ROC286CC
- Intel® Coffee Lake-Refresh 8th/9th Processor(Up to 65W)
- Anti-Corrosion Painting on Aluminium Enclosure
- Conformal Coating on all PCB
- 2 x SO-DIMM DDR4 2400/2666 MHz up to 64GB
- Front IO: 2x2.5”SATA HDD/SSD easy swap tray,2xUSB2.0
- Back IO: 2xCOM,4xUSB3.1,2xDP,2xLAN,1xLine-out/Mic
- Extended Operating Temperature -40 to 70°C
- 9V~36V DC-IN with Redundant support
- Technical Profile
- Specifications
- Thermal Solution
- Introduction
7STARLAKE has been working on developing ruggedised sever for energy use. ROC286CC is the latest 1U fanless system designed for anti-aggression use. It is based on Intel® Coffeelake 14nm Core™ Q370 Chipset and can support up to 64GB of memory capacity. Moreover, redundant power DC-DC 9V~36V provides extra power support to the power plant so that it will not have to suffer from the unexpected shutdown. It is worth noting that what makes ROC286CC stand out is its application of conformal coating that for battling against harsh environment. With further advantages such as MIL-STD 810 anti-shock and vibration, we believe that ROC286CC is a best choice for clients that are looking for an ideal server to meet the requirements in harsh environment.
- Key Features
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1. 1U Fanless
Most 1U system is equipped with fan to conduct heat dissipation. As an ruggedised computer trailblazer in the industry, 7STARLAKE designed ROC286CC to be 1U fanless server for better portability and heat dissipation with the adoption of heat pipe.
2. Redundant DC-DC
ROC286CC is designed with power redundancy as most power plant is highly automotive, and any disruption will cost a huge amount of money. Power redundancy allows power plants to have back up even if one of the power experiences shutdown. Therefore, the potential risk of shutting down suddenly can be avoided.
3. Conformal Coating on PCB
In nuclear power plants that are located in seaside, salt, sand, dust, and fog can all damage the functionality and inner components. In order to protect the system, the PCB of ROC286CC is applied with conformal coating to prevent the system from being corroded but also provide protection against moisture, dust, chemicals, and temperature extremes.
4. Anti-Corrosion Painting on Aluminium Enclosure
Because power plants are commonly seen by sea, rust can develop on iron and steel when they are subjected to water and air and consequently lead to critical power failure. In order to block such deterioration to the system, ROC286CC is applied with the proper anti-corrosion painting on aluminium enclosure to provide it with essential protection against the deteriorating effects that occur from exposure to water.
ROC286CC I/O Placement
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System |
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CPU |
Socket LGA 1151 for Intel® Core i7/i5/i3/Celeron® (Supports up to 65W) Intel® 8th/9th Processor |
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| Memory type | 2 x DDR4 SO DIMM up to 64 GB | |
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Chipset |
Intel® Q370 Chipset |
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Storage Device |
2 x SATAIII, 2.5” SSD |
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| Expansion Slot |
1 x PCIex16 1x M.2 (Key M, 2242/2280) with PCIe and SATA Signal |
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Storage |
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HDD/SDD |
2 x 2.5” SATA HDD/SSD easy swap tray |
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Ethernet |
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Ethernet |
Intel® I210 & I219LM GbE LAN (support 10/100/1000 Mbps for x2 RJ45 ports) |
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Rear I/O |
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Display Port |
2 x DP |
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| HDMI | 1 x HDMI | |
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Ethernet |
2 x RJ45 Intel® I210 & I219LM GbE LAN (support 10/100/1000 Mbps) |
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| Audio | 2 x 3.5mm Audio Jacks (1 x MIC, 1 x Line-Out) | |
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COM |
2 x RS232/422/485 ( 422/485 select by BIOS) |
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USB Port |
4 x USB 3.1(10Gb/s) |
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DC-IN |
9~36V DC IN (2 X 4P Terminal Block) |
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Front I/O |
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Button |
1 x Power Button w/Indicator LED |
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Indicator LED |
HDD |
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USB Port |
2 x USB 2.0 |
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Easy Swap SSD Tray |
2 |
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Applications, Operating System |
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Applications |
Commercial and Industrial Platforms, Embedded Computing, Process Control Intelligent Automation and manufacturing applications |
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Operating System |
Windows 10 64Bit Ubuntu13.04, Ubuntu13.10, Ubuntu14.04, Fedora 20 |
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Physical |
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Dimension (W x D x H) |
440 x430 x 44 mm |
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Weight |
8.92Kg |
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Chassis |
SECC |
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Heatsink |
Aluminum Alloy, Corrosion Resistant |
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Finish |
Anodic aluminum oxide |
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Environmental |
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| MIL-STD-810G Test |
Method 507.5, Procedure II (Temperature & Humidity) Method 501.5, Procedure I (Storage/High Temperature) Method 501.5, Procedure II (Operation/High Temperature) Method 502.5, Procedure I (Storage/Low Temperature) Method 502.5, Procedure II (Operation/Low Temperature) Method 503.5, Procedure I (Temperature shock) |
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Green Product |
RoHS compliance |
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Operating Temperature |
w/o Graphic Card (ET: -20 to 60°C; UT: -30 to 70°C) ; w/Graphic Card (0 to 50°C) |
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Storage Temperature |
-40 to 85°C |
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Relative Humidity |
5% to 95%, non-condensing |
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EMC |
CE and FCC compliance |
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- Dual Side Thermal Solution, Fanless Design for 1U Slim Size
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With combination of high CPU computing power and graphic GPU performance generate numerous heat, 7STARLAKE emphasizes on providing exceeding thermal design guarantee system offers superior performance under critical environment. Based on our experience, ROC286 adopts dual side thermal solution, with copper heat spreader directly touches the heat source components processor and graphic GPU to absorb the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid which can provide high efficiency heat transmission, the aluminum heat sink dissipates the heat into surrounding air promptly. Both side thermal solution is mainly for processor. With unique thermal design, 7STARLAKE is capable to integrate high power consumption CPU into 1U such slim size fanless system.
