1U,2U Fanless Redundant Server
Your Utmost Sustainable 1U and 2U Fanless Servers in Harsh Environment
When it comes to energy utilities, a properly functioning micro-grid control system is important for ensuring all processes work correctly and that energy is always being distributed in an efficient manner. The “Grid” helps connect homes and buildings to central power sources, which allows for the use of appliances, HVAC and electronics.
Introduction
As a pioneer in rugged computer industry, 7STarLake has been eyeing on designing and producing innovative systems to fulfil energy market needs. ROC286-1U ,SCH400-2U rackmount fanless redundant servers series is the birth of 7STARLAKE’s mastermind.
- This series can support high performance computing ( 10th Core i9 Comet-Lake) and is durable under extreme environments from -40 up to +70 degree. Given the fact that this trait is rare, this series is commonly used in energy sector which cannot endure accidental shutdown or outage even under harsh conditions.
- In order to prevent the systems from suffering from power outage, features such as the integration of TPM and FDTI to offer dual security and redundant PSU cover from DC-DC and AC-DC to provide power redundancy so that the users can still have a backup when facing power shutdown.
- Applying conformal coating for anti-corrosion material purpose is another highlight that 7STARLAKE ROC286 series rackmount servers have.
1U ROC286
- 1U Fanless
- Redundancy DC-DC (9V~36V / 33V~62V / 67V~143V)
- Redundancy AC-DC 100V~240V
- Conformal Coating for Anti- Corrosion
- Dual SATA 3.0 Hot Swap Tray for RAID 0/1
2U SCH400
- 2U Fanless
- Redundancy DC-DC (9V~36V / 33V~62V / 67V~143V)
- Redundancy AC-DC 100V~240V
- 4 x SATA 3.0 Hot Swap Tray for RAID 0/1/5
- Dual Security : The Integration of TPM & FDTI
- IPMI Monitoring
- 10GbE
- Key Features
-
Key Features
- Product Line
-
Product Line
ROC286A
- CPU :Intel® Coffee Lake(R) 8th/9th PU (Up to 65W)
- RAM : 2 x SO-DIMM DDR4 2400/2666 MHz up to 64GB
- Storage : 2x2.5”SATA SSD Hot Swap tray
- PSU: DC-IN 12V (ROC286A)
- Extended Operating Temperature: -30 to 70°C
ROC286AA
- CPU: Intel® Coffee Lake(R) 8th/9th PU (Up to 65W)
- RAM: 2 x SO-DIMM DDR4 2400/2666 MHz up to 64GB
- Storage : 2x2.5”SATA SSD Hot Swap tray
- PSU: 9V~36V DC-IN with Redundant support
- Extended Operating Temperature -30 to 70°C
ROC286B
- CPU :Intel® Coffee Lake(R) 8th/9th PU (Up to 65W)
- RAM : 2 x SO-DIMM DDR4 2400/2666 MHz up to 64GB
- Storage : 2x2.5”SATA SSD Hot Swap tray
- PSU: 100~240V AC-IN
- Extended Operating Temperature -30 to 70°C
ROC286BB
- CPU :Intel® Coffee Lake(R) 8th/9th PU (Up to 65W)
- RAM : 2 x SO-DIMM DDR4 2400/2666 MHz up to 64GB
- Storage : 2x2.5”SATA SSD Hot Swap tray
- PSU: 100~240V AC-IN with Redundant support
- Extended Operating Temperature: -30 to 70°C
ROC286CC
- CPU: Intel® Coffee Lake(R) 8th/9th PU (Up to 65W)
- RAM: 2 x SO-DIMM DDR4 2400/2666 MHz up to 64GB
- Storage : 2x2.5”SATA SSD Hot Swap tray
- PSU: 9V~36V DC-IN with Redundant support
- Extended Operating Temperature -30 to 70°C
- Anti-Corrosion Painting on Aluminum Enclosure
- Conformal Coating on all PCB
SCH400-AA
- CPU : Intel® Xeon(R) 10th W-1200/ Core i Processor
- RAM : 4 x DDR4 up to 128GB
- IPMI Support , 10GbE LAN (by option)
- Storage: 4 x 2.5” Easy swap SSD/HDD Tray
- Support RAID 0,1,5,10
- PSU: 9V~36V DC Redundant PSU
- Extended Operating Temperature -30 to 70°C
- 3 PCI-E Expansions Support ( 16,8,4)
