SK515-T6KL
COM Express Type 6 + GPU Embedded System
- High-Performance Intel CORE & Xeon in a ruggedized small form factor
- COM Express Type 6 CPU Modular
- Standard MXM Version 3.1 Support
- PCI/104 Express Expansion Slot for Modular Open Structure
- Extreme Temperature Support -40~+85 degree
- Technical Profile
- Specifications
- Order Information
- Introduction
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Computer-On-Module (COM), is a highly integrated board with CPU, chipset, memory, and peripherals designed into a component module. COM Express Type 6 has become the most versatile and most scalable COM standard supporting everything from small-scaled and cost-sensitive applications up to high-end computing and graphics-intensive solutions.
7starlake’s SK515 COM Express Type 6 platform based on modular, open, scalable architecture, ensuring amazing computing performance. SK515 support a wide range of Intel processors, from 6 Gen core i7 processors to the latest Intel Xeon series. What’s more, SK515 has the capability to operate in harsh environment. It accepts the extend range of temperature from -40°C to 85°C. With outstanding computing capability and efficient thermal design, SK515 is very suitable for industrial, military/aerospace and transportation.
- Description of Key Features
- (1)Efficiency product design
In order to design all kinds of products in the shortest time, the COM Express provide a better way to improvement the process. SK515-T6KL does not only provide the COM Express carrier board, but also MXM, PCIe, M.2 and mini PCI slot, will make the preliminary verification work more efficient. The solutions include:
- Mini PCIe Expansion: 2x full size mini PCIe (1 with mSATA support)
- M.2 Expansion: 1x 2280 M key (SATA only)
- PCIe/104 Expansion: 4x PCI x1, 1x PCIe x4, 5 xUSB, 1 LPC, 1X SPI
(2)Fast System Integration
SK515-T6KL is the fanless design for pass environment test, ex: IP65, MIL-STD810. No need to find the problem until the end, and confirm the design direction as soon as possible.
At the same time, SK515-T6KL use the mezzanine standard, mainly is used in industrial computers. Being mezzanines, they are always plugged on a carrier PCB that supports this format. The modules communicate with their carrier over a dedicated bus, and can have all kinds of special functions.
All I/O signals are mapped to two high densities, low profile connectors on the bottom side of the module. COM Express employs a mezzanine-based approach. The COM modules plug into a baseboard that is typically customized to the application. Over time, the COM Express mezzanine modules can be upgraded to newer, backwards-compatible versions. COM Express is commonly used in Industrial, Military/Aerospace, Gaming, Medical, Transportation, IoT, and Computing embedded applications.
(3)Rich Expansion
SK515-T6KL provides rich expansion to make the whole solutions easier. We could use PCIe 104 related product SK506, SK303, SK1050 and SK1660S
- MXM
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SK220
- PCIe/104 (Type 2) MXM-GPU Carrier
- Utilizes PCIe x16 and PCIe x4, x1 link
- 1VGA & 6 Mini DisplayPort
- MXM 3.0 and 3.1 graphic card support GTX1080, RTX2060S,Quadro RTX5000 support by separate DC-In
- Type A and Type B MXM graphic card and support
- Operating Temp: -40°C to 85°C
StackPC and PCIe/104 Compliant
Utilizes PCIex16 and x4 Link
1 x VGA & 4 x Mini DisplayPort Module 12V DC Input MXM 3.0 and 3.1 Graphic card support Type A and Type B MXM Graphic card support Support up to NVIDIA GeForce 1050Ti/1650/1660S , RTX2060 Operating Temp. -40°C to 85°C
SK221
- NIC
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SK506
- StackPC-FPE form factor
- PCIe/104 stackable bus structure
- Reliable Ethernet technology from Intel i350-AM4 controllers
- Total 6 independent LAN connections (2 from host board, 4 from Intel controllers)
- Flexible options for Ethernets through RJ45 or 10 pin-headers
- High-performing bridgeless design supporting PCI Express Gen 2.1 5GT/s
- Extended temperature -40°C to 85°C
- StackPC-FPE form factor
- PCIe/104 stackable bus structure
- Reliable Ethernet technology from Intel i350-AM4 controllers
- total 6 independent LAN connections (2 from host board, 4 from Intel controllers)
- Flexible options for Ethernets through RJ45 or 10 pin-headers
- High-performing bridgeless design supporting PCI Express Gen 2.1 5GT/s
- Extended temperature -40°C to 85°C
SK502
- COM
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SK303
- PCI/104-Express, PCI & PCIe connectors (w/StackPC design)
- PCIe/104 stackable bus structure
- PCIe to PCI adapter function
- COM: 4 x RS232/422/485 with 5V/12V selectable and isolation function
- Extended Temp.: -40°C to 85°C
- Storage
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SK401
- PCIe/104 stackable bus structure
- upports 1 x 2.5” SSD, 2 x Mini PCIe slots
- Supports 2 x mSATA SSD slot, compatible with JEDEC MO-300B
