7SL-R760
Intel 4/5TH XEON SP 2U, 2P Dell Military GPU Server
- Dual Intel® 4/5th XEON® SP , Dell Military GPU Server
- Up to 8 PCIe slots :
◎4x 16 Gen4/Gen5 Full-Height/Full Length
◎2 x8/x16 Gen4/Gen5 Full-Height/Full-Length
◎2x 16 LP Gen4 Low profile, Half Length
- 1 x USB 2.0, 1 x iDRAC Direct (Micro-AB USB 2.0), 1 x iDRAC dedicated, 1x USB 3.0, 1 x Serial port(optional), 1x VGA
- MIL-STD-810 Vibration Method 514.6 : ◎Acceleration : 5.0 Grms
- MIL-STD-810 Vibration Method 514.6 : ◎ PSD : 0.01257 g2/Hz
- MIL-STD-810 Shock Method 516.6 : ◎Wave Form : Half Shine Wave
- MIL-STD-810 Shock Method 516.6 : ◎Acceleration : 20G
- MIL-STD-810 Temperature Method 501.5 502.5 : ◎Operating Temp. High 55°C
- MIL-STD-810 Temperature Method 501.5 502.5 : ◎Operating Temp. Low -30°C
- Technical Profile
- Specifications
- Order Information
Technical Profile
7StarLake Partners with Dell to Deliver High-Level Ruggedized Servers for Extreme Environments
7StarLake, an industry leader in rugged computing solutions, proudly announces its status as an authorized partner of Dell, bringing advanced ruggedization to Dell’s high-performance server lineup. With a proven track record in military and defense applications, 7StarLake enhances Dell servers to withstand harsh environments, ensuring uncompromised reliability in extreme conditions.
By integrating MIL-STD-810G-certified vibration and shock resistance, 7StarLake fortifies Dell’s server platforms, including the XR-5610, XR-7620, and R760, against the toughest operational challenges. Furthermore, leveraging extensive expertise in thermal management, 7StarLake optimizes these servers to perform seamlessly in temperatures ranging from -30°C to +55°C, making them ideal for defense, aerospace, and industrial applications.
This collaboration underscores 7StarLake’s commitment to delivering mission-critical solutions, ensuring Dell’s cutting-edge technology thrives in the most demanding environments.
- Product Highlight
-
Technical Specification
- 5th/4th Gen Intel® Xeon® Scalable processors, Two Socket LGA-4677 (Socket E)
- Up to 56/64 Cores per Processor
- Up to 8TB memory with 32 DIMM slots
- Storage Internal Controllers: PERC H965i, PERC H965e, PERC H755, PERC H355, HBA355i
- (BOSS-N1): HWRAID 1, 2 x M.2 NVMe SSDs
Management and Operating System
- Windows®, VMWARE, Ubuntu Server LTS, Windows Server with Hyper-V, Red Hat Enterprise Linux, SUSE Linux Enterprise Server, VMware ESX
- AMI UEFI BIOS type
- iDRAC9, iDRAC Direct, iDRAC RESTful API with Redfish, iDRAC Service Module, NativeEdge Endpoint Orchestrator
- TPM 2.0 support
Expansion
- Up to 8 PCIe slots (6 x16 Gen4/Gen5, 1 x 8 LP Gen4, 1 x 16 LP Gen4)
- 24x 2.5-inch SATA III, SAS, or NVMe SSDs max 368.64 TB
Input/Output Versatility
- 1x Power Button
- 1x SSD Status LED
- 2x AC-IN Jack
- (Front)
- 1x iDRAC Direct (Micro-AB USB 2.0) port, 1 x USB 2.0
- (Rear)
- 1 x iDRAC dedicated port, 1 x USB 3.0, 1 x Serial (Micro- AB USB 2.0) port, 1 x Mini-DisplayPort or VGA, 2 x 10GbE LAN, 2 x 25 GbE SFP+ LOM
Power Supply Options
- Redundant 1400 W Platinum 100/240V VAC
- 1100 W 48V~60V DC (Optional)
Thermal Solution
- Air Cooling 6 x Standard cold fans
- Optional Direct Liquid Cooling (DLC) or Conduction Liquid Cooling Plate (CLCP)
Environmental
Operating
- Temperature: -10°C to 55°C
- Humidity: 5%to 95%, non-condensing
- Shock: 3 axis, 25g
- Vibration: 5Grms
Non-Operating
- Temperature: -20°C to 60°C
- Humidity: 5%to 95%, non-condensing
MIL-STD-810 Test
- Method 500.5, Procedures I and II (Altitude, Operation):
- 12,192M, (40,000 ft) for the initial cabin altitude (18.8Kpa or 2.73 Psia)
- Method 500.5, Procedures III and IV (Altitude, Non-Operation):
