7SL-R760

7StarLake Partners with Dell Technologies to Deliver High-Level Ruggedized Servers for Extreme Environments

7StarLake, an industry leader in rugged computing solutions, proudly announces its status as an authorized partner of Dell Technologies, bringing advanced ruggedization to Dell’s high-performance server lineup. With a proven track record in military and defense applications, 7StarLake enhances Dell servers to withstand harsh environments, ensuring uncompromised reliability in extreme conditions.

By integrating MIL-STD-810G-certified vibration and shock resistance, 7StarLake fortifies Dell’s server platforms, including the XR-5610, XR-7620, and R760, against the toughest operational challenges. Furthermore, leveraging extensive expertise in thermal management, 7StarLake optimizes these servers to perform seamlessly in temperatures ranging from -30°C to +55°C, making them ideal for defense, aerospace, and industrial applications.

This collaboration underscores 7StarLake’s commitment to delivering mission-critical solutions, ensuring Dell’s cutting-edge technology thrives in the most demanding environments.

Product Highlight

Technical Specification

• 5^th/4^th Gen Intel^® Xeon^® Scalable processors, Two Socket LGA-4677 (Socket E)
• Up to 56/64 Cores per Processor
• Up to 8TB memory with 32 DIMM slots
• Storage Internal Controllers: PERC H965i, PERC H965e, PERC H755, PERC H355, HBA355i
• (BOSS-N1): HWRAID 1, 2 x M.2 NVMe SSDs

Management and Operating System

• Windows^®, VMWARE, Ubuntu Server LTS, Windows Server with Hyper-V, Red Hat Enterprise Linux, SUSE Linux Enterprise Server, VMware ESX
• AMI UEFI BIOS type
• iDRAC9, iDRAC Direct, iDRAC RESTful API with Redfish, iDRAC Service Module, NativeEdge Endpoint Orchestrator
• TPM 2.0 support

Expansion

• Up to 8 PCIe slots (6 x16 Gen4/Gen5, 1 x 8 LP Gen4, 1 x 16 LP Gen4)
• 24x 2.5-inch SATA III, SAS, or NVMe SSDs max 368.64 TB

Input/Output Versatility

• 1x Power Button
• 1x SSD Status LED
• 2x AC-IN Jack
• (Front)
• 1x iDRAC Direct (Micro-AB USB 2.0) port, 1 x USB 2.0
• (Rear)
• 1 x iDRAC dedicated port, 1 x USB 3.0, 1 x Serial (Micro- AB USB 2.0) port, 1 x Mini-DisplayPort or VGA, 2 x 10GbE LAN, 2 x 25 GbE SFP+ LOM

Power Supply Options

• Redundant 1400 W Platinum 100/240V VAC
• 1100 W 48V~60V DC (Optional)

Thermal Solution

• Air Cooling 6 x Standard cold fans
• Optional Direct Liquid Cooling (DLC) or Conduction Liquid Cooling Plate (CLCP)

Environmental

Operating

• Temperature: -10°C to 55°C
• Humidity: 5%to 95%, non-condensing
• Shock: 3 axis, 25g
• Vibration: 5Grms

Non-Operating

• Temperature: -20°C to 60°C
• Humidity: 5%to 95%, non-condensing

MIL-STD-810 Test

• Method 500.5, Procedures I and II (Altitude, Operation):
• 12,192M, (40,000 ft) for the initial cabin altitude (18.8Kpa or 2.73 Psia)
• Method 500.5, Procedures III and IV (Altitude, Non-Operation):
• 15,240, (50,000 ft) for the initial cabin altitude (14.9Kpa or 2.16 Psia)
• Method 501.5, Procedure I (Storage/High Temperature)
• Method 501.5, Procedure II (Operation/High Temperature)
• Method 502.5, Procedure I (Storage/Low Temperature)
• Method 502.5, Procedure II (Operation/Low Temperature)
• Method 503.5, Procedure I (Temperature shock)
• Method 507.5, Procedure II (Temperature & Humidity)
• Method 509.7 Salt Spray (50±5)g/L(Optional for Conformal Coating)
• Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)
• Method 514.6, Vibration Category 20/Operating (Category 20 & 24, Vibration)
• Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock)
• Method 516.6, Shock-Procedure I Operating (Mechanical Shock)

Mechanical

• Height: 3.41 inches (86.8mm)
• Width: 19 inches (482.6mm)
• Depth: 22 inches (572mm) with bezel
• 18.57inches (471.8mm) without bezel
• Weight: 46.64 pounds (21.16kg)

Appearance