ROC288BB

1U 19” AC-DC Redundant Fanless Server
1U 19” Fanless Server With Intel Raptor Lake-S Processor
1U 19” AC-DC Redundant Fanless Server With Intel Raptor Lake-S Processor

1U 19” AC-DC Redundant Fanless Server With Intel Raptor Lake-S Processor

  • Intel®Raptor / Alder Lake-S13th /12th Gen Processor(up to 65W)
  • PCH Q670
  • 2 x SO-DIMM DDR5 4800 MHz up to 64GB
  • 1 x M.2 2242/2280 M-Key(PCIe3.0 x4 / STATIII) 

         1 x M.2 2230 E-Key(PCIe x 1 / USB2.0) 

         1 x M.2 3042 B-Key(PCIe x 1 / USB2.0. SATAIII)

  • 4 x USB3.1 , 2 x USB2.0, 1 x DisplayPort, 1 x HDMI,   2 x LAN, 1 x Line-out/Mic-in
  • 2 x 2.5”SATA HDD/SSD Easy Swap Tray
  • AC-IN 90~260V with redundant
  • Operation Temp. ET : -20 ~ 60°C ; UT : -30 ~ 70°C

Intel Gold

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    • Technical Profile
    • Specifications
    • Order Information
    • Thermal Solution

    Introduction

    ROC288BB is an industrial 1U 19” fanless server based on Intel® Q670 Chipset, an essential companion to Intel’s new performance hybrid processors, providing I/O and other system-critical functions to computing devices such as high performance connectivity, modern manageability, and security technologies. ROC288BB, powered by Intel®Raptor / Alder Lake-S13th /12th Gen Processor(up to 65W) supports DDR5 up to 64GB,1x M.2 2230 E key/ 1x M.2 3042 B key/ 1x M.2 2242 / 2280 M key,1 x DP, 1 x HDMI, 2 x RJ45(1 x GbE ; 1 x 2.5GbE), 2 x 3.5mm Audio Jacks (1 x Mic-in, 1 x Line-out),  x USB 3.1(10Gb/s),2 x 2.5” SATA HDD/ SSD Easy Swap Tray,90-260V AC-IN Power Supply with Redundant, extented temperature  -30 ~ 70°C

     

    Intel® Raptor Lake-S/ Alder Lake-S processors

    Through fully-upgraded hybrid performance architecture (configuration of a mix of performance and efficiency cores) new socket LGA1700 and chipsets, ROC288BB features the intelligently allocation of high computing power created by high core counts, efficiency optimization for graphic performance &machine vision, and AI inference enhancement to bring AI computing capability to the edge.

    With further advantages, for example, HDD/ SSD easy swap tray and multi-expansion slot, we believe that ROC286BB  is a best choice for those, who are looking for an ideal server to meet the requirements of commercial and industrial platforms, process control, intelligent automation and manufacturing applications. 

    Intel CPU_13th_7.png

    I/O Placement

     

    286BB front IO diagram

     

     

     

    286BB Rear IO diagram

     

     



     

     

    System

    High Performance Processor

    3th/12th Gen Intel® Raptor Lake-S/Alder Lake-S LGA1700 Socket Processor / Core i9/i7/i5/i3 Processor / TDP 65W

    Memory type

    DDR5 4800 MHz / 2 x 262-pin SO-DIMM / Max. 64 GB (Non-ECC)

    Chipset

    Intel® Q670 Chipset

    Expansion Slot

    1x M.2 2230 E key (PCIe X1 , USB2.0, SMBus, CNVi)
    / 1x M.2 3042 B key (USB2.0, PCIe3.0 X1, SATAIII)
    / 1x M.2 2242 / 2280 M key (PCIe3.0 X4, SATAIII)

    Storage

    HDD/SDD

    2x 2.5” SATA HDD/SSD easy swap tray

    Ethernet

    Ethernet

    Intel® I219-LM Giga LAN + Intel® I225V 2.5 Giga LAN

    Front I/O

    Display Port

    1 x DP 
    HDMI 1x HDMI 

    Ethernet

    2x RJ45 (1 x GbE ; 1 x 2.5GbE)

    Audio

    2x 3.5mm Audio Jacks (1x MIC, 1x Line-Out)

    COM

    2x RS232/422/485 (422 / 485 select by BIOS)

    USB Port

    4x USB 3.1(10Gb/s)

    AC-IN

    2x AC-IN, 90V~260V

    Rear I/O

    Easy Swap SSD Tray

    2

    Button

    1 x Power Button w/Indicator LED

    Indicator LED

    SSD
    Applications, Operating System

    Applications

    Commercial and Industrial Platforms, Embedded Computing, Process Control, Intelligent Automation and manufacturing applications

    Operating System

    Windows 10/11 64Bit
    Linux (support by request)

    Physical

     

    Dimension (W x D x H)

    430 x430 x 44.4 mm

    Weight

    6Kg

    Chassis

    SECC

    Heatsink

    Aluminum Alloy, Corrosion Resistant

    Finish

    Anodic aluminum oxide

    Environmental

     

    Green Product

    RoHS compliance
    Operating Temperature ET : -20 to 60°C
    UT : -30 to 70°C

    Storage Temperature

    -40 to 85°C

    Relative Humidity

    5% to 95%, non-condensing

    EMC

    CE and FCC compliance

    ROC288BB-ET 
    19” 1U Rack-mount Rugged FanlessAC-DC Redundant System withIntel® Raptor/Alder Lake-S13th/12th Processor(Up to 65W), Q670, 2 x DDR5 SO-DIMM up to 64GB, 1 x DisplayPort, 1 x HDMI,4 x USB,100~240V AC-IN*2 Redundant support, Operating Temp. -20~+60°C
    ROC288BB-UT 
    19” 1U Rack-mount Rugged FanlessAC-DC Redundant System withIntel® Raptor/Alder Lake-S13th/12th Processor(Up to 65W), Q670, 2 x DDR5 SO-DIMM up to 64GB, 1 x DisplayPort, 1 x HDMI,4 x USB,100~240V AC-IN*2 Redundant support, Operating Temp. -30~+70°C

    Dual side thermal solution, fanless design for 1U slim size

    With combination of high CPU computing power and graphic GPU performance generate numerous heat, 7STARLAKE emphasizes on providing exceeding thermal design guarantee system offers superior performance under critical environment. Based on our experience, ROC286 adopts dual side thermal solution, with copper heat spreader directly touches the heat source components processor and graphic GPU to absorb the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid which can provide high efficiency heat transmission, the aluminum heat sink dissipates the heat into surrounding air promptly. Both side thermal solution is mainly for processor. With unique thermal design, 7STARLAKE is capable to integrate high power consumption CPU into 1U such slim size fanless system.

    ROC286