ROC254A
Virtualization 1U Fanless Server with XEON x 16 Cores, VMware Support, 90V to 264V AC-in ,Driven by Intel® Xeon®D-1541/D-1587, providing superior performance in data processing and supporting high flexibility in application.
- MIL-STD 810G Compliance
- Intel® Xeon®D-1541/D-1587 Processor
- Up to 128GB Registered ECC RDIMM DDR4-2400MHz
- 1 x VGA , 6 x USB Ports
- 2 x Gigabit Ethernet, 1 x IPMI
- 2 x 10GbE ( By Request )
- 100V ~ 240V AC-input
- Optional for 220VAC/DC Redundant PSU
- 1 x PCIe 3.0 x16 Expansion Slot
- Extended Temperature -10°C to 60°C
- Technical Profile
- Specifications
- Thermal Solution
- Introduction
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ROC254A, 19" 1U Rackmount Fanless Virtual SuperComputer is driven by Intel® Xeon®D1541/D-1587 (8 / 16 Cores, 16 / 32 Threads, 12 / 24MB Cache), providing superior performance in data processing and supporting high flexibility in application.
With 44mm of height and 380mm of depth, it's fit for rack mount, wall mount, and standalone application. Heat pipes and heat sinks are constructed on both component and system levels. Honeycomb vents are designed on the top, sides and back to allow natural convection cooling.
ROC254A's power design is for 100V – 240V AC-in, which allows a flexible usage. ROC254A meets the demands of industrial embedded applied computing applications including the industrial PC platform, transaction, multimedia workstation, vehicle PC, and network server.
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System main board
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With combination of high CPU computing power and graphic GPU performance generate numerous heat, 7STARLAKE emphasizes on providing exceeding thermal design guarantee system offers superior performance under critical environment. Based on our experience, ROC254A adopts dual side thermal solution, with copper heat spreader directly touches the heat source components processor and graphic GPU to absorb the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid which can provide high efficiency heat transmission, the aluminum heat sink dissipates the heat into surrounding air promptly. Both side thermal solution is mainly for processor. With unique thermal design, 7STARLAKE is capable to integrate high power consumption CPU into 1U such slim size fanless system.
1. Motherboard Features
The motherboard offer infrastructure optimization, by combining the performance and advanced intelligence of Intel® Xeon® processors into a dense, lower-power system-on-a-chip. With server-class reliability, availability and serviceability (RAS) features now available in an ultra-dense, low-power device, it will be able to deliver balanced compute, storage and intelligent edge networks and appliances. These advanced technology building blocks offer the best work load optimized solutions and long life availability with the Intel® Xeon® processor D family, with up to 128GB DDR4 ECC RDIMM operating at 2133MHz, USB 3.0 I/O, six SATA3.0 storage or dual 10 GbE LAN networking ports.
2. AC-in Power Design
ROC254A supports 100 to 240V AC-in power, allows the system to be utilized in extensive power types. The design of wide power range keeps the system’s reliability and you can expect longer life-span as well. Sudden drop or surge of power posts absolutely no threat to this smart system.
3.Ultra Slim Size
ROC254A is a compact yet capable industrial grade fanless system. With only 380mm in depth and 44mm (1.73") in height, this 1U size system is superior in its compact yet durable exterior design and highly functional interior structure.
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Operating Temp. |
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0°C to 50°C |
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System |
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CPU |
Intel® Xeon® D-1587 (1.7GHz, 16 Cores, 32 Threads, 24MB Cache) Intel® Xeon® D-1541 (2.1GHz, 8 Cores, 16 Threads, 12MB Cache) |
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Chipset |
SoC, integrated with CPU |
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Memory Type |
Up to 128GB ECC RDIMM DDR4-2400MHz |
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Expansion Slot |
1 x PCIex16 |
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Storage Device |
2 x 2.5" Solid State Disk (SSD) |
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Ethernet Chipset |
1 x Intel® I350-AM2 GbE LAN |
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Rear I/O |
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Display Port |
1 (Max Resolution 4096*2304) |
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Ethernet |
2 x RJ45 Gigabit Ethernet LAN Interfaces |
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USB Port |
2 x USB3.0 standard-A connectors |
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AC-IN |
1 x IEC C14 Plug |
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Front I/O |
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Button |
1 x Power Button w/Indicator LED |
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Indicator LED |
1 x HDD LED |
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USB |
2 x USB2.0 standard-A connectors |
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Easy Swap SSD Tray |
2 x 2.5 SSD Easy Swap Tray |
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Power Requirement |
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Power Input |
90V to 264V AC-in, 200W max |
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Physical |
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Dimension |
430 x 380 x 44.6 mm |
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Environmental |
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Operating Temp. |
-10 to 60°C |
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Storage Temp. |
-40 to 85°C |
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Relative Humidity |
10% to 90%, non-condensing |
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Dual side thermal solution, fanless design for 1U slim size
With combination of high CPU computing power and graphic GPU performance generate numerous heat, 7STARLAKE emphasizes on providing exceeding thermal design guarantee system offers superior performance under critical environment. Based on our experience, ROC254A adopts dual side thermal solution, with copper heat spreader directly touches the heat source components processor and graphic GPU to absorb the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid which can provide high efficiency heat transmission, the aluminum heat sink dissipates the heat into surrounding air promptly. Both side thermal solution is mainly for processor. With unique thermal design, 7STARLAKE is capable to integrate high power consumption CPU into 1U such slim size fanless system.
