HPC3000-IL
3U IP67 Military Dual-GPU Server with Intel® Xeon SP ICe Lake Silver 4316(20xC) Processor
- Intel® 3rd Gen Ice Lake Xeon® Silver 4316(20xC) Processor
- 2TB NVMe Gen 4.0 (W/R,3000MB/sec)-System Drive
- 8xSATA Drive Bay (SAS/SATA) RAID10
- 4 x 100GbE , 2 x GbE
- 2 x Nvidia Quadro RTX A4000 GPU (6,144 CUDA)
- DC-DC 24V (800W)
- Options for Redundant AC 100~240V Input
- MIL-STD-810 Thermal, shock, vibration, Humidity EMI / EMC Resistance
- MIL-STD -461 24V~40V DC (optional)
- Extreme Temperature : -20 ~+55 degree
- Technical Profile
- Specifications
- Order Information
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System |
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|---|---|
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CPU |
Intel® Ice Lake Xeon™ Sliver 4316 150W (20 Core, 2.3GHz, Up to 3.4Ghz) |
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Memory type |
Up to 2TB 3DS ECC RDIMM, DDR4-3200MHz |
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Display |
|
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GPU |
Dual x NVIDIA Quadro RTX A4000 PCI-E (16GB-GDDR6, CUDA 6,144) |
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Storage |
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NVMe |
2TB NVMe 4.0 M.2 (R/W, 3000MB/sec) Option : 2TB RAID1 NVMe 4.0 (R/W, 3000MB/sec) |
|
HDD/SSD |
8 x 2.5” Easy Swap HDD/SSD Tray RAID 10 Support |
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Ethernet |
|
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Ethernet |
2 x Intel® I350-AM4 4x Intel 100GbE (SFP+) E810-CQDA2*2(Options) |
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Front I/O |
|
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USB3.0 |
2 x DTL38999(USB3FTV7AZNF312) |
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100GbE |
4 x DTL38999(LCFTV6MDGN) |
|
GbE |
2 x DTL38999(LCFTV6MDGN) |
|
IPMI |
1 x DTL38999(LCFTV6MDGN) |
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VGA |
1 x DTL38999(TV07RW-9-09S) |
|
COM |
1 x DTL38999(TV07RW-9-09S) |
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DIO |
1 x DTL38999(TV07RW-9-09S) |
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DC-IN |
1 x DTL38999(PL082-300-20) |
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Power Button |
1 x Power Button with LED backlight |
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SDD |
1 x SSD light 8 x 2.5” Easy swap HDD/SSD Tray |
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Power Requirement |
|
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Power Input |
DC-DC 24V (800W) Option 1 : Redundant AC 100~240V Input Option 2 : MIL-STD -461 24~40V DC-Input |
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Application |
|
|
Application |
Military Platforms Requiring Compliance MIL-STD-810 Embedded Computing and applications subject to Harsh Temperature, Shock, Vibration, Attitude, Dust and EMI Conditions. |
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OS support list |
|
|
Windows |
Windows 10 |
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Linux |
By request |
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Environment |
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Dimension |
480x112x500 mm (WxHxD) |
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Classis |
Aluminum Alloy, Corrosion Resistant |
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Operation Temp. |
-20 to +55°C |
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Storage Temp. |
-40 to +85°C |
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Relative Humidity |
5% to 95%, non-condensing |
|
EMC |
EN 61000-4-2: Air discharge: 8 kV, Contact discharge: 6kV EN 61000-4-3: 10V/m EN 61000-4-4: Signal and DC-Net: 1 kV EN 61000-4-5: Leads vs. ground potential 1kV, Signal und DC-Net: 0.5 kV CE and FCC MIL-STD-461 (Options): CE102 basic curve, 10kHz - 30 MHz RE102-4, (1.5 MHz) -30 MHz - 5 GHz RS103, 1.5 MHz - 5 GHz, 50 V/m equal for all frequencies |
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MIL-STD-810
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Method 500.5, Procedures I and II (Altitude, Operation): 12,192M, (40,000 ft) for the initial cabin altitude (18.8Kpa or 2.73 Psia) Method 500.5, Procedures III and IV (Altitude, Non-Operation): 15,240, (50,000 ft) for the initial cabin altitude (14.9Kpa or 2.16 Psia) Method 501.5, Procedure I (Storage/High Temperature) Method 501.5, Procedure II (Operation/High Temperature) Method 502.5, Procedure I (Storage/Low Temperature) Method 502.5, Procedure II (Operation/Low Temperature) Method 503.5, Procedure I (Temperature shock) Method 507.5, Procedure II (Temperature & Humidity) Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 24,Vibration) Method 514.6, Vibration Category 20/Operating (Category 20 & 24,Vibration) Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock) Method 516.6, Shock-Procedure I Operating (Mechanical Shock) |
