AV600-TH-A20

IP66 GPU Military Computer

Military IP66 Mission GPU Computer

  • MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
  • IP66 Chassis with D38999 connectors
  • Intel® 11th Gen. Tiger Lake(H) W-11865MLE Processors, up to 8 cores
  • 64GB DDR4 SO-DIMM ECC or non ECC support
  • NVIDIA RTX™ A2000 MXM 8GB GDDR6 2560 CUDA cores
  • 2.5” SATA SSD
  • 1x 3G-SDI Capture Card (Options)
  • MIL-STD-461 18V~36V DC-Input
  • Extreme Temperature: -20°C to +60°C degree

 Special Request :

  • Frame Grabber Card: 4CH 3G-SDI
  • Discrete IO : 4 x DI + 4 x DO
  • 10GbE : Dual 10GbE (Intel X710) Ethernet Ports 
  • Dual Redundant MIL-STD-1553 connections 
  • Dual ARINC 429 input connections 
  • Conformal coating on electronics 

 Intel Gold

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Introduction

AV600-TH-A20-PA1 is driven by Intel® 11 Gen. Tiger Lake-H Processors, integrated Intel® UHD Graphics (Xe architecture). Tiger Lake H processor is built on 10nm SuperFin Technology, up to 8 CPU cores and 4.5 GHz frequency. It is high computing performance and flexibility for heavier IoT workloads, the platform posts significant performance gains gen-over-gen with up to 32 percent gain in single-thread performance. It also features in high-bandwidth, high speed I/Os for expansion and peripherals.

AV600TH-A20-PA1 highlights on its rugged design and high functionality, the system especially installed MIL-STD Amphenol type connector and full IP66 protection allow system withstand in any kind of harsh environment. AV600TH-A20-PA1 supports extended temperature from -40°C to 70°C and MIL-STD-461 18V~36V DC-input Power supply which can protect system from damages caused by sudden surge of voltage, thus further secure the reliability of its critical components and the system itself.

AV700TH-T2
ARINC 429

ARINC 429 is the worldwide standard for data transmission in aircraft electronics. It is adopted mostly for commercial aircraft and transport aircraft network protocol standard. Communications, guidance, altitude, altitude reference, flight management, and more are all needed to work together to accomplish a successful flight. The physical connection wires are twisted pairs carrying balanced differential signaling. 

The ARINC 429 unit of transmission is a fixed-length 32-bit frame, which the standard refers to as a 'word'. The bits within an ARINC 429 word are serially identified from Bit Number 1 to Bit Number or simply Bit 1 to Bit 32.

ARINC 429

 

 

System  Diagram

    4CH 3G-SDI(Option )

Video Distribution FPGA_Intel Xeon 4CH 3G-SDI
Appearance

AV600-TH-A20H.png

 

 

System

CPU

Intel® 11th  Gen. Tiger Lake-H Processors, up to 8 cores, integrated Intel® UHD Graphics

Intel® Xeon® W-11865MLE, 25W Tiger Lake 11th Gen, 8C, Freq. 1.5/4.5 GHz, 24MB cache

Memory type

DDR4 SO-DIMM Up to 96GB, non-ECC and ECC

CHIPSET

Intel® RM590E (support ECC, with Xeon CPU) /QM580E

GPU

NVIDIA RTX™ A1000/A2000

4GB/8GB GDDR6 memory, 2048/2560 CUDA cores

Expansion Slot

2 x Full-size mini PCIe (1 with mSATA supported)

1 with mSATA/USB2.0/PCIeX1 support

1 with SIM/USB2.0/PCIeX1 support

1 x 2280 M key (SATA only)

Storage

SATA

1 x 2.5” SSD, Hot Swappable SSD/HDD slot

M.2

1 x 2280 M key (SATA only)

Ethernet

Ethernet (Internal)

2 x 10/100/1000 Ethernet Ports

Front I/O

X1

2 x GbE LAN + 2 x USB2.0 + 1 x COM(RS232) with D38999 connector 

X2

1 x VGA+ 4 x DI/4 x DO +3 x RS422, with D38999 connector 

X3

1 x USB3.0, with D38999 connector  

X4

1 x USB3.0, with D38999 connector  

X5

1 x DC-in, with D38999 connector   

LED

1 x SSD/HDD LED indicator

switch

1 x IP65 power button, with LED indicator

SSD

2 x 2.5”Easy swap SSD Tray

Power

Power input

MIL-STD -461 18V~36V DC-Input

Application, Operating System
Application Military Platforms Requiring Compliance to MIL-STD-810 Where Harsh Temperature, Shock, Vibration, Altitude, Dust and MIL-461 EMI Conditions.
Operating System Windows® 10 64-bit / Linux (support by request)

Physical

Dimension

250 x 325 x 100 mm (LxWxH)

Weight

11 KG

Chassis

Aluminum Alloy

Heatsink

Heatsink Aluminum Alloy, Corrosion Resistant

Environmental

Green Product

RoHS, WEEE compliance

Operating Temp.

-20°C to +60°C

Storage Temp.

-40°C to +85°C

Relative Humidity

5% to 95%, non-condensing
MIL-STD-810 Method 507.5, Procedure II ( Temperature & Humidity )
Method 516.6 Shock-Procedure V Non-Operating ( Mechanical Shock )
Method 516.6 Shock-Procedure I Operating ( Mechanical Shock )
Method 514.6 Vibration Category 24/Non-Operating ( Category 20 & 24, Vibration )
Method 514.6 Vibration Category 20/Operating ( Category 20 & 24, Vibration )
Method 501.5, Procedure I ( Storage/High Temperature )
Method 501.5, Procedure II ( Operation/High Temperature )
Method 502.5, Procedure I ( Storage/Low Temperature )
Method 502.5, Procedure II ( Operation/Low Temperature )
Method 503.5, Procedure I ( Temperature shock )
Reliability No Moving Parts; Passive Cooling.
Designed & Manufactured using ISO 9001 / 2000 Certified Quality Program.
MIL-STD-461 CE102  :   10 KHz - 10 MHz
RE102-4 : 1.5 MHz -30 MHz - 5 GHz
RS103 :    200 MHz - 3.0 GHz - 5.0 GHz, 50 V/m equal for all frequencies
Designed to Meet Items ( Options )
CS101, CS114, CS115, CS116
CE106, RE103, RS101  
MIL-STD-1275 Steady State 20V-33V
  Surge Low 18V/500ms
  Surge High 100V/500ms
Order Information

Model Name

Description

AV600TH-A10

Intel® 11th Gen. Tiger Lake(H) W-11865MLE, RTX A1000 MXM, 1x 2.5” SATA SSD Easy Swap Tray, 18V-36V DC-IN, support MIL-STD-461, MIL-STD-810. with MIL-DTL-D38999 Connectors, Operating Temp. -40 to +60°C

AV600TH-A20-PA1

Intel® 11th Gen. Tiger Lake(H) W-11865MLE, RTX A2000 MXM, 1x 2.5” SATA SSD Easy Swap Tray, 1x 3D-SDI Capture Card, 18V-36V DC-IN, support MIL-STD-461, MIL-STD-810. with MIL-DTL-D38999 Connectors, Operating Temp. -40 to +60°C