7SL-3500-CC
3U VPX 3 Payload 1CPU 2GPU Conduction Cooled ATR
- 3U VPX 3 Payload Conduction Cooled VITA 48.2 ATR
- 1.0” Pitch (Condution Cooled), PCIe Gen 4 (x4 or x8 support)
- Thermal Capacity : 80W~100W Per Slot
- 3 Slot – 1CPU 2GPU
- Intel i7-1185GRE or Ultra 7-155H
- Conduction Cooled Technology
- RTX™ A2000 (2560 CUDA)
- 18V~36V DC Input
- MIL-STD 810 Vibration, Shock
- Custom backplanes with VPX and SOSA aligned slot profiles
- Custom I/O options including MIL-STD Wiring & Connectors
- Technical Profile
- Specifications
- Order Information
- Introduction
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7SL-3500 3U-VPX
The 7SL-3500-CC 3U VPX System is a modular Military Rugged ATR enclosure, geared for 3U OpenVPX designs. The versatile design allows multiple customizable configurations based on proven components and design techniques. 7SL-3500-CC Hybrid conduction cooled plate assisted by forced air sets with aggregate power demands over 300W.
Custom and standard 3 slot backplanes with VPX and SOSA aligned slot profiles in combinations supporting high speed signal processing applications.
Scalable to multi CPU-GPU requirementsDesigned expressly for Gen 4.0 ultra-high wattage military systems
7STARLAKE scalable and customizable, rugged VPX ATR System enables compute-intensive, SWaP constrained mission-critical applications for deployment in the world’s most demanding military and aerospace environments
- 7StarLake Advanced Thermal Solutions
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From ships at sea to high-altitude Drone, 7Starlake 3U VPX system enable electronics survivability in the harshest environments. As an ever-increasing number of data acquisition methods are utilized in military and aerospace, the need to convert that rising data tide into precise, real-time action only escalates.
Applications like object targeting , ground vehicles tracking, thermal image monitoring, and multiple simultaneous sensors feeds. When a wealth of such sources need aggregation and immediate analysis, potentially with graphical visualization output to any number of displays, VPX-based systems can ensure proven solutions
- 7SL-3500-CC
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Conduction Cooled_7SL-3500CC2
- As the most common heat-transfer device available, heat pipes can manage the transfer of heat between two solid interfaces effectively. Combining the advantages of thermal-conductivity and phase transition, heat pipes are extremely light-weight compared with traditional cooling methods.,
- For the highest thermal dissipation and thermal density, heat pipes can be very effective in conduction cooled environments.
- The heat pipes are embedded in a symmetrical topology from the sidewall, allowing the assembly to be less sensible to gravity or acceleration
- This technique, not only improves thermal performance, but also helps to sustain a high level of shock and vibration by providing a rigid frame to attach the board at multiple points.
Force Air Conduction Cooled_7SL-3500-CC3
- 7SL-3500 Hybrid conduction cold plate assisted by forced air sets with aggregate power demands over 300W
- Internal recirculation fans ensure dry air is forced across conduction or air-cooled payload modules, minimizing hot-spots and dissipating heat homogeneously
- Product Appearance
| System | |
|---|---|
|
CPU |
Intel® i7-1185GRE or Ultra 7- 155H |
|
Memory type |
32GB DDR4 RAM Soldered on Board Or 64GB DDR5 RAM Soldered on Board |
|
GPU option 1 |
1x NVIDIA RTX A2000, 8GB GDDR6, 2,560 CUDA |
| GPU option 2 | 2x NVIDIA RTX A2000, 8GB GDDR6, 2560 CUDA |
| BIOS | Dual 256Mbit SPI flash |
| Security | |
| TPM | N/A |
| Storage | |
|
SATA |
1x SATAIII 6Gb/s |
|
M.2 |
1x M.2 2242 on top side (M-key) |
| Side I/O (D38999) | |
|
X1 |
1x USB3.0 |
|
X2 |
1x GbE |
|
X3 |
1x USB 2.0 |
|
X4 |
1x Mini DP |
|
DC-IN |
1x |
|
GND |
1x |
|
Power Button |
1x |
| OS support list | |
|
OS |
Windows 10 (180921H2) , Linux (RHEL 8.6U 20.04.4) |
| Application | |
|
Application |
Military Platforms Requiring Compliance MIL-STD-810 Embedded Computing and applications subject to Harsh Temperture, Shock, Vibration, Atitude, Dust and EMI Conditions. |
| Environment | |
|
Power Requirement |
18V~36V DC-IN |
|
Dimension |
190 x 389.5 x 269 mm (WxDxH) |
|
Weight |
Max. 20 KG |
| Operating Temp. | -20°C to 60°C |
|
Storage Temp. |
-40°C to 85°C |
|
Reliability |
Designed & Manufactured using ISO 9001 Certified Quality Program. |
7SL-3500-CC2
3U VPX Conduction to Air ATR System, GPGPU AI Inference Computer with Intel® i7-185GRE or Ultra 7-155H Processor, 1x NVIDIA MXM A2000 GPU, IP65 rating, MIL-STD D38999 Connectors, 18V~36V DC-IN.
7SL-3500-CC3
3U VPX Conduction to Liquid ATR System, GPGPU AI Inference Computer with Intel® i7-185GRE or Ultra 7-155H Processor, 2x NVIDIA MXM A2000 GPUs, IP65 rating, MIL-STD D38999 Connectors, 18V~36V DC-IN.