HORUS422A
2U Fanless Storage Server , Intel® Xeon E3-1268L ,12 Bays 2.5" SAS RAID ,10GbE Support, NVIDIA®Quadro RTX 3000 GPU
- MIL-STD 810 Certified 2U Fanless Storage Server
- 6th Gen Intel® Xeon E3-1268L v5, i7-6700TE (2.4GHz up to 3.4GHz)
- 4 x DDR4 XR-DIMM up to 64GB
- RocketRAID 840A RAID Card
- 4 x RJ45 LAN, 6 x USB, 1 x RS232 Console
- 12 x 2.5" Easy swap SSD/HDD Tray
- MIL-STD810H 500.6 Low Pressure Altitude
- Extended Temperature -40°C to 60°C ( -20~+60 for 10GbE)
- NVIDIA® GTX 1050 Ti / NVIDIA® Quadro RTX 3000
- MIL-STD810H 500.6 Low Pressure Altitude
- Technical Profile
- Specifications
- CPU
- Thermal Solution
Introduction
HORUS422A is designed with 6th Gen Intel® Xeon E3-1268L v5, i7-6700TE processor presents outstanding CPU performance with quad cores up to 3.4GHz clock speed. System especially builds in Highpoint RocketRAID 840A SATA RAID Card supports up to 12 SATA/SSD drives.
HORUS422A highlights on it rugged design and high functionality, system especially designed with dual sided thermal solution, allow powerful system presents supreme performance under harsh environment.
Dual sided thermal solution ensures supreme system performance
With combination of high end CPU computing and high bandwidth PCIe bus power generate numerous heat, 7starlake emphasizes on providing exceeding thermal design guarantee superior system performance under critical environment. HORUS422A innovatively adopts dual sided thermal solution, with copper heat spreader directly touches the heat source components processor and RAID card to absorb the heat rapidly, heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid which can provide high efficiency heat transmission. The aluminum heat sink dissipates the heat into surrounding air promptly. One side thermal solution is mainly for 6th Gen Intel® Xeon E3-1268L v5, i7-6700TE 35W processor and the other side is to dissipate the heat for RocketRAID 840A RAID card. With unique thermal design, HORUS422A can ensure high performance and reliability under harsh environment.
Maximizes SATA SSD Storage Performance
RAID 5 Performance Up to 6,000 MB/s!
RocketRAID 800 host bus adapters are the industry's fastest SATA RAID Controllers. The PCIe Generation 3.0 host interface and dedicated 6Gb/s SATA channels work in tandem to deliver uncompromised transfer performance for up to 16 SSD's or hard disks.
- System main board: ATX AB20
-
1. 6th Gen Intel® Xeon E3-1268L v5, i7-6700TE powerful processor
HORUS422A is based ATX formfactor AB20 motherboard, powered by 6th Gen Intel® Xeon E3-1268L v5, i7-6700TE, Skylake processor presenting superior CPU and graphics performance, providing quad cores up to 3.4 GHz clock speed over compact size 2U rackmount.
2.Rich I/O interface
AB20 equips extensive I/O interface to fulfill different application requirements. The board supports four XR-DIMM RAM up to 64 GB, it offers 4x LAN, 10x USB and 6x COM for device connects ability, with 4x Mini PCIe slot, 1x PCIex8 and1x PCIex4 can add on extra feature for different demands. With MXM slot can integrate with graphic card for image processing usage.
- MIL-STD-810
-
Operating
Reference
Test
Condition
Method 502.5
Procedure 2Low Temperature
5°C, 4 hours, ±3°C
Method 501.5
Procedure 2High Temperature
+55°C, 4 hours, ±3°C
Method 507.5
Humidity
85%-95% RH without condensation, 24 hours/ cycle, conduct 10 cycles.
Method 514.6
Vibration
5-500Hz, Vertical 2.20Grms, 40mins x 3axis.
Method 516.6
Shock
6 Grms, 11ms, 3 axes.
Method 500.5
Procedures I and II
Altitude
25°C, 15,000ft
12,192M, (40,000 ft) for the initial cabin altitude (corresponding pressure in a standard atmosphere: 18.8Kpa or 2.73 Psia).
Non-Operating
Reference
Test
Condition
Method 502.5
Low Temperature Storage
-33°C, 4 hours, change rate:≦20°C/ Hour
'-15°C, 72hours (By request)Method 501.5
Procedure 1High Temperature Storage
+71°C, 4 hours, change rate:≦20°C/ Hour
'+63°C, 240 hours (By request)Method 514.6
Vibration
5-500Hz, Vertical 2.20Grms, 40mins x 3axis.
