The rugged MIL-STD compliant system, SR10B is equipped with highly effectively heat conductive and heat convective thermal solutions to meet extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system via 8.0 mm copper heat pipes. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.

 

Device Model	SR10B-X3
Tester	Marc Liu
Test Result	Pass
Test Temperature	High 0°C to 70°C / Low -40°C to 0°C
Test Time	8 Hours / 3 Hours
Test Standard	Reference IEC60068-2
Test Software	Burnin test v9.0、 Crystal DiskMARK3.03, Intel Extreme Tuning Utility1
Criteria	After testing, system can't halt.

Test Configuration

Device	Configuration
CPU	Intel® Core i7-7820EQ 3.0GHz
PCH	Mobile Intel QM175 Express Chipset
Memory	Swissbit SO-DIMM 4 GB DDR4-1600
port3 SATAII	Innodisk 3ME3 mSATA 64GB
port4 SATA II	Apacer 64GB Onboard SSD
LAN1	Intel(R) I210 Gigabit Network Connection
LAN2	Intel(R) I217-LM Ethernet Connection
Test Software	Burnin test v6.0、AS SSD Benchmark Intel Extreme Tuning Utility 4.3.0.11
Chamber	KSON THS-b4t-150 Chipeng SMO-3

Thermal Measurement

7starlake provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus 7starlake conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, 7starlake is able to analyse the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5 hours which at each temperature point we burn in SR10A for one hour, from 50°C to 85°C.

SR10B-X3 IO Performance

Point	-40°C	-20°C	25°C	40°C	45°C	50°C	55°C	60°C	65°C	70°C
CPU T-J	0	21	98	100	100	100	100	100	100	100
CPU Die	-17.3	7.4	81.5	84.2	92.1	93.5	95.5	97.3	97.7	100.6
Heatsink	-36.9	-16.1	61.3	64.3	69.4	72.4	76.2	79.8	83.5	87.2
Δ1=(TJ-Die)	17.3	13.6	16.5	15.8	7.9	6.5	4.5	2.7	2.3	-0.6
Δ2=(Die-Sink)	19.6	23.5	20.2	19.9	22.7	21.1	19.3	17.5	14.2	13.4
CPU Frenquency (GHz)	2.79	2.79	2.69	2.59	2.49	2.19	2.00	1.70	1.20	0.90