AV200-CH
Military MXM GPU Computer
- MIL-STD 810 Thermal, Vibration, Shock
- 9th Gen Intel® Coffee Lake Xeon E-2276ML (6xC, 4.2Ghz)
- 4 x SO-DIMM Up to 128GB DDR4
- MXM RTX A4500 (5888CUDA, 16GB GDDR6)
- Options : RTX A2000 (2560CUDA, 8GB GDDR6)
- 1 x NVMe (Options for 4xCH HD-SDI)
- 2 x Mini PCIe ( SIM Slots )
- 2 x LAN, 2 x DP, 4 x USB 3.0, 1 x COM port
- 12V DC-Input (options for 9V~36V)
- Extended Temperature -40°C to 60°C
- Technical Profile
- Specifications
- CPU
- Order Information
- Thermal Solution
- 다운로드
Introduction
AV200-CH, EBX rugged system is a powerful system that is driven by Intel® 9th generation Coffee Lake-H CPU and chipset soldering onboard, integrated with Nvidia GPU RTX A4500/2060S that supports 2 independent DisplayPort. Processor E-2276ML plus Intel® CM246 chipset supports clock speed 2.0GHz, up to 4.2GHz. up to 6 cores to cope with enormous data computing. Apart from computing power, the system is able to survive in harsh environment from -40 to 60°C, and ruggedness for vibration and shock is proven to pass MIL-810G standard. With the combination of high CPU computing power and rich display inputs, AV200-CH is a perfect portable solution for rugged consoles & workstations, transportation, defense control room to share instant and accurate information on huge screen for in-time solutions.
Thermal solution for fanless system design
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7starlake designs a unique enclosure that is able to stack together both horizontally and vertically. The aluminum heat sink enclosure allows dual-sided heat dissipation. 7starlake exclusively adopts special heat radiating material and combining with special CNC cutting, further forged into a lavish sophisticated metal. Apart from the special heat sink enclosure, AV200-CH innovatively adopts two kinds of copper heat spreader. The shape and the size of the spreader are tailor-made based on the heat sources placement of CPU module and graphic module. In view of the gap difference between motherboard and heat sink, 7starlake builds two heat spreaders in different thicknesses. Combining all these exclusive thermal designs can alternatively replace traditional fan, and also ensures high reliability and stability while working under wide range temperature from -40°C to 50°C.
7STARLAKE, the leading pioneer in ruggedised and embedded systems, introduces the latest EBX SBC OXY5741A. The EBX SBC measures 243*146 mm, providing extraordinary computing performance under extreme environment. It is powered by 9th / 8th Gen Intel® Xeon® / Core ™. Featuring Intel’s Xeon E-2276ML and ruggedised open-standard EBX architecture, 7STARLAKE EBX series is built tentatively and triumphs on environmental testing. It still operates effectively under harsh environments ranging from -40°C to 85°C so that it is a perfect solution for defence, transportation, and automation applications. More key functions such as stackable PCIe/104 expansion ability, flexible I/O, and NVMe Gen 3.0 PCIex4 for fast and large capacity storage, all contribute to this versatile architecture that can meet clients’ needs.
Support OpenVINO™
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The AV200-CH is an AI hardware ready system ideal for deep learning inference computing, AV200-CH support Intel OpenVINO™(Open Visual Inference & Neural Network Optimization),Intel® architecture-based processor (CPU) and Integrated GPU and deep learning accelerator (FPGA, Movidius ™ VPU) deep learning acceleration chip to enhance vision system functions and performance. It's also runs great with the Intel Neural Compute Stick , and helps developers to create cost-effective and robust computer vision applications. It enables deep learning inference at the edge and supports heterogeneous execution across computer vision accelerators.
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System main board: EBX SBC-OXY5741A
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1. Intel® Core i7 CPU soldering onboard
AV200-CH is based on EBX SBC—OXY5741A, powered by Intel Coffee Lake-H E-2276ML quad core processor plus CM246 chipset soldered onboard. With CPU soldering onboard, there is less conduction of heat and high density interconnection between the motherboard and the components, which reduces the MB from the crisis of overheating. Apart from overheating, soldering onboard also provides the best level of shock and vibration protection, removing the unnecessary concern about poor connection that CPU socket type may bring.
2. Two Independent DisplayPort
AV200-CH has added on NVIDIA graphic card through PCIe/104 interface, supporting 2 independent DisplayPort which is driven by GPU RTX A4500. itself has 5,888 CUDA Cores, representing its high computing performance and consumes power at 115W maximum. Connecting by PCIe/104 interface which enhance the resistance of shock and vibration as the connector allows nearly seamless connecting.
3. Wide Range DC input (Option)
For military and heavy duty vehicle applications, instable voltage always brings headaches about damaging the electric components. AV200-CH supports 9 to 36V DC-in, the flexible acceptance of inconsistent power input makes it capable of surviving tough engine cranks and transient over-voltage situations.
