDMI, 2 x LAN, 1 x Line-out/Mic-in, 2 x COM, 2 x 2.5” SATA HDD/ SSD Easy Swap Tray.
With further advantages, for example, HDD/ SSD easy swap tray and multi-expansion slot, we believe that ROC286A is a best choice for those, who are looking for an ideal server to meet the requirements of commercial and industrial platforms, process control, intelligent automation and manufacturing applications.
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System |
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High Performance Processor |
Socket LGA 1151 for Intel® Coffee Lake 9th Gen. Xeon E-2278GEL, Core i7/i5/i3/Celeron® (Supports up to 65W) Intel® 8th/9th Processor |
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| Memory type | 2x DDR4 SO DIMM up to 64 GB | |
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Chipset |
Intel® Q370 Chipset |
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| Expansion Slot |
1x PCIe x16 1x M.2 (Key M, 2242/2280) with PCIe and SATA Signal |
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Storage |
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HDD/SDD |
2x 2.5” SATA HDD/SSD easy swap tray |
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Ethernet |
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Ethernet |
Intel® I210 & I219LM GbE LAN (support 10/100/1000 Mbps for x2 RJ45 ports) |
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Rear I/O |
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Display Port |
2x |
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| HDMI | 1x | |
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Ethernet |
2x RJ45 Intel® I210 & I219LM GbE LAN (support 10/100/1000 Mbps) |
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| Audio | 2x 3.5mm Audio Jacks (1x MIC, 1x Line-Out) | |
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COM |
2x RS232/422/485 ( 422/485 select by BIOS) |
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USB Port |
4x USB 3.1(10Gb/s) |
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DC-IN |
DC-IN 12V(1x 4P Terminal Block) |
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Front I/O |
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Button |
1x Power Button w/Indicator LED |
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Indicator LED |
1x HDD |
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USB Port |
2x USB 2.0 |
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Easy Swap SSD Tray |
2x |
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Power Requirement |
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Power Input |
9V~36V DC-IN |
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Applications, Operating System |
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Applications |
Commercial and Industrial Platforms, Embedded Computing, Process Control Intelligent Automation and manufacturing applications |
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Operating System |
Windows 10 64Bit Ubuntu13.04, Ubuntu13.10, Ubuntu14.04, Fedora 20 |
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Physical |
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Dimension (W x D x H) |
430 x450 x 44.4 mm |
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Weight |
8.92Kg |
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Chassis |
SECC |
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Heatsink |
Aluminum Alloy, Corrosion Resistant |
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Finish |
Anodic aluminum oxide |
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Environmental |
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| MIL-STD-810G Test |
Method 507.5, Procedure II (Temperature & Humidity) Method 501.5, Procedure I (Storage/High Temperature) Method 501.5, Procedure II (Operation/High Temperature) Method 502.5, Procedure I (Storage/Low Temperature) Method 502.5, Procedure II (Operation/Low Temperature) Method 503.5, Procedure I (Temperature shock) |
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Green Product |
RoHS compliance |
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Operating Temperature |
w/o Graphic Card (ET: -20 to 60°C; UT: -30 to 70°C) ; w/Graphic Card (0 to 50°C) |
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Storage Temperature |
-40 to 85°C |
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Relative Humidity |
5% to 95%, non-condensing |
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EMC |
CE and FCC compliance |
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- Dual side thermal solution, fanless design for 1U slim size
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With combination of high CPU computing power and graphic GPU performance generate numerous heat, 7STARLAKE emphasizes on providing exceeding thermal design guarantee system offers superior performance under critical environment. Based on our experience, ROC286 adopts dual side thermal solution, with copper heat spreader directly touches the heat source components processor and graphic GPU to absorb the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid which can provide high efficiency heat transmission, the aluminum heat sink dissipates the heat into surrounding air promptly. Both side thermal solution is mainly for processor. With unique thermal design, 7STARLAKE is capable to integrate high power consumption CPU into 1U such slim size fanless system.
