IEC-61850-3 , IEEE-1613 Substation Fanless Computer, 2U Rackmount Server with Intel. 10th XEON W-1290TE, Core i9-10900TE Processor, Operating Temperature -20°C to 60°C
- Intel® 10th Gen. XEON W-1290TE (10 x Cores) ; Core i9-10900TE (10x Cores)
- ECC RIDM up to DDR4-128GB
- 2 x LAN (RJ45), 4 x USB, 2 x DP, 1 x VGA, 1 x DVI-D
- 2 x SFP 10GbE, 1x IPMI
- 4 x 2.5” Easy swap SSD/HDD Tray (RAID 0/1/5/10)
- 3 x PCIe Expansion Slots (1 x PCIex16, 1 x PCIex8 1 x PCIex4)
- Trusted Platform Module onboard (TPM)
- FTDI for Optional
- 100V~240V AC Input (Optional for 200W AC/DC Redundant PSU)
- 48V/72V/110V DC-DC Redundancy For Option
- Extended Temperature -20°C to 60°C
Special Request :
- 6x COM Ports (2xRS232/422/485 , 4xRS232)
- 16 Bit DIO
- Technical Profile
Gateways are rugged communication devices collecting numerous data, such as metering, status, events and fault report from any protection device while sending this information upstream to a control center, transfering commands issued from the control center to other devices. One example of a particular need for gateways is in the energy industry. The energy industry requires specific types of devices using specific protocols. With PLCs/PACs becoming popular in these applications, gateways has grown into a necessary part of Substation Automation Systems, and its reliability may affect the safety of whole system at a station level.
As a leading company specialized in energy related application, 7Starlake’s experienced team designed an extremely reliable Gateway system SCH400, which is powered by Intel 10th XEON W-1290TE, Core i9-10900TE Processor, enabling highly efficient processing capability to deal with a large amount of data delivering between IEC-61850 devices and the Control Center. In advantage of other outstanding features, such as extended temperature -20~+60°C, 100V~240V AC Input, SCH400 is an undoubtedly best choice for Gateway application in Substation.
- Key Features
Integrating TPM module, operating systems can require an authentication to protect keys, data or systems.
(3)Rich communication Interface
In advantage of SCH400 diverse I/O, 4 x LAN(RJ45), 2 x COM(DB9), 6 x USB, 2 x DP, 1 x VGA, 1 x DVI-D, the SCH400 system can satisfy all our clients.
The standardization of IEC-61850 enables the integration of the equipment and systems from different suppliers, reducing the burden on the configuration and maintenance of these systems. The protocol also meets utilities’ requirements for long-term system expandability. Thus, there are more and more electric companies perform power-system automation by using IEC-61850 protocol with Intelligent electronic devices (IED)
PRP/HSR network will be required as an efficient and cost effective solution in order to construct a seamless/bumpless communication infrastructure to ensure maximum system availability.
The design of wide power range keeps the system’s reliability and you can expect longer life-span as well. Sudden drop or surge of power posts absolutely no threat to this smart system.
The widespread use of multifunctional intelligent electronic devices with advanced communications capabilities has resulted in a new trend in substation automation systems. The intelligent electronic devices exchange messages over the substation local area network. Detail environment and testing requirements for communications networking devices in electric power substations.
RAID function supports an assortment to help protect or speed up the performance of a computer's disk storage. RAID 0/1 function makes SCH400 to archive it.
Copper heat spreader, pure copper heat pipe and aluminum heat sink, with all these benefits of fanless design. To ensure high reliability and stability while SCH400 working under wide range temperature from -20°C up to +60°C. And, with SCH400 special industrial extended range of temperature layout, it can also reduce the potential computer glitches caused by hardware incompatibility and losses of connectivity caused by shock and vibration.
- Why IEC-61850 Is Necessary
Although there are lots of protocols worldwide for substation automation, IEC-61850 is the only one that supports systems networked together to perform intelligent transmission and distribution protection, monitoring, automation, metering, and control. The standardization of IEC-61850 enables the integration of the equipment and systems from different suppliers, reducing the burden on the configuration and maintenance of these systems. The protocol also meets utilities’ requirements for long-term system expandability. Thus, there are more and more electric companies perform power-system automation by using IEC-61850 protocol with Intelligent electronic devices (IED).
- Main Features
|-20°C to 60°C|
|CPU||Intel® 10th Gen. XEON W-1290TE (10 x Cores)|
|Intel® Core i9-10900TE (10x Cores)|
|Memory Type||DDR4 RDIMM up to 128GB|
1 x PCIex 16
1 x PCIe x 8
1 x PCIe x 4
|Storage Device||4 x 2.5” Easy swap HDD/SSD Tray|
|Power Input||12V DC-IN|
|IPMI||1 x IPMI|
|LAN||2 x RJ45 LAN, 2 x SFP 10GbE|
|USB||4 x USB 3.0|
|2 x DP|
|1 x DVI-D|
1 x VGA
|Power Button||1 with backlight|
|Indicator||1 HDD backlight|
|USB||2 x USB 2.0|
|COM||6 x COM Port (Options )|
|48V DC Input||48V DC Input|
|Redundant Power||Dual DC-DC 72V/96V/125V Redundant PSU
AC- DC (100V~240V) Redundant PSU
|OS support list|
|Windows||Windows 8.1 x32/ x64、Windows 10 x32/ x64|
|Linux||Fedora 15, Ubuntu, Red Hat|
|Mechanical and Environment|
|Dimension||430 x 396 x 88 mm ( W x D x H )|
|Operating Temp.||-20°C to 60°C|
|Storage Temp.||-40°C to 85°C|
|Relative Humidity||5% to 95%, non-condensing|
|Certification||CE, FCC, MIL-STD 810G Compliance|
|MIL-STD-810G Test||Method 507.5, Procedure II (Temperature & Humidity)|
|Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)|
|Method 516.6 Shock-Procedure I Operating (Mechanical Shock)|
|Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)|
|Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration)|
|Method 501.5, Procedure I (Storage/High Temperature)|
|Method 501.5, Procedure II (Operation/High Temperature)|
|Method 502.5, Procedure I (Storage/Low Temperature)|
|Method 502.5, Procedure II (Operation/Low Temperature)|
|Method 503.5, Procedure I (Temperature shock)|
|EMC||CE, FCC compliant|
|Green Product||RoHS, WEEE compliance|
|SCH400||2U 19” Power Automation Fanless Server Computer with Intel. 10th gen Core i9-10900TE Processor, 2× RJ45, 6 x COM ports, 2x SFP 10GbE +, TPM onboard, FTDI for optional, 'Wide range DC-DC (72V/96V/125V) Redendant PSU, Operating Temperature -20°C to 60°C|
|SCH400-GW||2U 19” Power Automation Fanless Server Computer with Intel. 10th gen Core i5-10500TE Processor, 2× RJ45, 6 x COM ports, 2x SFP 10GbE +, TPM onboard, FTDI for optional , 12V DC Input, Operating Temperature -20°C to 60°C|