- SATAII interface supports 1.5Gbps/3.0Gbps
- Reserve PCI/104 connector for different stacking criteria
- Extended temperature -40°C to 85°C
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Processor & System |
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|---|---|---|
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COM Express CPU Module (Type 6) |
Intel® Core™ i7-7820EQ (KabyLake 7th Gen, 4 Cores/8 Threads, 8M Cache, up to 4.00 GHz), 45W |
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GPU |
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Quadro |
P3000 (1280 CUDA Cores, 75W) P5000 (2560 CUDA Cores, 100W) RTX3000 (1920 CUDA Cores, 80W) RTX5000 (3072 CUDA Cores, 110W) |
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GeForce |
RTX2060 (2176 CUDA Cores, 175W) GTX1080 (XXX CUDA Cores, 180W) GTX1660S (1048 CUDA Cores, 95W) GTX1050Ti (768 CUDA Cores, 75W) |
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Ethernet |
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LAN |
Dual Gigabit (10/100/1000) Ports 1x Intel i210IT, 1 x from COM Express |
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Internal I/O |
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MXM |
1 (Socket) |
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LAN |
2 (Pin header) |
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USB3.0 |
2 (Pin header) |
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SATA Port |
2 (up to 6Gb/s)(Pin header) |
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SATA Power |
2 (Pin header) |
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DVI |
1 (Pin header) |
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MXM VGA |
1 (Pin header) |
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MXM DC IN |
1 (Pin header) |
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MXM DP |
2 (Pin header) |
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MB DC IN |
1 (Pin header) |
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LVDS |
1 (Pin header) |
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LVDS Backlight |
1 (Pin header) |
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AUDIO |
1 (Pin header) |
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COM (RS232/422/485) |
4 (Pin header) |
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USB 2.0 |
2 (Pin header) |
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DIO |
8 Bit (4DI/4DO) (Pin header) |
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Battery Header |
1 (Pin header) |
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eSPI/LPC Header |
1 (Pin header) |
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Expansion Slot |
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MXM |
1 (MXM3.1 Type B) |
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PCIe/104 |
1 |
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mPCIe |
2 x Full-size mini PCIe (USB+PCIe) ; 1 x with mSATA supported |
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SIM Slot |
1 |
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M.2 |
1XM.2 2280 M-Key Slot (SATA only) |
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Power Management |
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ACPI |
ACPI 3.0 |
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Sleep State |
S0, S1, S4, S5 |
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Mechanical and Environmental |
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Form Factor |
Proprietary |
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Power Type |
9~36V DC IN(For System, 4P Terminal Block) ; 12V DC IN(For MXM, ATX 4P) |
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Dimension |
190 mm x 185 mm (Plan) |
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Operating Temperature |
- 40℃ ~ 85℃ |
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Storage Temperature |
- 40℃ ~ 85℃ |
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Relative humidity |
10% to 90%, non-condensing |
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Accessories |
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SINK+ FAN Kit |
CPU(SINK)+MXM(SINK+FAN) |
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Standard Compliance |
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Standard Compliance |
CE/FCC |
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- Order Information
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Model Name
Description
SK515-T604Q01
CPU Board : i7-6820EQ / MXM GPU : Quadro P3000
SK515-T604Q02
CPU Board : i7-6820EQ / MXM GPU : Quadro P5000
SK515-T604Q03
CPU Board : i7-6820EQ / MXM GPU : Quadro RTX3000
SK515-T604Q04
CPU Board : i7-6820EQ / MXM GPU : Quadro RTX5000
SK515-T604G01
CPU Board : i7-6820EQ / MXM GPU : RTX2060S
SK515-T604G02
CPU Board : i7-6820EQ / MXM GPU : GTX1080
SK515-T604G03
CPU Board : i7-6820EQ / MXM GPU : GTX1660S
SK515-T604G04
CPU Board : i7-6820EQ / MXM GPU : GTX1050Ti