AV600-D27
IP65 Military Ice Lake-HCC XEON D-2796TE with 100G MPO SFP GPU server
- MIL-STD-810 Thermal, Shock, Vibration, Humidity
- MIL-STD-461 EMI / EMC
- Intel®Ice Lake -HCC Xeon D-2796TE Processors, up to 20 Cores
- Throughput 50Gbps and 100Gbps (4 x 25Gbps) D38999 MPO LAN Port
- Nvidia RTX A2000 8GB GDDR6 memory 2560 CUDA cores
- Up to 256G DDR4 RDIMM, 512G DDR4 LRDIMM
- IP65 1 x 2.5" SATA SSD Easy Swap Tray
- MIL-STD-461 / 1275 18V~36V DC Input
- Extreme Temperture : -40°C to 60°C
- Technical Profile
- Specifications
- Order Information
- Thermal Solution
In the ever-progressing domain of multidomain operations, the linchpin for triumph is the synthesis of multi-intelligence sensor data within a fusion framework, delivering nuanced and timely situational awareness.
Elevating the military Commander's comprehension demands more than technical proficiency; it necessitates strategically placing mission-critical, high-performance servers at the edge. This isn't just a technical requirement; it's a strategic imperative propelling your mission to unprecedented heights.
Crafted with cutting-edge components, including the Intel® Ice Lake-HCC 20 Cores Xeon Processor, Nvidia RTX A2000 (2560 CUDA cores), and supporting up to a 100G Fiber Network, the AV600-D27 transcends intelligence and decision-making thresholds. Setting its sights on harnessing computing power to amplify battlefield strategies, the AV600-D27 guarantees high-bandwidth capability to handle intensive military edge workloads. It delivers ultra-fast, nearly instantaneous visual analysis for military workstations, encompassing AI-Targeting, target acquisition, and Network Visualization.
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Block Diagram
I. Ultra-High Performance Intel® Xeon® D Processor ICE LAKE-D HCC :
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Intel® Xeon® processor D-2700 product family offers hardware and software scalability up to sixteen cores, making it the perfect choice for a broad range of high-performing, low-power solutions that will bring intelligence and Intel® Xeon® reliability, availability, and serviceability (RAS) to the edge.
Enhanced performance per watt :
Intel® Xeon® processor D-2700 product family delivers exceptional value and unmatched performance density per watt. Up to 120W TDP , industry-leading 10 nm process technology and a compute-only design make it ideal for meeting the diverse needs of customers seeking mid-range low-power, high-density solutions.
II. NVIDIA Quadro RTXA2000 MXM
AV600-D27 supports 1 x NVIDIA Quadro RTXA2000 MXM Module; can power the planets most reliable mainstream workstations. Designed into a 80-watt package, RTXA2000 is powered by NVIDIA Ampere architecture, supplying innovative multi-precision performance to accelerate a vast range of modern applications. AV600-D27 w/ Quadro RTXA2000 GPU accelerates diverse cloud workloads. These include high-performance computing, data analytics, deep learning training and inference, graphics and machine learning. RTXA2000 MXM features multi-precision Turing Tensor Cores. It comes in a very compact MXM form factor, helping AV600-D27 deliver ground-breaking performance at scale.