Method 516.6
Shock
6 Grms, 11ms, 3 axes.
Method 500.5
Procedures III and IV
Altitude
25°C, 15,000ft
15,240, (50,000 ft) for the initial cabin altitude (corresponding pressure in a standard atmosphere: (14.9Kpa or 2.16 Psia)
Test Method/Specification:
Test method: Reference to MIL-STD-810G, Method 500.5, Test Procedure I: Storage, Air Transport
Temperature: 25°C
Altitude: 4.572m (15.000ft) for the cabin altitude
Altitude change rate: 7.6m/s
Operating Temp. |
|
|---|---|
|
5°C to 50°C |
|
System |
|
|
CPU |
6th Gen Intel® Xeon E3-1268L v5, i7-6700TE |
| GPU |
NVIDIA® GTX 1050 Ti(CUDA Cores: 768) NVIDIA® RTX 2060S (CUDA Cores: 2176) |
|
Chipset |
Q170 |
|
Memory Type |
4 x DDR4 XR-DIMM up to 64GB |
|
BIOS |
AMI® SPI BIOS |
|
Expansion Slot |
4 x mPCIe (two support with mSATA) |
|
Storage Device |
12 x 2.5" (7mm) Esay Swap HDD / SSD Tray |
Display |
|
|
Chipset |
Intel® HD Graphics 500 Series |
|
Display Type |
1 x DisplayPort ; 1 x HDMI |
Ethernet |
|
|
Chipset |
3 x Intel® I210-IT ; 1 x I219-LM GbE LAN |
|
WOL |
Yes |
|
Boot from LAN |
Yes for PXE |
Rear I/O |
|
|
Ethernet |
4 x RJ45 Gigabit Ethernet LAN Interfaces |
|
Display |
1 x HDMI ; 1 x DisplayPort |
|
USB |
4 x USB3.0 standard-A connectors |
|
AC-IN |
IEC C14 AC-IN |
Front I/O |
|
|
Button |
1 x System On/Off, 1 x System FAN On/Off |
|
Indicator LED |
1 x HDD LED |
|
COM |
1 x DB9 |
|
USB |
2 x USB2.0 standard-A connectors |
|
2.5" SSD / HDD Tray |
12 ( 7mm height SSD / HDD only ) |
OS support list |
|
|
Windows |
Windows 8 x32 / x64、Windows 8.1 x32 / x64、Windows 10 x32 / x64 |
|
Linux |
Fedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04 |
Mechanical and Environment |
|
|
Form Factor |
ATX |
|
Power Type |
AC to DC 100-240V 400W FLEX ATX Switch Power Supply with fan |
|
Dimension |
430 x 396 x 88 mm ( W x D x H ) |
|
Operating Temp. |
5°C to 50°C |
|
Storage Temp. |
-20°C to 70°C |
|
Relative Humidity |
5% to 95%, non-condensing |
The HORUS422A offers highly effectively heat conductive and heat convective thermal solutions to meet the demands of customers' extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.
| Device Model | HORUS422A |
| Tester | Marc |
| Test Result | Pass |
| Test Temperature | High 0°C~50°C / Low 0°C~5°C |
| Test Time | 8.5 Hours |
| Test Standard | Reference IEC60068-2 |
| Test Software | Burn in test 8.0 AS SSD 1.9 |
| Criteria | After testing, system can't halt. |
- Test Configuration
-
Device
Configuration
CPU
Intel® Core™ i7-6700TE Processor 2.4 GHz
PCH
Intel Q170
Memory
Innodisk 16GB SOD DDR4 2133
Test Software
Burnin test v8、、IntelBurnTest 1.9
XTU CPU STRESS,FU MARKChamber
KSON THS-b4t-150 Chipeng SMO-3
- Thermal Measurement
-
7starlake provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus 7starlake conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, 7starlake is able to analyses the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5.5 hours which at each temperature point we burn in HORUS422 for two hour, from +40 to +50°C.
HORUS422A System - IO Performance
Point 5°C 15°C 25°C 40°C 50°C CPU T-J 43 52 65 75 86 CPU Die 26.4 28.1 39.5 57.5 71 Heatsink 24.2 26.9 32.7 47.3 68 Δ1=(TJ-Die) 16.6 23.9 25.5 17.5 15 Δ2=(Die-Sink) 2.2 1.2 6.8 10.2 3 CPU Frenquency (GHz) 2.9 2.9 2.9 2.86 2.86
Effective cooling solution for maximum heat dissipation:
With HORUS422A, it's all about the incorporation of different heat dissipating part to create an almighty thermal conduction power. HORUS422A adopts dual sided thermal solution, with copper heat spreader directly touches the heat source components processor and graphic GPU to absorb the heat rapidly, the heat then transfer to heat pipe, the aluminum heat sink dissipates the heat into surrounding air promptly. With unique thermal design, HORUS422A can ensure high performance and reliability while working under extended range temperature from -40°C up to 50°C.
Dual Sided High Efficiency Thermal solution
HORUS422A adopts dual sided thermal solution, with copper heat spreader directly touches heat source components processor and graphic GPU to absorb the heat rapidly, the heat then transfer to heat pipe, aluminum heat sink dissipates the heat into surrounding air promptly. One side thermal solution is mainly for Core I processor and the other side is to dissipate the heat for graphic GPU.
Active cooling fan kits (By option)
By integrating active cooling fan kits ensures system CPU i7-6700 and GPU GTX 1050 Ti run full speed without throttling even under harsh environment -40°C~50°C.
Motherboard AB20
ATX AB20 powered by Intel 6th generation Skylake Core i7-6700 CPU, Skylake processor offers superior CPU and graphics performance, providing quad cores up to 4 GHz clock speed.
