THOR400-D27
Military Xeon®D-2796TE , 100G NIC GPU Server, 2U Half-Rack
- 2U Half-Rack MIlitary GPU Server,
- Intel® Xeon® D-2796TE (2.0GHz, 20 Cores, 40 threads)
- NVIDIA MXM A4500 (5,888 CUDA)
- 1x 100GbE Single (Fiber)
- Up to 512GB DDR4 RDIMM
- 2x NVMe U.2 (up to 64TB) , 2x NVMe M.2 Expansions
- MIL-STD-810 Temperature, Shock, Vibration
- MIL-STD 461 EMI/EMC; MIL-STD 1275
- Technical Profile
- Specifications
- Order Information
In the ever-progressing dom
ain of multidomain operations, the linchpin for triumph is the synthesis of multi-intelligence sensor data within a fusion framework, delivering nuanced and timely situational awareness.
Elevating the military Commander's comprehension demands more than technical proficiency; it necessitates strategically placing mission-critical, high-performance servers at the edge. This isn't just a technical requirement; it's a strategic imperative propelling your mission to unprecedented heights.
Crafted with cutting-edge components, including the Intel® Ice Lake-HCC 20 Cores Xeon Processor, Nvidia RTX A45000 (5888 CUDA), and supporting up to a 100G Fiber Network, the THOR400-D27 transcends intelligence and decision-making thresholds. Setting its sights on harnessing computing power to amplify battlefield strategies, the THOR400-D27 guarantees high-bandwidth capability to handle intensive military edge workloads. It delivers ultra-fast, nearly instantaneous visual analysis for military workstations, encompassing AI-Targeting, target acquisition, and Network Visualization.
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I. Ultra-High Performance Intel® Xeon® D Processor ICE LAKE-D HCC :
Intel® Xeon® processor D-2700 product family offers hardware and software scalability up to sixteen cores, making it the perfect choice for a broad range of high-performing, low-power solutions that will bring intelligence and Intel® Xeon® reliability, availability, and serviceability (RAS) to the edge.
- Rich Expansion Slot
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SK515-T6 provides rich expansion to make the whole solutions easier. We could use PCIe 104 related product SK506, SK303, SK1050 and SK1660S：
- StackPC-FPE form factor
- PCIe/104 stackable bus structure
- Reliable Ethernet technology from Intel i350-AM4 controllers
- Total 6 independent LAN connections (2 from host board, 4 from Intel controllers)
- Flexible options for Ethernets through RJ45 or 10 pin headers
- High-performing bridgeless design supporting PCI Express Gen 2.1 5GT/s
- Extended temperature -40 to 85°C
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SK401:
- Stack PC form factor
- PCIe/104 stackable bus structure
- Reserve PCI/104 connector for different stacking criteria
- Extended temperature -40 to 85°C
- PCI/104-Express, PCI & PCIe connectors (w/StackPC design)
- PCIe/104 stackable bus structure
- PCIe to PCI adapter function
- COM: 4 x RS232/422/485 with 5V/12V selectable and isolation function
- Extended temperature -40 to 85°C
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NVIDIA Ampere RTXA2000/A4500 MXM 3.1 Graphics Module:
- Powered by NVIDIA RTX® A2000/A4500
- MXM 3.1Type-B Module
- A2000 High-speed 8GB GDDR6 Memory
- A4500 High-speed 16GB GDDR6 Memory
- A2000 2,560 new-gen. Pascal architecture CUDA cores
- A4500 5,888 new-gen. Pascal architecture CUDA cores
- Outputs 4 Channel Support
- Display Port 1.4 Ready
- Support NVIDIA CUDATM, OptimusTM, DirectX® 12, OpenGL® 4.5
System |
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Processor |
Intel® Xeon® Processor D-2796TE, Frequency 2.0GHz, Max Turbo Frequency 3.1GHz, 20 Core, 40 Thread, 30MB Cache, TDP 118W |
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Memory type |
4 x Channel DDR4-2933 RDIMM/LRDIMM up to 512GB (Both ECC & Non-ECC) |
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Chipset |
SoC, integrated with CPU |
GPU |
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NVIDIA |
NVIDIA RTX™ MXM A4500, 16GB GDDR6, 256-bit, 512GB/s, 5,888 CUDA cores, 17.66 TFLOPS, 46 RT cores, Type B, PCie x16, 80/115W TDP NVIDIA RTX™ MXM A2000, 8GB GDDR6, 128-bit, 192GB/s, 2,560 CUDA cores, 8.25 TFLOPS , 20 RT cores, Type A, PCIe x8, 35/60W TDP |
Graphics Output |
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Display Port |
1x mDP (by MXM GPU) |
Storage |
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HDD/SSD |
2x 2.5" U.2 (up to 6x) NVMe SSD 2x M.2 M Key PCIe Gen.4 x4 |
100G |
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| Intel | Integrated Intel® Ethernet 100G |
Front and Side I/O |
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X1 |
1x DC-IN, with D38999 connector |
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X2 |
1x mDP, with D38999 connector |
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X3 |
1x 100GbE SFP MPO(4x 25GbE), with D38999 connector |
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X4 |
1x USB3.0, with D38999 connector |
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Button |
1x Power Switch with Dedicated LED |
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Dedicated LED |
1x Red/Green LEDs ( SSD) |
Power Requirement |
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Power Input |
DC-DC 18V~ 36V (300W max) MIL-STD 461 |
Applications, Operating System |
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Applications |