- 15,240, (50,000 ft) for the initial cabin altitude (14.9Kpa or 2.16 Psia)
- Method 501.5, Procedure I (Storage/High Temperature)
- Method 501.5, Procedure II (Operation/High Temperature)
- Method 502.5, Procedure I (Storage/Low Temperature)
- Method 502.5, Procedure II (Operation/Low Temperature)
- Method 503.5, Procedure I (Temperature shock)
- Method 507.5, Procedure II (Temperature & Humidity)
- Method 509.7 Salt Spray (50±5)g/L(Optional for Conformal Coating)
- Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)
- Method 514.6, Vibration Category 20/Operating (Category 20 & 24, Vibration)
- Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock)
- Method 516.6, Shock-Procedure I Operating (Mechanical Shock)
Mechanical
- Height: 3.41 inches (86.8mm)
- Width: 19 inches (482.6mm)
- Depth: 22 inches (572mm) with bezel
- 18.57inches (471.8mm) without bezel
- Weight: 46.64 pounds (21.16kg)
Specifications
|
System |
|
|---|---|
| Processor | Two 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors, Socket E (LGA-4677) |
| CPU Core Count | Up to 16 Cores/32 Cores |
| Memory Type | DDR5-5600MT/s RDIMM ECC, up to 1TB in 8 DIMM slot, up to 1TB in 8 DIMM slot |
| GPU Options | Up to 5 x 75W (Single Width Full Height/Half Length, Low Profile) GPU or Up to 2 x 300W (Double Width Full Height/Full Length) |
| TPM | Chipset: Infineon, Type: TPM 2.0 |
| IPMI | iDRAC RESTful API with Redfish |
| BIOS | AMI UEFI BIOS |
| USB | 1x USB3.0 +1x USB2.0 ports |
| Ethernet | 2x 25G Ethernet SFP+ Ports & 2 x 10G Ethernet RJ45 Ports |
| Power Type | 100V~240V AC IN Redundant |
| Storage | 24x 2.5” Swappable SATA SAS, or NVMe (HDD/SSD/U.2) |
| Operating Temp. | -10°C to +55°C |
| Dimension | 482mm(W) x 572mm(D) x 86mm(H) |
| Front I/O | |
| Power Button | 1x |
| SSD LED indicator | 1x |
| Swappable SSD Tray | 24x |
| iDAC | 1x iDRAC Direct (Micro-AB USB 2.0) port, 1 x USB 2.0 |
| StorageRear I/O | |
| iDAC | 1x iDRAC dedicated Direct port |
| USB3.0 | 1x |
| Serial | 1x (Micro-AB USB 2.0) |
| 10G LAN | 2x |
| 25 LAN | 2x |
| Display port | 1x Mini-DP or VGA |
| Environmental | |
| MIL-STD-810 Test |
Method 500.5, Procedures I and II (Altitude, Operation): 12,192M, (40,000 ft) for the initial cabin altitude (18.8Kpa or 2.73 Psia) Method 500.5, Procedures III and IV (Altitude, Non-Operation): 15,240, (50,000 ft) for the initial cabin altitude (14.9Kpa or 2.16 Psia) Method 501.5, Procedure I (Storage/High Temperature) Method 501.5, Procedure II (Operation/High Temperature) Method 502.5, Procedure I (Storage/Low Temperature) Method 502.5, Procedure II (Operation/Low Temperature) Method 503.5, Procedure I (Temperature shock) Method 507.5, Procedure II (Temperature & Humidity) Method 509.7 Salt Spray (50±5)g/L(Optional for Conformal Coating) Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 24,Vibration) Method 514.6, Vibration Category 20/Operating (Category 20 & 24,Vibration) Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock) Method 516.6, Shock-Procedure I Operating (Mechanical Shock) |
| Operating Temp. | -10°C to +55°C |
| Storage Temp. | -20°C to +60°C |
| Relative Humidity | 5% to 95%, non-condensing |
Order Information
|
7SL-R760-AC |
7SL-R760-DC |
|
|
CPU |
5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors, Socket E (LGA-4677) |
5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors, Socket E (LGA-4677) |
|
RAM |
DDR5-5600MT/s RDIMM ECC, up to 8TB in 32 DIMM slot |
DDR5-5600MT/s RDIMM ECC, up to 8TB in 32 DIMM slot |
|
Storage |
24x 2.5” Swappable SATA SAS, or NVMe (HDD/SSD) |
24x 2.5” Swappable SATA SAS, or NVMe (HDD/SSD) |
|
Power |
2400W 100V~240V AC IN Redundant |
1100W DC 48V~60V |
|
Thermal |
Active Smart Fan Cooling |
Active Smart Fan Cooling |