Introduction

The SR100-X4 based on Intel® Coffee Lake CM246 chipset, is powered by Intel® 9th generation Core™ i7/i5/i3 processor onboard. The SR100-X4 can operate effectively in harsh environment under temp range from -40°C to 70°C and is a perfect solution for military, transportation, factory automation and digital signage applications. SR100-X4 is based on EBX form factor which features with stackable PCIe/104 and FPE expansions, support NVMe M.2 SSD up to 2TB and SO-DIMM up to 128GB. It supports multi-display, 1 DP and 1 HDMI, 2 GIGA LAN port, 4 USB 3.0, 1 COM port and 2 M.2 B key(2242 & 2280) Expansion slots . SR100-X4 supplies wide power voltage from 9V to 36V DC-DC and options for MIL-STD 461 18V~36V DC-DC.

Frame Grabber Card (Analog to Digital / PAL )

Frame grabbers may be used in military applications. For instance, when a potential breach of abnormal signal is detected, a frame grabber captures an image or a sequence of images in digital form, and then transmits the data to pilots or command control center.  SR100-X4 support frame grabber cards expansion to be better process data promptly to meet front line needs, to collect useful images and help pilots to react promptly on the ever-changing battlefield.

Digital HD-SDI video input

1CH, Mini PCIe HW encode

video capture card

Analogic PAL video input

4CH, Mini PCIe Video Capture Card

Analogic PAL video output

1CH, Scan Converter Board

Unique Features

Effective cooling solution for thermal design

7starlake implements unique cooling solution on SR100-X4 to achieve maximum heat dissipation with copper heat spreader, pure copper heat pipe and aluminum heat sink. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of copper and aluminum, the copper heat spreader touches the heat source - processor and chipset and absorbs the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, SR100-X4 can ensure high reliability and stability while working under wide range temperature from -40°C up to 70°C.

MIL-STD-810G standard designed for shock and vibration

SR100-X4 is designed to meet MIL-STD-810G standard for shock and vibration. MIL-STD-810G standard is considered the upmost principle, which guarantees the system achieves superior quality and stability when operate under extreme harsh environment. We have conducted the test with series of testing procedures for resistance to shock, vibration, dust, humidity, and extreme temperatures. What’s more to make the system more rugged is SR100-X4 designed with EBX form factor and stackable ability. With those two features can provide maximum exceeding solidity when stacking together to prevent loose from vibration. With key components- CPU and SSD soldering on board to enhance the capability of shock and vibration.
 

Stackable with PCIe/104 Expansion

Known for application ruggedness, reliability, sealing properties, and compactness characteristics, PCIe/104 & FPE connectors are ideal for high-end electronic equipment and use in extreme environment conditions. With easy connect/disconnect and blind mating, SR100-X4 has a functional life greater than 10,000 mating cycles. The PCIe/104 connector on SR100-X4 that specifies standard of SAMTEC Q2™ QMS/QFS series in a three bank (156-pin) orientation for module stacking. SAMTEC designed the QMS/QFS series with a 15.24 mm stack height for top and bottom board stacking. And the Q2™ has triple the wipe of many high-speed mezzanine interconnects making SR100-X4 the best choice for tough environmental conditions.