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Supporting NVIDIA RTX A4500/2060S
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Powered by NVIDIA, CUDA® is a parallel computing platform and programming model developed by NVIDIA for general computing on graphical processing units (GPUs). With CUDA, developers are able to dramatically speed up computing applications by harnessing the power of GPUs. In GPU-accelerated applications, the sequential part of the workload runs on the CPU – which is optimized for single-threaded performance – while the compute intensive portion of the application runs on thousands of GPU cores in parallel.
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Related Products
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NVIDIA RTX A4500 MXM 3.1 Graphics Module
- Powered by NVIDIA RTX™ A4500
- NVIDIA CUDA technology with 5,888 Cores
- MXM 3.1 Type B
- Support for 4 outputs
- 256-bit width, 8GB/16GB , GDDR6 High-Speed Memory
- Power Consumption: 115W
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NVIDIA GeForce RTX2060 Super MXM 3.1 Graphics Module
- Powered by NVIDIA GeForce® RTX 2060 Super
- NVIDIA CUDA technology with 2,176 Cores
- MXM 3.1 Type B
- Support for 4 outputs
- 256-bit width, 8GB , GDDR6 High-Speed Memory
- Power Consumption: 175W
System |
|
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CPU |
Intel® Xeon E-2276ML Processor (6 Core / 12 Threads, 12M Cache, up to 4.20 GHz), 25W Intel® Core i7-9850HL Processor (6 Core / 12 Threads, 9M Cache, up to 4.10 GHz), 25W |
Memory Type |
4 x SO-DIMM DDR4 2400/2666 MHz up to 128GB |
Memory Type |
Up to 32GB DDR4 SDRAM |
Chipset |
Intel® CM246 Chipset |
GPU |
MXM NVIDIA® RTX™ A4500 5,888 CUDA® cores , 16GB GDDR6 memory Option 1 : MXM NVIDIA® RTX™ 2060 Super 2,176 CUDA® cores , 8GB GDDR6 memory Option 2 : MXM NVIDIA® RTX™ A2000 2,560 CUDA® cores , 8GB GDDR6 memory |
Display |
|
Display Port | Resolution up to 4096 x 2304 60@Hz |
Storage |
|
M.2 | Up to 2TB |
Ethernet |
|
Ethernet |
Intel® I210iT & I219LM GbE LAN (10/100/1000 Mbps supported ) 2 x 100Base-FX port supported |
Front I/O |
|
DC-IN |
M12 Connector |
USB |
2 x USB 3.0 |
Power Button |
1 x Power Button w/Indicator LED |
Rear I/O |
|
Display Port |
2 x DP , resolution up to 4096 x 2304 |
Ethernet |
2 x RJ45, 2 x 100Base-FX port |
USB |
4 x USB 3.0 |
COM |
1 x 232/422/485 variable |
Power Requirement |
|
Power Input |
12V DC-IN Option : 9~36V DC-IN |
Applications, Operating System |
|
Applications |
Commercial and Military Platforms Requiring Compliance to MIL-STD-810 where Harsh Temperature, Shock, Vibration, Altitude, Dust and EMI Conditions |
Operating System |
Windows 10 64Bit ,Windows server 2012 r2, Windows server 2016 , Ubuntu13.04, Ubuntu13.10, Ubuntu14.04, Fedora20 |
Physical |
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Dimension | 315 x 150 x 120mm (W x D x H) |
Weight | 6Kg (13.23lbs) |
Chassis | SECC |
Heatsink | Aluminum Alloy, Corrosion Resistant |
Finish | Anodic aluminum oxide |
Environment |
|
Compliance |
MIL-STD-461 , MIL-STD-810, IEC-61850-3, IEEE-1613, CE and FCC, RoHS |
Operating Temp. |
-40 to 60°C (ambient with air flow) |
Storage Temp. |
-40 to 70°C |
Relative Humidity |
10% to 90%, non-condensing |
The AV200CH offers highly effectively heat conductive and heat convective thermal solutions to meet the demands of customers' extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.
AV200-CH CPU E-2276ML ,NVIDIA RTX2060S Performance
- Test Configuration
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Motherboard
Perfectron OXY5741A
CPU
Intel® XEON-E-2276ML
GPU
1 x MXM RTX 2060S
Memory
1 x Innodisk DDR4-2400 32G SODIMM
M.2 NVME PCIe SSD
7Starlake M.2 NVME 480GB
LAN
Intel I219LM/I210 with 10/100/1000Mbp
Power
DC-IN 9~36V
- Thermal Measurement
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7STARLAKE provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus 7STARLAKE conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, 7STARLAKE is able to analyses the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 9 hours which at each temperature point we burn in AV200-CH for two hour, from -40°C to 60°C.
Effective cooling solution for maximum heat dissipation:
7STARLAKE implements unique cooling solution with heat spreader and aluminum heat sink for maximum heat dissipation. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of aluminum, the heat spreader touches the heat source - processor and chipset and absorbs the heat rapidly, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, AV200-CH can ensure high reliability and stability while working under wide range temperature from -40 up to 60°C.
첨부 | 파일 크기 |
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AV200-CH System test report _20220510.pdf (1.86 MB) | 1.86 MB |