SK513

SK513_Mezzanine COM Express Type 6 Carrier board, -40°C~85°C
SK513_Mezzanine COM Express Type 6 Carrier board, -40°C~85°C
SK513_Mezzanine COM Express Type 6 Carrier board, -40°C~85°C_04

Mezzanine COM Express Type 6 Carrier Board with MXM , PCI/104 Express Expansion

  • COM Express Type 6 / 7 Support Up to Intel XEON E-2276ME(Type6), i7-9850HE (Type6), Broadwell-DE D-1577(Type7) Processor
  • Standard MXM Type 3.1 Support Up to NVIDIA® Quadro®, Tesla®, and GeForce® GPUs
  • PCI/104 Express Expansion Slot for Modular Open Stracture
  • Multi-Expansion Slots include Dual Mini PCIe Express Slots, 1 x M.2 Slot
  • Extreme Temperature Support -40°C to 85°C
  • 2 x VGA, 1 x LVDS, 4 x COM, 6 x USB, 2 x miniPCIe, 1 x M.2, 2 x SATA
  • 9V-36V DC Input
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  • Technical Profile
  • Specifications

  

 Introduction

Computer-On-Module (COM), is a highly integrated board with CPU, chipset, memory, and peripherals designed into a component module. COM Express Type 6 has become the most versatile and most scalable COM standard supporting everything from small-scaled and cost-sensitive applications up to high-end computing and graphics-intensive solutions.

7starlake’s SK513 COM Express Type 6 platform based on modular, open, scalable architecture, ensuring amazing computing performance. SK513 support a wide range of Intel processors, from Core i7 processors to the latest Intel Xeon series. What’s more, SK513 has the capability to operate in harsh environment. It accepts the extend range of temperature from -40°C to 85°C. With outstanding computing capability and efficient thermal design, SK513 is very suitable for industrial, military/aerospace and transportation.

COMe Type6 Support PCIe/104

SK513 feature a range of Intel processors, up to the latest Intel Core series. SK513 are built to operate in harsh environmental conditions, the operating temperatures as low as -40°C to as hot as 85°C. From low power consumption to high performance processing power, SK513 are built to suit a wide range of computing applications from signal processing to unmanned vehicles and more.

5

Key Features of SK513
Rich Expansion Slot

SK-513 provides rich expansion to make the whole solutions easier. We could use PCIe 104 related product SK506, SK303 , SK1050 and SK1660：

12

 

 

  1. StackPC-FPE form factor -
  2. PCIe/104 stackable bus structure -
  3. Reliable Ethernet technology from Intel i350-AM4 controllers -
  4. Total 6 independent LAN connections (2 from host board, 4 from Intel controllers) -
  5. Flexible options for Ethernets through RJ45 or 10 pin-headers -
  6. High-performing bridgeless design supporting PCI Express Gen 2.1 5GT/s -
  7. Extended temperature -40 to 85°

 

  • SK401:
  1. StackPC form factor -
  2. PCIe/104 stackable bus structure -
  3. Reserve PCI/104 connector for different stacking criteria -
  4. Extended temperature -40 to 85°C

 

2

 

SK303
  1. PCI/104-Express, PCI & PCIe connectors (w/StackPC design)
  2. PCIe/104 stackable bus structure -
  3. PCIe to PCI adapter function -
  4. COM: 4 x RS232/422/485 with 5V/12V selectable and isolation function -
  5. Extended Temp.: -40°C ~ 85°C

 

 

  • SK1050-NVIDIA GTX1050Ti MXM 3.1 Graphics Module:
  1. Powered by NVIDIA GeForce® GTX1050Ti 
  2. MXM 3.1Type-A Module  
  3. High-speed 4GB GDDR5 Memory  
  4. 768 new-gen. Pascal architecture CUDA cores
  5. Outputs 4 Channel Support
  6. DisplayPort 1.2 Certified, DisplayPort 1.3/1.4 Ready
  7. Support NVIDIA CUDATM, OptimusTM, DirectX® 12, OpenGL® 4.5

4

 

5

  • SK1660S:
  1. NVIDIA GTX 1660SUPER MXM 3.1 Graphics Module
  2. Powered by NVIDIA GeForce® GTX 1060SUPER 
  3. MXM 3.1Type-B Module  
  4. 192-bit, 6GB GDDR6 Memory 
  5. Outputs 4 Channel Support 
  6. Support NVIDIA CUDA, DirectX® 12, OpenGL® 4.6

 

330X1

 

NVIDIA® GTX 1050 Ti(CUDA Cores: 768)/GTX1060 (CUDA Cores: 1280) GPU. Designed for Driverless Vehicle

  • Intel® 7th Gen. Core i7-7820EQ
  • 2 x DDR4 SO-DIMM up to 32GB
  • MXM Graphic Card support
  • 2 x RJ45 LAN, 6 x USB
  • 2 x 2.5" Easy swap SSD/HDD Tray
  • 2 x I/O Expansion Design
  • Extended Temperature -20°C to 60°C
  • NVIDIA® GTX950M (CUDA Cores: 640)/GTX1050(CUDA Cores: 640)/GTX 1050 Ti(CUDA Cores: 768)/GTX1060 (CUDA Cores: 1280) GPU

 