C4ISR, Commercial and Military Platforms Requiring Compliance to MIL-STD-810 Process Control, where Harsh Temperature, Shock, Vibration, Altitude, Dust and EMI Conditions |
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Operating System |
Windows 10 64Bit, Windows Server 2019 64bit, Windows 2016 64bit, Hyper-V Server 2016 R2, Ubuntu16.04.3 LTS/17.10/18.04.1LTS, Fedora 25/26, RedHat Linux EL 6.8/6.9/7.3/7.4/7.6, VMware ESXi 6.5u1 ,Vmware ESXi 6.7U2 |
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Physical |
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Dimension |
220 x 450 x 88mm (W x D x H) |
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Weight |
7.5Kg |
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Chassis |
Aluminum Alloy, Corrosion Resistant |
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Finish |
Anodic aluminum oxide |
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Cooling |
Natural Passive Convection/Conduction Cooling. No Moving Parts Ingress Protection |
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Environmental |
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Operating Test MIL-STD-810 |
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Low air pressure |
Method 500.5 |
Operation/Air Carriage 4572m (15.000 ft) |
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Procedure 2 |
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Low Temperature |
Method 502.5 |
-20°C, 4 hours, ±3°C |
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Procedure 2 |
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High Temperature |
Method 501.5 |
+55°C, 4 hours, ±3°C |
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Procedure 2 |
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Humidity |
Method 507.5 |
85%-95% RH without condensation, 24 hours/ cycle, conduct 10 cycle |
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Vibration |
Method514.6 |
5-500Hz, Vertical 7.7Grms, 40mins x 3axis |
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Category 24 |
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Shock |
Method 516.6 |
20 Grms, 11ms, 3 axes |
Non-Operating Test MIL-STD-810 |
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Low Temperature |
Method 502.5 |
-33°C, 4 hours, change rate:≦20°C/ Hour -15°C, 72hours (By request) |
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High Temperature |
Method 501.5 |
+71°C, 4 hours, change rate:≦20°C/ Hour |
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Procedure 1 |
+68°C, 240 hours (By request) |
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Vibration |
Method514.6 |
5-500Hz, Vertical 7.7Grms, 40mins x 3axis |
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Shock |
Method 516.6 |
20 Grms, 11ms, 3 axes |
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Salt Fog |
Method 509.7 |
Salt Spray (50±5)g/L |
MIL-STD 461 |
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Conducted Emissions |
CE102 basic curve |
10kHz – 30MHz |
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Power Leads |
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Conducted Emissions |
RE102-4 |
1.5HMz - 30MHz – 5GHz |
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Electric Field |
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Radiated Susceptibility |
RS103 |
1.5 MHz – 3GHz, 50 V/m equal for all frequencies |
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2MHz – 80MHz, 50 V/m equal for all frequencies |
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Electric Field |
80MHz – 3GHz, 50 V/m equal for all frequencies |
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3GHz – 5GHz, 50 V/m equal for all frequencies |
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Electrostatic Discharge |
EN 61000-4-2 |
Air DISCHARGE: 8 Kv, Contact discharge : 6kV |
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Electromagnetic compatibility |
EN61000-4-4 |
Signal and DC Net: 1 kV |
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Electromagnetic compatibility |
EN61000-4-5 |
Lead vs. ground potential 1Kv, ignal und DC Net: 1 kV |
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Radio disturbance |
EN55022 |
Class A |
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Electromagnetic compatibility |
EN61000-4-3 |
10V/m |
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Electromagnetic compatibility |
EN 61000-4-5 |
Lead vs. ground potential 1Kv, ignal und DC Net: 0.5 kV |
MIL-STD-1275 Specifications |
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Steady State |
20V~33V |
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Surge Low |
20V~33V |
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Surge High |
18V/500ms |
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THOR400-D27A45
Military MXM-GPU System GPGPU AI Inference Computer with Intel® Xeon D-2796NT Processor, NVIDIA A2000, DDR4-2933 MHz 128GB RDIMM ECC, 2x NVMe U.2 (up to 64TB) for Fast & Mass Storage, 1 x 100GbE integrated Intel® Ethernet IP65 rating, MIL-STD-D38999 Connectors, 18~36V DC-IN, Extreme Rugged operating temperature -20~+60°C
THOR400-D27A20
Military MXM-GPU System GPGPU AI Inference Computer with Intel® Xeon D-2796NT Processor, NVIDIA A4500, DDR4-2933 MHz 128GB RDIMM ECC, 2x NVMe U.2 (up to 64TB) for Fast & Mass Storage, 1 x 100GbE integrated Intel® Ethernet IP65 rating, MIL-STD-D38999 Connectors, 18~36V DC-IN, Extreme Rugged operating temperature -20~+60°C