7SL-3500
3U VPX 3-Slot 2x GPU Conduction Cooled ATR System
- 3 Slot –3 Payload
- Intel i7-1185GRE
- NVIDIA MXM RTX A4500(5888 CUDA)
- 28V DC Input
- 300W Payload By Forced-Air Cooled
- 450W Payload By Liquid Cooled
- Design to Meet MIL-STD 810, MIL-S-901D
- Custom backplanes with VPX and SOSA aligned slot profiles
- Custom I/O options including MIL-STD Wiring & Connectors
- Hybrid Conduction Cooled
- Heat Exchanger Sidewalls
- Extreme Temperature -40°C to 60°C
- Technical Profile
- Specifications
- Introduction
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7SL-3500 3U-VPX
The 7SL-3500 VPX System is a modular Military Rugged ATR enclosure, geared for 3U OpenVPX designs. The versatile design allows multiple customizable configurations based on proven components and design techniques. 7SL-3500 Hybrid conduction cold plate assisted by forced air sets with aggregate power demands over 300W , assisted by liquid up to 450W.
Custom and standard 3 slot backplanes with VPX and SOSA aligned slot profiles in combinations supporting high speed signal processing applications.
Scalable to multi CPU-GPU requirementsDesigned expressly for Gen 4.0 ultra-high wattage military systems
7STARLAKE scalable and customizable, rugged VPX ATR System enables compute-intensive, SWaP constrained mission-critical applications for deployment in the world’s most demanding military and aerospace environments
- 7StarLake Advanced Thermal Solutions
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From ships at sea to high-altitude Drone, 7Starlake ATS solutions enable electronics survivability in the harshest environments. As an ever-increasing number of data acquisition methods are utilized in military and aerospace, the need to convert that rising data tide into precise, real-time action only escalates.
Applications like object targeting , ground vehicles tracking, thermal image monitoring, and multiple simultaneous sensors feeds. When a wealth of such sources need aggregation and immediate analysis, potentially with graphical visualization output to any number of displays, VPX-based systems can ensure proven solutions
- Conduction Cooled_7SL-3500CC
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Conduction cooled SBC have traditionally been deployed in applications where heat evacuation with an airflow is impractical.
- As the most common heat-transfer device available, heat pipes can manage the transfer of heat between two solid interfaces effectively. Combining the advantages of thermal-conductivity and phase transition, heat pipes are extremely light-weight compared with traditional cooling methods.,
- For the highest thermal dissipation and thermal density, heat pipes can be very effective in conduction cooled environments.
- The heat pipes are embedded in a symmetrical topology from the sidewall, allowing the assembly to be less sensible to gravity or acceleration
- This technique, not only improves thermal performance, but also helps to sustain a high level of shock and vibration by providing a rigid frame to attach the board at multiple points.
- Force Air Conduction Cooled_7SL-3500FA
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- 7SL-3500 Hybrid conduction cold plate assisted by forced air sets with aggregate power demands over 300W
- Internal recirculation fans ensure dry air is forced across conduction or air-cooled payload modules, minimizing hot-spots and dissipating heat homogeneously
- Liquid Cooled_7SL-3500LC
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Advanced conduction liquid cooling systems that enables higher powered, compact electronics in ruggedized military, aerospace applications.
7SL-3500-LC is a VPX-REDI Liquid-cooled enclosure utilizing side-wall cooling within the enhanced wedge-lock guide rails (increased 50% contact area) cooling of standard conduction Liquid Cooling Hardware Implementations. In order to effectively reduce overall temperature and prevent the leakage of the liquid, 7Starlake innovated a unique heat exchanger which integrating Conduction Liquid Cold Plate (C.L.C.P.) building in most advanced " Gun Drilled ", which with 4 pipes (each pipe 10mm x 10mm x 400mm) to dissipate max 1KW heat on the 3/4 ATR system
- Product Appearance
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System | |
---|---|
CPU |
Intel® i7-1185GRE processor (Tiger Lake) |
Memory type |
Up to 32 GB DDR4 Soldered |
GPU |
NVIDIA RTX A4500, 16GB GDDR6, 5,888 CUDA |
BIOS | Dual 256Mbit SPI flash |
Security | |
TPM | N/A |
Storage | |
SATA |
1 x SATA 6Gb/s |
M.2 |
1 x M.2 2242 on top side (M-key) |
Side I/O (D38999) | |
X1 |
1 x USB3.0 |
X2 |
1 x GbE |
X3 |
1 x USB 2.0 |
X4 |
1 x Mini DP |
DC-IN |
1 |
GND |
1 |
Power Button |
1 |
OS support list | |
OS |
Windows 10, Linux (kernel 5.4 and higher) |
Application | |
Application |
Military Platforms Requiring Compliance MIL-STD-810 Embedded Computing and applications subject to Harsh Temperture, Shock, Vibration, Atitude, Dust and EMI Conditions. |
Environment | |
Power Requirement |
18V~36V DC-IN |
Dimension |
190 x 496 x 269 mm (WxDxH) |
Weight |
23 KG |
Operating Temp. |
-40°C to 60°C |
Storage Temp. |
-40°C to 85°C |
Reliability |
Designed & Manufactured using ISO 9001 Certified Quality Program. |