1.5 U Fanless Rugged GPU Server Intel® Xeon® D Processor, MXM Graphic Card, 9V to 36V DC-in, Operating Temp -20°C to 50°C. 
NVIDIA® GTX950M (CUDA Cores: 640)/GTX1050(CUDA Cores: 640)/GTX 1050 Ti(CUDA Cores: 768)/GTX1060 (CUDA Cores: 1280) GPU 

  • MIL-STD 810G Compliance
  • Intel® Xeon® D-1548 Processor
  • 2 x DDR4 SO-DIMM up to 32GB RAM
  • MXM Graphic Card support
  • 4 x Intel® Gigabit Ethernet
  • 2 x CAN bus
  • 4 x USB, 1 x COM
  • 9V to 36V DC-in
  • Operating Temp. -20°C to 50°C
  • NVIDIA® GTX 1050 Ti(CUDA 768 GDDR5-4GB) / GTX1650 (CUDA 896 GDDR5-4GB) / GTX1660 Super (CUDA 1408 GDDR6-6GB)
330X2

 

Operating Temp.

-40°C to 85°C

System

COM Express CPU Options(Type6)

9th CPU Intel® Xeon® E-2276ME 45W Coffee Lake 9th Gen, 6 x 2.8 /4.5 GHz, 12MB cache

9th CPU Intel® Xeon® E-2276ML 25W Coffee Lake 9th Gen, 6 x 2.0 / 4.2 GHz, 12MB cache

9th CPU Intel® Core™ i7-9850HE 45W Coffee Lake 9th Gen, 6 x 2.7 / 4.4 GHz, 9MB cache

9th CPU Intel® Core™ i7-9850HL 25W Coffee Lake 9th Gen, 6 x 1.9 / 4.1 GHz, 9MB cache

7th CPU Intel® Core™ i7-7820EQ 45W Kaby Lake 7th Gen, 4 x 3.0 / 3.7 GHz, 8MB cache

6th CPU Intel® Core™ i7-6822EQ 25W Sky Lake 6th Gen, 4 x 2.0 / 2.8 GHz, 8MB cache

6th CPU Intel® Core™ i7-6820EQ 25W Sky Lake 6th Gen, 4 x 2.0 / 2.8 GHz, 8MB cache

6th CPU Intel® Xeon® E3-1505M v6 45W Kaby Lake 6th Gen, 4 x 3.0 / 4.0 GHz, 8MB cache

6th CPU Intel® Xeon® E3-1505L v6 25W Kaby Lake 6th Gen, 4 x 2.2 / 3.0 GHz, 8MB cache
COM Express CPU Options(Type7)

Express-BD7-D1559 Basic COM Express Type7 module with Intel Broadwell-DE D1559, 12C (eTEMP)

Express-BD7-D1539 Basic COM Express Type7 module with Intel Broadwell-DE D1539, 8C (eTEMP)

Express-BD7-D1519 Basic COM Express Type7 module with Intel Broadwell-DE D1519, 4C (eTEMP)

Express-BD7-D1577 Basic COM Express Type7 module with Intel Broadwell-DE D1577, 16C

Express-BD7-D1548 Basic COM Express Type7 module with Intel Broadwell-DE D1548, 8C

Express-BD7-D1527 Basic COM Express Type7 module with Intel Broadwell-DE D1527, 4C

Express-BD7-D1508 Basic COM Express Type7 module with Intel Broadwell-DE D1508, 2C

GPU Module Options

NVIDIA® GeForce™ GTX 1050Ti – (Pascal, 768 CUDA Cores, 60W)

NVIDIA® GeForce™ GTX 1060 – (Pascal, 1280 CUDA Cores, 78W)

NVIDIA® GeForce™ GTX 1070 – (Pascal, 2048 CUDA Cores, 115W)

NVIDIA® GeForce™ GTX 1080 – (Pascal, 2560 CUDA Cores, 150W)

NVIDIA® GeForce™ GTX 1660S – (Pascal,1408 CUDA Cores, 125W)

COM Express Compatibility

COM Express® Type 6

Expansion

MiniPCIe Expansion

2 x Full-size mini PCIe (1 with mSATA supported)

M.2 Expansion

1 x 2280 M key (SATA only)

PCIe/104 Expansion

4 x PCIe x 1

1 x PCIe x 4

5 x USB 2.0

1 x LPC

1 x SPI

Display

DisplayPort

2 x DisplayPort outputs from COM Express®, 4 x outputs from GPU, 6 total

VGA

1 x output from COM Express®, 1 x output from GPU

LVDS

1 x dual channel 18/24-bit LVDS

Ethernet

Gigabit Ethernet

2 x 10/100/1000 Ethernet Ports

I/O

USB

4 x USB 3.0, 2 x USB 2.0

COM Port

4 x RS232/422/485

Audio

1 x Line-out, 1 x MIC-In

Power System

Input Power_SYS

9~36V (4P Terminal Block)

Input Power_MXM

12V (ATX 4P)

Power Consumption

Varies per COM Express /MXM with different CPU and GPU models

RTC Battery

3V CR2032

Mechanical and Environment

Dimensions

190 x 185 mm

Operating Temperature

-40 to 85°C

Storage Temperature

-40 to 85°C

Relative Humidity

10% to 90%, non-condensing