AV710-X4-32G4S
Military Jetson AGX Orin IP65 Rugged Computer
- NVIDIA® Jetson AGX Orin 32GB/64GB LPDDR5 with 1792 CUDA and 56 Tensor Cores
- Support 2x 1GbE LAN, 1x USB3.0, 1x HDMI
- On board 64GB eMMC 5.1
- IP65 Classified
- Extended Temperature -20 to +55°C
- DC-IN 12V~32V
- 4CH 3G-SDI Input
- Dimension: 250 x 220 x 100mm (W x D x H)
- Technical Profile
- Specifications
- Order Information
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AV710-X4-32G4S is an ultra-small-form-factor (USFF) MIL-SPEC rugged edge compute solution. Designed using a Modular Open Systems Approach (MOSA) with a modular chassis and architecture design, integrating either the NVIDIA Jetson Orin AGX edge AI system on module (SOM), AV710-X4-32G4S provides the performance and flexibility demanded by emerging autonomous and uncrewed missions, in an ultra-compact and lightweight form factor. AV710-X4-32G4S is engineered to withstand austere environments and is SWaP-optimized for integration and deployment in highly space-constrained platforms.
NVIDIA® Jetson Orin™ AGX
Equipped with an NVIDIA Ampere architecture GPU featuring 1792 CUDA® and 56 Tensor Cores, the AV710-X4-32G4S, integrated with the NVIDIA Jetson Orin™ AGX module, delivers up to 200 TOPS of AI performance with power configurable between 15W and 60W. This gives you up to 8X the performance of Jetson AGX Xavier in the same compact form factor. Bring your next-gen products to life with the world’s most powerful AI computers for energy-efficient autonomous machines, plus high-speed interface support for multiple sensors, making them the ideal solution for a new age of robotics.
NVIDIA JetPack™ Support
Compatible with NVIDIA JetPack™ 5.0 and higher, the AV710-X4-32G4S enables users to harness a comprehensive library of tools for building top-tier inference models. This enhances application performance by accelerating graphics, data processing, and image classification functions which can be tailored to your specific needs.
Edge AI Platform
SFF & SWaP
Open Modular Architecture
MIL-STD 810 Rugged
Can integrate the NVIDIA Jetson Orin AGX (32GB or 64GB), delivering up to 275 TOPS of AI performance for next-gen autonomous and uncrewed mission-critical applications
Ultra-compact and lightweight, SWaP-optimized for integration and deployment in highly space-constrained vehicles. Orin NX and SMARC x86-based architecture/processor options. Robust IO and configuration options, including multiple USB 3.0, GbE, serial, display, video capture, GPS, GPIO. Engineered for austere environments. -40C to +55C operating temp, passive cooled. Fully sealed. MIL-STD-810H, MIL-STD-461G, MIL-STD-1275E/704F.
Block Diagram
Appearance
Dimensions
| System | |||
|---|---|---|---|
| AI Performance | 200 TOPS | ||
| CPU Module |
Ampere GPU + Arm Cortex-A78AE CPU + 32GB LPDDR5 + 64GB eMMC 5.1 |
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| GPU |
NVIDIA Ampere architecture with 1792 NVIDIA® CUDA® cores and 56 Tensor Cores, max freq. 930MHz |
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CPU |
8-core Arm® Cortex®-A78AE v8.2 64-bit CPU, 2MB L2 + 4MB L3, max freq. 2.2GHz |
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Memory |
32/64 GB 256-bit LPDDR5, 204.8 GB/s |
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Storage |
64GB eMMC 5.1 |
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| Expansion Slot |
2x M.2 2280 M key (PCIe x4) 1x M.2 3042/3052 B key 1x M.2 2030 E key 1x MIPI Camera connector(6 CSI camera support) 1x I2C 2x SPI 1x I2S 2x UART 1x CAN 1x SIM 4x CH 3G-SDI Input |
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Display |
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Display |
1x HDMI 2.0(max resolution 3840x2160) |
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Front I/O |
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| DC-IN 12V~32V | 1x Power in, with M12 waterproof connector | ||
| X1 | 1x 1GbE LAN , with M12 waterproof connector | ||
| X2 | 1x 10GbE LAN, with M12 waterproof connector (Options) | ||
| X3 | 1x USB 3.0, with M20 waterproof connector | ||
| X4 | 1x HDMI, with M20/D38999 waterproof connector | ||
| BNC | 4x Channel 3G-SDI | ||
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Rear I/O |
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| Grounding |
1x Screw termaial for grounding. |
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| Debug Access Panel | 1x Reset Button | ||
| 1x Recover Button | |||
| 1x USB type-C for Debug | |||
| 1x USB Type-C for Recovery | |||
| 1x Reboot LED | |||
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Operating System |
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OS |
NVIDIA Jetpack™ 5.X (5.02/5.1) |
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| Physical | |||
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Dimension |
250 (W) x 220 (D) x 100 (H) mm |
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Weight |
3.3Kg |
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Environmental |
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| Operating Temp. | -20 to 55°C | ||
| Storage Temp. | -40 to 85°C | ||
| Relative Humidity | 5% to 95%, non-condensing | ||
| MIL-STD-810 | Method 507.5, Procedure II ( Temperature & Humidity ) Method 516.6 Shock-Procedure V Non-Operating ( Mechanical Shock ) Method 516.6 Shock-Procedure I Operating ( Mechanical Shock ) Method 514.6 Vibration Category 24/Non-Operating ( Category 20 & 24, Vibration ) Method 514.6 Vibration Category 20/Operating ( Category 20 & 24, Vibration ) Method 501.5, Procedure I ( Storage/High Temperature ) Method 501.5, Procedure II ( Operation/High Temperature ) Method 502.5, Procedure I ( Storage/Low Temperature ) Method 502.5, Procedure II ( Operation/Low Temperature ) Method 503.5, Procedure I ( Temperature shock ) |
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| Reliability | No Moving Parts; Passive Cooling. Designed & Manufactured using ISO 9001 / 2000 Certified Quality Program. |
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