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F30

Military Airborne Modular Computer By PCIe/104 Intel® 9th Gen Xeon Processor with Nvidia MXM-GPU 

  • Intel®Xeon E-2276ML (12M Cache, 2.0 GHz, up to 4.20 GHz, 6-cores, 12 threads) ; Option : Intel®Xeon E-2276ME (12M Cache, 2.8 GHz, up to 4.50 GHz, 6-cores, 12 threads)
  • NVIDIA®RTX A2000 MXM GPU 
  • Modular rugged chassis with stackable PCIe/104 I/O card expansion.
  • IP65 sealed chassis with Amphenol DTL-38999 connectors 
  • Extreme rugged temperature : -40°C to 70°C
  • 28V DC MIL-STD-461/1275 Power supply with Voltage transient protections/EMI_EMC conditions
  • MIL-STD-810 Thermal Shock, Vibration, Humidity