HPC110’s Intel® XEON™ 2nd Gen Scalable Gold 6240 Processor is the foundation for secure, agile, hybrid-cloud data centers, provides the for a powerful data center platform the creates an evolutionary leap in agility and scalability. With enhanced hardware-based security and exceptional multi-socket processing performance, these processors are built for mission-critical, real-time analytics, machine learning, artificial intelligence, and multi-cloud workloads. With trusted, hardware-enhanced data service delivery, these processors deliver improvements in I/O, memory, storage, and network technologies to harness actionable insights from our increasingly data-fueled world. Designed for advanced analytics, artificial intelligence, and high-density infrastructure, new Intel Xeon Gold 6204 processor delivers new levels of performance, platform capabilities and industry-leading workload acceleration.

HPC110's Intel® XEON™ 2nd Gen Scalable Gold 6240 Processor provides a new foundation for performance begins with support for Intel’s breakthrough Intel® Optane™ DC persistent memory, delivering up-to 36TB of system-level memory capacity when combine with traditional DRAM, helping to transform critical data workloads – from cloud and databases, to in-memory analytics, and content delivery networks.

HPC110 Supports NVIDIA Tesla T4 GPU Module; can power the planets most reliable mainstream workstations. Designed into a low-profile, 70-watt package, T4 is powered by NVIDIA Turing Tensor Cores, supplying innovative multi-precision performance to accelerate a vast range of modern applications. HPC110 w/ Tesla T4 GPUs accelerates diverse cloud workloads. These include high-performance computing, data analytics, deep learning training and inference, graphics and machine learning. T4 features multi-precision Turing Tensor Cores and new RT Cores. It is based on NVIDIA Turing architecture and comes in a very energy efficient small PCIe form factor. HPC110 delivers ground-breaking performance at scale.

HPC110 gains in performance with the introduction of the new 28-core CPUs from the Intel Xeon Gold processor range. With more cores packed into a single socket at higher clock speeds, subscriber density and network throughput on elements such as virtual Broadband Network Gateways (vBNG) can be significantly increased bringing greater cost efficiency per rack unit.

The higher core count is also beneficial for virtualization workloads based on "per socket" licensing costs meaning the more cores per socket, the greater the cost savings. Current installations which deploy Open Virtual Switch (OVS) infrastructure will gain immediate benefits.

The performance upgrades and built-in acceleration will also bring a significant boost to applications requiring the highest speed packet handling and flow processing on Intel architecture in applications such as policy control and enforcement, carrier-grade NAT, quality-of-service, network security and network analytics. 

1. System Features

The motherboard offer infrastructure optimization, by combining the performance and advanced intelligence of Intel® Xeon® processors into a dense, lower-power system-on-a-chip. With server-class reliability, availability and serviceability (RAS) features now available in an ultra-dense, low-power device, it will be able to deliver balanced compute, storage and intelligent edge networks and appliances. These advanced technology building blocks offer the best work load optimized solutions and long life availability with the Intel® Xeon® processor D family, with up to 768 GB DDR4 ECC RDIMM operating at 2133MHz, USB 3.0 I/O, six SATA3.0 storage or dual 10 GbE LAN networking ports.

2. AC-in Power Design

HPC110 supports 100V~240V AC-in power, allows the system to be utilized in extensive power types. The design of wide power range keeps the system’s reliability and you can expect longer life-span as well. Sudden drop or surge of power posts absolutely no threat to this smart system.

3.Ultra Slim Size

HPC110 is a compact yet capable rugged system. With only 480mm in depth and 44mm (1.73") in height, this 1U size system is superior in its compact yet durable exterior design and highly functional interior structure.