- MIL-STD Environment
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- Operating Temperature High: 50°C, MIL-STD-810G, Method 501.5, Procedure I
- Operating Temp Low: 0°C, MIL-STD-810G, Method 502.5, Procedure I
- Non-Operating Temperature High: 70°C, MIL-STD-810G, Method 501.5, Procedure II
- Non-Operating Temperature Low: -40°C, MIL-STD-810G, Method 502.5, Procedure II
- Operating Altitude: Up to 15,000 ft., MIL-STD-810G, Method 500.5
- Non-Operating Altitude: Up to 45,000 ft., MIL-STD-810G, Method 500.5
- Humidity: MIL-STD-810G, Method 507.5, Procedure Ib (Natural Cycle B3)
- Shock: MIL-STD-810G, Method 516.6, 30 g’s, Saw-tooth, 11ms & MIL-DTL-901E, Grade A, Class II; Type B
- Vibration: MIL-STD-167, Type I, Deck Mounted Equipment
- EMI/EMC: MIL-STD-461, RE102 (Shipboard Level 1), CE102, RS103
- Power : MIL-STD-1275
Apperance
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System |
|
|---|---|
| Processor | Intel® Xeon® D-2796TE, 20core, 40 thread, 30MB Cache, 2.0/3.1GHz. Single socket FCBGA-2579 , up to 118W TDP |
| Memory type |
Up to 256GB ECC RDIMM DDR4-3200 MHz Up to 512GB LRDIMM DDR4-3200 MHz |
|
Chipset |
Intel® SoC Integrated |
|
GPU |
1x NVidia® RTX A2000, 2560 CUDA Cores |
|
Display |
VGA, Resolution up to 1920x1200@60Hz 32bpp |
|
Display Chipset |
Aspeed AST2510 |
| Ethernet Controller |
10G /25G SFP28 LAN from CPU ETH_KR Gigabit LAN via Intel®I210iT |
| LAN | 1 x 100 GBase SFP |
| Storage |
1 x M.2 NVMe 2TB M2. 2280 Gen4 x 4 SSD 2 x U.2 NVMe 8TB 2.5” SSD |
|
Power Type |
MIL-STD-461 / 1275 18V~36V DC Input |
|
Front I/O |
|
| DC-IN | 1 x DC-IN, with D38999 connector |
| X1 | 2 x RS232, with D38999 connector |
| X2 | 1 x 100GbE MPO SFP28, with D38999 connector ( Cable Kit MPO to 4 x 25G SFP28) |
| X3 | 1x MiniDP, with D38999 connector(Internal VGA to MiniDP) |
| X4 | 1 x USB3.0, with D38999 connector |
| LED | 1 x SSD/SSD LED indicator |
| Switch | 1 x IP65 power button , with LED indicator |
| SSD | 1 x 2.5" Easy swap SSD/HDD Tray |
| Physical | |
| Dimension | 250 mm x 400 mm x 122 mm (W x L x H) |
| Chassis | Aluminum Alloy |
| Heatsink | Heatsink Aluminum Alloy with air cooler, Corrosion Resistant |
| Operation System | |
| Operation System | Windows 10 / 11 64Bit, Linux by option |
| RoHS | RoHS Compliant |
| Environmental | |
| MIL-STD-810 Test |
Method 500.5, Procedures I and II (Altitude, Operation): 12,192 M, (40,000 ft) for the initial cabin altitude (18.8 Kpa or 2.73 Psia) Method 500.5, Procedures III and IV (Altitude, Non-Operation): 15,240, (50,000 ft) for the initial cabin altitude (14.9 Kpa or 2.16 Psia) Method 501.5, Procedure I (Storage/High Temperature) Method 501.5, Procedure II (Operation/High Temperature) Method 502.5, Procedure I (Storage/Low Temperature) Method 502.5, Procedure II (Operation/Low Temperature) Method 503.5, Procedure I (Temperature shock) Method 507.5, Procedure II (Temperature & Humidity) Method 509.7 Salt Spray (50±5)g/L Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 4,Vibration) Method 514.6, Vibration Category 20/Operating (Category 20 & 24,Vibration) Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock) Method 516.6, Shock-Procedure I Operating (Mechanical Shock) |
| Reliability |
Conduction Cooling. Designed & Manufactured using ISO 9001 Certified Quality Program |
| MIL-STD-461 |
CE102 basic curve, 10 kHz - 30 MHz RE102-4, (1.5 MHz) -30 MHz - 5 GHz RS103, 200 MHz - 3.2 GHz, 50 V/m equal for all frequencies EN 61000-4-2: Air discharge: 8 kV, Contact discharge: 6kV EN 61000-4-3: 10 V/m, EN 61000-4-4: Signal and DC-Net: 1 kV EN 61000-4-5: Leads vs. ground potential 1kV, Signal und DC-Net: 0.5 kV EN55022 : Class A |
| MIL-STD-1275 |
Steady State – 20V~33V Surge Low – 18V/500ms Surge High – 100V/500ms |
| Operating System | |
| Operating System | Windows 10 / 11 64Bit, Linux by option |
| RoHS | RoHS compliant |