SCH400-BB
- CPU: Intel 10th Gen Xeon® W-1200/ Core i Processor
- RAM: 4 x DDR4 up to 128GB
- IPMI Support ,10GbE LAN (by option)
- Storage: 4 x 2.5” Swap SSD/HDD Tray
- Support RAID 0,1,5,10
- PSU: 100~240 VAC Redundant PSU
- Extended Operating Temperature -30 to 70°C
- 3 PCI-E Expansions Support ( 16,8,4)
Expandable Module List
- 7Starlake 1U/2U Product Table
-
7StarLake 1U/2U Product Table
1U
2U
DC
AC
Redundant DC
Redundant AC
Anti-Corision Conformal Coating
Redundant DC
Redundant AC
Model name
ROC286A
ROC286B
ROC286AA
ROC286BB
ROC286CC
SCH400-AA
SCH400-BB
PHOTO
Security
TPM
N/A
N/A
N/A
N/A
N/A
YES
YES
FDTI
N/A
N/A
N/A
N/A
N/A
Options
Options
Main features
IPMI
N/A
N/A
N/A
N/A
N/A
IPMI
IPMI
10GbE
Options
Options
Options
Options
Options
Options
Options
CPU
9th Coffee Lake
9th Coffee Lake
9th Coffee Lake
9th Coffee Lake
9th Coffee Lake
10th Comet Lake
Xeon Comet Lake
10th Comet Lake
Xeon Comet Lake
i3-9100TE
i5-9500TE
i7-9700TEi3-9100TE
i5-9500TE
i7-9700TEi3-9100TE
i5-9500TE
i7-9700TEi3-9100TE
i5-9500TE
i7-9700TEi3-9100TE
i5-9500TE
i7-9700TEi7-10700TE
i9-10900TE
XEON W-1270TE
XEON W-1290TEi7-10700TE
i9-10900TE
XEON W-1270TE
XEON W-1290TEMemory
DDR4- 64GB
DDR4- 64GB
DDR4- 64GB
DDR4- 64GB
DDR4- 64GB
DDR4-128GB
DDR4-128GB
Chipset
Q370
Q370
Q370
Q370
Q370
W480/Q470
W480/Q470
Storage
SATA 3.0
2 x 2.5” hot-swappable SATA SSD
2 x 2.5” hot-swappable SATA SSD
2 x 2.5” hot-swappable SATA SSD
2 x 2.5” hot-swappable SATA SSD
2 x 2.5” hot-swappable SATA SSD
4 x 2.5” hot-swappable SATA SSD
4 x 2.5” hot-swappable SATA SSD
easy swap tray
easy swap tray
easy swap tray
easy swap tray
easy swap tray
easy swap tray
easy swap tray
NVMe
(M.2 2280)1x Gen 3.0 (PCIex4)
1x Gen 3.0 (PCIex4)
1x Gen 3.0 (PCIex4)
1x Gen 3.0 (PCIex4)
1x Gen 3.0 (PCIex4)
1x Gen 3.0 (PCIex4)
1x Gen 3.0 (PCIex4)
PSU
Power input
9V~36V DC
100V~240V AC
9V~36V DC
100V~240V AC
9V~36V DC
9V~36V DC
100V~240V AC
1x 150W
1 x 200W
2x 150W
2 x 200W
2 x 150W
2x 150W
2 x 200W
Redundancy
N/A
N/A
Redundant DC
Redundant AC
Redundant DC
Redundant DC
Redundant AC
Expansions
PCI-Ex 16
1
1
1
1
1
1
1
PCI-Ex 8
N/A
N/A
N/A
N/A
N/A
1
1
PCI-Ex 4
N/A
N/A
N/A
N/A
N/A
1
1
mPCIe
1
1
1
1
1
1
1
1 x M.2 2230 (E)
1
1
1
1
1
1
1
I/O
LAN
2 x RJ45
2 x RJ45 GbE LAN
2 x RJ45 GbE LAN
2 x RJ45 GbE LAN
2 x RJ45 GbE LAN
2 x RJ45 GbE LAN
2 x RJ45 GbE LAN
Display Port
2
2
2
2
2
2
2
DVI
N/A
N/A
N/A
N/A
N/A
DVI-D
DVI-D
VGA
N/A
N/A
N/A
N/A
N/A
1
1
HDMI
1
1
1
1
1
N/A
N/A
Audio
1 x MIC,
1 x Line-Out
1 x MIC,
1 x Line-Out
1 x MIC,
1 x Line-Out
1 x MIC,
1 x Line-Out
1 x MIC,
1 x Line-Out
1 x MIC,
1 x Line-Out
1 x MIC,
1 x Line-Out
COM
2 x RS232/422/485
2 x RS232/422/485
2 x RS232/422/485
2 x RS232/422/485
2 x RS232/422/485
N/A
N/A
USB 3.1
4 x USB 3.1
4 x USB 3.1
4 x USB 3.1
4 x USB 3.1
4 x USB 3.1
4 x USB 3.2
4 x USB 3.2
USB 2.0
2 x USB 2.0
2 x USB 2.0
2 x USB 2.0
2 x USB 2.0
2 x USB 2.0
2 x USB 2.0
2 x USB 2.0
Contact Us
US Office
Address: 33 Commercial Street, 1st Floor Front Gloucester, MA 01930 United States
Contact person: Paul Kuepfer
TEL: 1-978-276-9787
Email: paul.kuepfer@trilogicsys.com ; info@trilogicsys.com
Korea Office
Address: No.504, 54, Yeongil-ro, 6beon-gil, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea
Contact person: Daniel Shin
TEL: +82-31-304-9916
Email: daniel.shin@i-brdg.com
Japan Office (Shoshin Corporation)
Address: Nihonbashi Honcho 1-Chome Bldg.6F 1-9-13 Nihonbashi-Honcho, Chuo-ku, Tokyo 103-0023
Contact person: MAC FURUKAWA ; Yusuke Kikuchi
TEL: +81-3-3270-5921