SR10A-X3

SR10A-X3_MIL-STD Video Capture Fanless Computer, Intel i7_01
SR10A-X3_MIL-STD Video Capture Fanless Computer, Intel i7_02
SR10A-X3_MIL-STD Video Capture Fanless Computer, Intel i7_03
SR10A-X3_MIL-STD Video Capture Fanless Computer, Intel i7_04

SR10A-X3 MIL-STD Video Frame Grabber Fanless Computer with Intel i7-7820EQ ,  9V~36V DC-IN, Extended Temp. -40°C to 60°C

  • Intel® Core™ i7-7820EQ, 3.0/3.7 GHz, 4C, 8T, 8MB Cache, TDP 45W
  • DDR4 Up to 32GB, mSATA SSD Up to 1TB
  • HD-SDI Video Frame Grabber for Mini PCI Express
  • 8x Video Frame Grabber for mini PCI Express
  • Multi-Displays by 2x DP, 1x DVI-I
  • 2x PCIe Intel® Gigabit Ethernet
  • 4x USB 3.0, 1x COM ports (RS232/422/485)
  • 9V~36V DC-IN
  • Extended Temperature -40°C to 60°C
  • Optional unique accessory bumper design for vibration resistance

 Intel Gold

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  • Technical Profile
  • Specifications
  • CPU
  • Thermal Solution
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Introduction

The SR10A-X3 based on Intel® Haswell QM175 chipset, is powered by Intel® 7th generation Core™ processor onboard. The SR10A-X3 can operate effectively in harsh environment under temp range from -40°C to 60°C and is a perfect solution for military, transportation, factory automation and digital signage applications. SR10A-X3 is based on EBX form factor, DDR4 up to 32GB. It supports triple-display, 2 DP and 1 DVI-I, 2 GIGA LAN port, 4 USB 3.0 and 1 COM port. SR10A-X3 supplies wide power voltage from 9V to 36V DC-in.

SR10A-X3

Frame Grabber Card (Analog to Digital / PAL )

Frame grabbers may be used in military applications. For instance, when a potential breach of abnormal signal is detected, a frame grabber captures an image or a sequence of images in digital form, and then transmits the data to pilots or command control center.  SR10A-X3 support frame grabber cards expansion to be better process data promptly to meet front line needs, to collect useful images and help pilots to react promptly on the ever-changing battlefield.

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Digital HD-SDI video input

1CH, Mini PCIe HW encode video capture card

Analogic PAL video input

4CH, Mini PCIe Video Capture Card

Analogic PAL video output

1CH, Scan Converter Board

 

 

Unique Challenges

http://7starlake.dev.zhelang.com.tw/sites/default/files/inline-images/NEW_STYLE_products_SR10A_03.jpg

MIL-STD-810G standard designed for shock and vibration

SR10 is designed to meet MIL-STD-810G standard for shock and vibration. MIL-STD-810G standard is considered the upmost principle, which guarantees the system achieves superior quality and stability when operate under extreme harsh environment. We have conducted the test with series of testing procedures for resistance to shock, vibration, dust, humidity, and extreme temperatures. What’s more to make the system more rugged is SR10A designed with EBX form factor and stackable ability. With those two features can provide maximum exceeding solidity when stacking together to prevent loose from vibration. With key components- CPU and SSD soldering on board to enhance the capability of shock and vibration. With optional Bumper design, the level of vibration resistance increased.
 

Wire Rope Vibration Isolator Design for Higher Vibration Resistance

7starlake has especially design a Wire Rope Vibration Isolator for SR10A. The Wire Rope Vibration Isolator may sustain higher vibration resistance of the product itself. 

A Wire Rope Vibration Isolator is widely apply on supporting Military equipment because it may absorb and protect the object from vibration damage in any axes simultaneously, with the protection it may extended the product life operating under long hour vibration environment and vibration shock. The isolator is long life maintenance free tool and it may unload whenever required. Besides, Wipe Rope Vibration Isolators may survive under extreme temperature, corrosion, radioactivity, extreme dry or high humidity and UV Radiation environment.

 

Operating Temp.
-40°C to 60°C  
System
CPU Core i7-7820EQ, 3.0/3.7 GHz, 4C, 8T, 8M Cache, TDP 45W
Chipset Intel® QM175 Chipset
Memory Type DDR4 Up to 32GB SO-DIMM
Ethernet Chipset 2x RJ45 Intel® I210IT & i217LM GbE
Front I/O
Power Button 1x 
LED 1x Power, 1x HDD, 1x LAN
USB 2x USB 3.0
POWER 1x Terminal Block
Rear I/O
Display Port 2x 
DVI-I 1x  DVI-I
Ethernet 2x RJ45 ports
COM 1x RS232/422/485
USB 2x USB 3.0
Display
Display Interface 2x DP
DVI-I 1x DVI-I 
Mechanical and Environment
Power Requirement 9V~36V DC-IN, AT/ATX mode with power delay on/off
Dimension 262 x 149 x 69 mm
Weight 4.11 Kg(9.04 lbs)
Operating Temp. -40°C to 60°C (ambient with airflow)
Storage Temp. -40°C to 85°C
Relative Humidity 5% to 95%, non-condensing
Test Standard
MIL-STD-810 Test
Operating Tests
Low Temperature Method 502.4 Procedure 2 -20°C (Cold Boot) -40°C (Continue Operating)
High Temperature Method 501.4 Procedure 2 +55°C
Humidity Method 507.4 5 x 48 hour cycles
Vibration Method 514.5 Category 4 10—500Hz 1.04Grms
Shock Method 516.5 40G 11mSec TPS 3 axis
Altitude Method 500.5 Procedure 2 -1,000m to +12,000m
Non-Operating Tests
Shock Method 516.5 40G 11ms TPS 3 axis
Low Temperature Storage Method 501.4 -40°C
High Temperature Storage Method 502.4 Procedure 1 +75°C
Vibration Method 514.5 Category 24 fig 514.5C-17 20 to 1000Hz @ 0.02g²/Hz falling @ -6dB to 2000Hz
Altitude Method 500.5 Procedure 2 -1,000m to +12,000m
EMC CE and FCC certificated
Green Product RoHS, WEEE compliance

