TEC300P-M96
- Ampere® Altra® Max M96-28 SoC, 96 cores, 2.8 GHz, Ampere Altra
- RAM DDR4-3200 MT/s Up to 4TB
- RTX MXM A4500 GPU (5888 CUDA)
- 2x10G (SFP+), 2x1G , 4xUSB3.0, 1xVGA, 1xCOM, 4 x DP
- DC-IN 18V~36V
Special Request:
- 2 x CAN BUS
- AC Power In (Option)
- Technical Profile
- Specifications
- Order Information
Appearance
Dimension
| System | ||||
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| CPU | Ampere® Altra® MAX M96-28 SoC, 96 cores, 2.8 GHz, 95W TDP, Ampere Altra | |||
| Memory Type |
16 x DIMM sockets with individual memory channels Up to 4TB (16x 256 GB) DDR4 RDIMM memory, up to 3200 MT/s |
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| GPU | ||||
| Graphics Card | RTX MXM A4500 (5888 CUDA Cores) | |||
| Storage | ||||
| SSD | TBD | |||
| Ethernet | ||||
| Ethernet |
2 x 1 Gigabit Ethernet with RJ45 2 x 10G SFP+ |
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| Side I/O | ||||
| RJ45 GLAN | 2 | |||
| 10 GbE SFP+ | 2 | |||
| COM | 1 | |||
| CAN | 2 | |||
| USB3.0 | 4 | |||
| DP | 4 | |||
| VGA | 1 | |||
| DC-IN | 1 | |||
| Power Button | 1 x Power Button with LED backlight | |||
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OS support list |
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OS |
Linux RedHat ,Ubuntu |
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Power Requirement |
28V DC-IN (18V-36V) |
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Dimension |
TBD |
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Weight |
10 KG |
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Operating Temp. |
0°C to 60°C |
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Storage Temp. |
-40°C to 85°C |
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Relative Humidity |
5% to 95%, non-condensing |
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| Environmental | ||||
| MIL-STD-810 Test |
Method 500.5, Procedures I and II (Altitude, Operation): 12,192M, (40,000 ft) for the initial cabin altitude (18.8Kpa or 2.73 Psia) Method 500.5, Procedures III and IV (Altitude, Non-Operation): 15,240, (50,000 ft) for the initial cabin altitude (14.9Kpa or 2.16 Psia) Method 501.5, Procedure I (Storage/High Temperature) Method 501.5, Procedure II (Operation/High Temperature) Method 502.5, Procedure I (Storage/Low Temperature) Method 502.5, Procedure II (Operation/Low Temperature) Method 503.5, Procedure I (Temperature shock) Method 507.5, Procedure II (Temperature & Humidity) Method 509.7 Salt Spray (50±5)g/L Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 24,Vibration) Method 514.6, Vibration Category 20/Operating (Category 20 & 24,Vibration) Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock) Method 516.6, Shock-Procedure I Operating (Mechanical Shock) |
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| Reliability |
Conduction Cooling. Designed & Manufactured using ISO 9001 Certified Quality Program. |
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| EMC |
EN 61000-4-2: Air discharge: 8 kV, Contact discharge: 6kV EN 61000-4-3: 10V/m EN 61000-4-4: Signal and DC-Net: 1 kV EN 61000-4-5: Leads vs. ground potential 1kV, Signal und DC-Net: 0.5 kV |
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TEC300P-M96 |
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CPU |
Ampere® MAX M96-28 |
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GPU-1 |
MXM RTXA4500 |
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RAM |
Up to DDR4-1.5TB |
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USB3.0 |
4 |
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VGA |
1 |
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DP |
4 |
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CAN BUS |
2 |
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COM |
1 |
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GLAN |
2 |
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10G SFP+LAN |
2 |
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Power |
DC 18V~36V |
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