SCH400-BB
2U Fanless Redundant Server ,Intel®10th Gen Xeon W-1290TE / Core i9-10900TE , 2 x 200W AC/DC Redundant Power Supply, Operating Temperature -20°C to 60°C
- Intel 10th Gen Xeon® W-1200/ Core i Processor
- 4x DDR4 up to 128GB
- 2x RJ45 GbE LAN, 2x RJ45, 4x USB3.2, 4x USB2.0,
- IPMI Support ,10GbE LAN (by option)
- 2x DP, 1x VGA, 1x DVI-D
- 4x 2.5” Swap SSD/HDD Tray (Support RAID 0,1,5,10)
- 3x PCIe Expansion Slots
- Trusted Platform Module (TPM)
- 2x 200W 100V~240 VAC Redundant PSU
- Extended Temperature -20°C to 60°C
- Technical Profile
- Specifications
- Introduction
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Gateways are rugged communication devices collecting numerous data, such as metering, status, events and fault report from any protection device while sending this information upstream to a control center, transferring commands issued from the control center to other devices. One example of a particular need for gateways is in the energy industry. The energy industry requires specific types of devices using specific protocols. With PLCs/PACs becoming popular in these applications, gateways has grown into a necessary part of Substation Automation Systems, and its reliability may affect the safety of whole system at a station level.
As a leading company specialized in energy related application, 7StarLake’s experienced team designed an extremely reliable Gateway system SCH-406, which is powered by 10th Generation Intelntel 10th Gen Xeon W-1290TE/Core i9-10900TE Processors, enabling highly efficient processing capability to deal with a large amount of data delivering between IEC-61850 devices and the Control Center. In advantage of other outstanding features, such as extended temperature -20~+60°C, dual 200W AC/DC redundant power supply, SCH-406 is an undoubtedly best choice for Gateway application in Substation.
- Key Features
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(1)Security Redundancy
Integrating TPM module, operating systems can require an authentication to protect keys, data or systems.
(3)Rich communication Interface
In advantage of SCH-406 diverse I/O, 2 x RJ45 GbE LAN, 2 x RJ45 10GbE LAN, 1 x IPMI, 4 x USB3.2, 2 x USB2.0, 2 x DP,1 x VGA, 1 x DVI-D, the SCH-406 system can satisfy all our clients.
(5)IEC-61850-3
The standardization of IEC-61850 enables the integration of the equipment and systems from different suppliers, reducing the burden on the configuration and maintenance of these systems. The protocol also meets utilities’ requirements for long-term system expandability. Thus, there are more and more electric companies perform power-system automation by using IEC-61850 protocol with Intelligent electronic devices (IED)
(7)Network Redundancy
PRP/HSR network will be required as an efficient and cost effective solution in order to construct a seamless/bumpless communication infrastructure to ensure maximum system availability.
(2)Power Redundancy
The design of wide power range keeps the system’s reliability and you can expect longer life-span as well. Sudden drop or surge of power posts absolutely no threat to this smart system.
(4)IEEE-1613
The widespread use of multi-functional intelligent electronic devices with advanced communications capabilities has resulted in a new trend in substation automation systems. The intelligent electronic devices exchange messages over the substation local area network. Detail environment and testing requirements for communications networking devices in electric power substations.
(6)Data Redundancy
RAID function supports an assortment to help protect or speed up the performance of a computer's disk storage. RAID 0/1 function makes SCH-406 to archive it.
(8)Extreme Temperature
Copper heat spreader, pure copper heat pipe and aluminum heat sink, with all these benefits of fanless design. To ensure high reliability and stability while SCH-406 working under wide range temperature from -20°C up to +60°C. And, with SCH-406 special industrial extended range of temperature layout, it can also reduce the potential computer glitches caused by hardware incompatibility and losses of connectivity caused by shock and vibration.
- Why IEC 61850 Is Necessary
-
Although there are lots of protocols worldwide for substation automation, IEC 61850 is the only one that supports systems networked together to perform intelligent transmission and distribution protection, monitoring, automation, metering, and control. The standardization of IEC 61850 enables the integration of the equipment and systems from different suppliers, reducing the burden on the configuration and maintenance of these systems. The protocol also meets utilities’ requirements for long-term system expandability. Thus, there are more and more electric companies perform power-system automation by using IEC-61850 protocol with Intelligent electronic devices (IED).
- Drawing
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|
System |
|
|---|---|
|
CPU |
10th Generation Intel® Xeon® W-1200 Processors Intel® Xeon® W-1290TE Processor (20M Cache, up to 4.50 GHz) Intel® Xeon® W-1250TE Processor (12M Cache, up to 3.80 GHz) 10th Generation Intel® Core™ i9/i7/i5 Processors Intel® Core™ i9-10900TE(20M Cache, up to 4.60 GHz) Intel® Core™ i7-10700TE(16M Cache, up to 4.50 GHz) Intel® Core™ i5-10500TE(12M Cache, up to 3.70 GHz) |
|
Memory type |
4x DDR4 up to 128GB |
|
Expansion Slot |
1x PCI-E 3.0 x16 2x PCI-E 3.0 x4 |
|
Storage Device |
4x 2.5” Easy swap HDD/SSD Tray (Support RAID 0,1,5,10) |
|
Rear I/O |
|
|
Power Button |
1x with backlight |
|
USB |
2x USB 2.0 |
|
Front I/O |
|
|
Power Input |
2x 100V~240V AC-IN |
|
LAN |
2x RJ45 GbE LAN ; 2x RJ45 10GbE LAN (by option) ; 1x IPMI |
|
USB |
4x USB 3.2 |
|
DisplayPort |
2x |
|
DVI |
1x DVI-D |
|
VGA |
1x |
|
Optional |
|
|
Dual 10GbE SFP+ Module |
INTEL X710 Dual 10GbE SFP+ LAN card |
|
Power |
|
|
Power Input |
100V~240V AC-IN, 2x 200W AC/DC Redundant Power Supply |
| OS support list | |
| Windows | Windows 10 x64 |
| Linux | Ubuntu, Red Hat |
| Mechanical and Environmental | |
| Dimension | 430 x 450 x 88 mm ( W x D x H ) |
| Operating Temp. | -20 to 60°C |
| Storage Temp. | -40°C to 85°C |
| Relative Humidity | 5% to 95%, non-condensing |
| Standards | CE, FCC, MIL-STD 810G Compliance |
| System Design | Fanless |
| Mounting | 2U Rackmount |
| MIL-STD-810G | Method 507.5, Procedure II (Temperature & Humidity) |
| Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock) | |
| Method 516.6 Shock-Procedure I Operating (Mechanical Shock) | |
|
Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration) |
|
| Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration) | |
| Method 501.5, Procedure I (Storage/High Temperature) | |
| Method 501.5, Procedure II (Operation/High Temperature) | |
| Method 502.5, Procedure I (Storage/Low Temperature) | |
| Method 502.5, Procedure II (Operation/Low Temperature) | |
| Method 503.5, Procedure I (Temperature shock) | |
| EMC | CE, FCC compliant |
| Green Product | RoHS, WEEE compliance |