The rugged MIL-STD compliant system, SR10A-X3 is equipped with highly effectively heat conductive and heat convective thermal solutions to meet extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system via 8.0 mm copper heat pipes. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.

SR10A

 

 

Device Model SR10A-X3
Tester Ian Huang
Test Result Pass
Test Temperature High 0°C~70°C / Low -40°C~0°C
Test Time 8Hours / 3Hours
Test Standard Reference IEC60068-2
Test Software Burnin test v7.1、
Crystal DiskMARK3.03,
Intel Extreme Tuning Utility1
Criteria After testing, system can't halt.
Test Standard

Device

Configuration

CPU

Intel® Core i7-7820EQ 3.0GHz

PCH

Mobile Intel QM175 Express Chipset

Memory

Swissbit SO-DIMM 4 GB DDR4-1600

port3 SATAII

Innodisk 3ME3 mSATA 64GB

port4 SATA II

Apacer 64GB Onboard SSD

LAN1

Intel(R) I210 Gigabit Network Connection

LAN2

Intel(R) I217-LM Ethernet Connection

Test Software

Burnin test v6.0、AS SSD Benchmark
Intel Extreme Tuning Utility 4.3.0.11

Chamber

KSON THS-b4t-150 Chipeng SMO-3
Thermal Measurement

The rugged MIL-STD compliant system, SR10A-X3 is equipped with highly effectively heat conductive and heat convective thermal solutions to meet extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system via 8.0 mm copper heat pipes. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.

 

SR10A-X3  IO Performance

Point -40°C -20°C 25°C 40°C 45°C 50°C 55°C 60°C 65°C 70°C
CPU T-J 2 20 98 100 100 100 100 100 100 100
CPU Die -9.7 8.5 81.5 84.2 92.1 93.5 95.5 97.3 97.7 100.6
Heatsink -33.7 -16.2 61.3 64.3 69.4 72.4 76.2 79.8 83.5 87.2
Δ1=(TJ-Die) 11.7 11.5 16.5 15.8 7.9 6.5 4.5 2.7 2.3 -0.6
Δ2=(Die-Sink) 24 24.7 20.2 19.9 22.7 21.1 19.3 17.5 14.2 13.4
CPU Frenquency (GHz) 2.79 2.79 2.69 2.59 2.49 2.19 2.00 1.70 1.20 0.90

 

Effective cooling solution for maximum heat dissipation:

7starlake implements unique cooling solution with copper heat spreader, pure copper heat pipe and aluminum heat sink for maximum heat dissipation. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of copper and aluminum, the copper heat spreader touches the heat source - processor and chipset and absorbs the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, SR10A-X3 can ensure high reliability and stability while working under wide range temperature from -40°C to 60°C

http://7starlake.dev.zhelang.com.tw/sites/default/files/inline-images/NEW_STYLE_products_SR10A_Thermal01_0.jpg

Patent Designed Aluminum Heat Sink

The heat sink is made by heat radiating material, which is aim to lowering the temperature by dissipating heat into the surrounding air. 96 % of aluminum, 21 mm height and weighs 1039 g

 

Pure Copper Heat Pipe

The heat pipes are embedded in the heat sink to ensure 100% tight integration for superior heat dissipation. Especially adopts U shape copper heat pipe to fulfill utmost thermal conductivity, copper heat pipe transfers heat from the heat sources (e.g. CPU, chipset) to the heat sink over relatively long distance. Two-phase heat transfer involves the liquid-vapor phase change of a working fluid.

• 8.0 mm diameter heat pipe, 225 mm length of each heat pipe, 99.9% purity of copper
• High heat conductivity coefficient up to 5000

 

Copper Heat spreader

Copper heat spreader directly touches the power source area, which can absorb heat rapidly and transfer to heat pipe and allow the high efficiency heat pipe further bring out heat to upper heat sink enclosure

• 99.9% purity of copper, weigh 470 g

 

Wire Rope Vibration Isolator design may sustain higher vibration resistance of the product itself.


• 10Grms Vibration and 75Grms Vibration Shock proof with Wipe Rope Vibration Isolator.

 

Attachment Size
SR10_Shock_Test_3.pdf (1.19 MB) 1.19 MB
SR10_Vibration_Test_3.pdf (1.19 MB) 1.19 MB