AV600-TH-A20H
Military IP66 Mission GPU Computer
- MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
- IP66 Chassis with D38999 connectors
- Intel® 11th Gen. Tiger Lake(H) W-11865MLE Processors, up to 8 cores
- 64GB DDR4 SO-DIMM ECC or non ECC support
- NVIDIA RTX™ A2000 MXM 8GB GDDR6 2560 CUDA cores
- 2.5” SATA SSD
- 1x 3G-SDI Capture Card (Options)
- MIL-STD-461 18V~36V DC-Input
- Extreme Temperature: -20°C to +60°C degree
Special Request :
- Frame Grabber Card: 4CH 3G-SDI
- Discrete IO : 4 x DI + 4 x DO
- 10GbE : Dual 10GbE (Intel X710) Ethernet Ports
- Dual Redundant MIL-STD-1553 connections
- Dual ARINC 429 input connections
- Conformal coating on electronics
- Technical Profile
- Specifications
- Order Information
- Thermal Solution
- Download
- Introduction
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AV600-TH-A20-PA1 is driven by Intel® 11 Gen. Tiger Lake-H Processors, integrated Intel® UHD Graphics (Xe architecture). Tiger Lake H processor is built on 10nm SuperFin Technology, up to 8 CPU cores and 4.5 GHz frequency. It is high computing performance and flexibility for heavier IoT workloads, the platform posts significant performance gains gen-over-gen with up to 32 percent gain in single-thread performance. It also features in high-bandwidth, high speed I/Os for expansion and peripherals.
AV600TH-A20-PA1 highlights on its rugged design and high functionality, the system especially installed MIL-STD Amphenol type connector and full IP66 protection allow system withstand in any kind of harsh environment. AV600TH-A20-PA1 supports extended temperature from -40°C to 70°C and MIL-STD-461 18V~36V DC-input Power supply which can protect system from damages caused by sudden surge of voltage, thus further secure the reliability of its critical components and the system itself.
- ARINC 429
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ARINC 429 is the worldwide standard for data transmission in aircraft electronics. It is adopted mostly for commercial aircraft and transport aircraft network protocol standard. Communications, guidance, altitude, altitude reference, flight management, and more are all needed to work together to accomplish a successful flight. The physical connection wires are twisted pairs carrying balanced differential signaling.
The ARINC 429 unit of transmission is a fixed-length 32-bit frame, which the standard refers to as a 'word'. The bits within an ARINC 429 word are serially identified from Bit Number 1 to Bit Number or simply Bit 1 to Bit 32.
- System Diagram
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4CH 3G-SDI(Option )
- Appearance
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System |
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CPU |
Intel® 11th Gen. Tiger Lake-H Processors, up to 8 cores, integrated Intel® UHD Graphics Intel® Xeon® W-11865MLE, 25W Tiger Lake 11th Gen, 8C, Freq. 1.5/4.5 GHz, 24MB cache |
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Memory type |
DDR4 SO-DIMM Up to 96GB, non-ECC and ECC |
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CHIPSET |
Intel® RM590E (support ECC, with Xeon CPU) /QM580E |
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GPU |
NVIDIA RTX™ A1000/A2000 4GB/8GB GDDR6 memory, 2048/2560 CUDA cores |
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Expansion Slot |
2 x Full-size mini PCIe (1 with mSATA supported) 1 with mSATA/USB2.0/PCIeX1 support 1 with SIM/USB2.0/PCIeX1 support 1 x 2280 M key (SATA only) |
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Storage |
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SATA |
1 x 2.5” SSD, Hot Swappable SSD/HDD slot |
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M.2 |
1 x 2280 M key (SATA only) |
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Ethernet |
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Ethernet (Internal) |
2 x 10/100/1000 Ethernet Ports |
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Front I/O |
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X1 |
2 x GbE LAN + 2 x USB2.0 + 1 x COM(RS232) with D38999 connector |
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X2 |
1 x VGA+ 4 x DI/4 x DO +3 x RS422, with D38999 connector |
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X3 |
1 x USB3.0, with D38999 connector |
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X4 |
1 x USB3.0, with D38999 connector |
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X5 |
1 x DC-in, with D38999 connector |
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LED |
1 x SSD/HDD LED indicator |
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switch |
1 x IP65 power button, with LED indicator |
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SSD |
2 x 2.5”Easy swap SSD Tray |
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Power |
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Power input |
MIL-STD -461 18V~36V DC-Input |
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Application, Operating System |
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Application | Military Platforms Requiring Compliance to MIL-STD-810 Where Harsh Temperature, Shock, Vibration, Altitude, Dust and MIL-461 EMI Conditions. | |||
Operating System | Windows® 10 64-bit / Linux (support by request) | |||
Physical |
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Dimension |
250 x 325 x 100 mm (LxWxH) |
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Weight |
11 KG |
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Chassis |
Aluminum Alloy |
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Heatsink |
Heatsink Aluminum Alloy, Corrosion Resistant |
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Environmental |
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Green Product |
RoHS, WEEE compliance |
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Operating Temp. |
-20°C to +60°C |
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Storage Temp. |
-40°C to +85°C |
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Relative Humidity |
5% to 95%, non-condensing |
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MIL-STD-810 | Method 507.5, Procedure II ( Temperature & Humidity ) Method 516.6 Shock-Procedure V Non-Operating ( Mechanical Shock ) Method 516.6 Shock-Procedure I Operating ( Mechanical Shock ) Method 514.6 Vibration Category 24/Non-Operating ( Category 20 & 24, Vibration ) Method 514.6 Vibration Category 20/Operating ( Category 20 & 24, Vibration ) Method 501.5, Procedure I ( Storage/High Temperature ) Method 501.5, Procedure II ( Operation/High Temperature ) Method 502.5, Procedure I ( Storage/Low Temperature ) Method 502.5, Procedure II ( Operation/Low Temperature ) Method 503.5, Procedure I ( Temperature shock ) |
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Reliability | No Moving Parts; Passive Cooling. Designed & Manufactured using ISO 9001 / 2000 Certified Quality Program. |
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MIL-STD-461 | CE102 : 10 KHz - 10 MHz RE102-4 : 1.5 MHz -30 MHz - 5 GHz RS103 : 200 MHz - 3.0 GHz - 5.0 GHz, 50 V/m equal for all frequencies |
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Designed to Meet Items ( Options ) | ||||
CS101, CS114, CS115, CS116 | ||||
CE106, RE103, RS101 | ||||
MIL-STD-1275 | Steady State | 20V-33V | ||
Surge Low | 18V/500ms | |||
Surge High | 100V/500ms |
- Order Information
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Model Name
Description
AV600TH-A10
Intel® 11th Gen. Tiger Lake(H) W-11865MLE, RTX A1000 MXM, 1x 2.5” SATA SSD Easy Swap Tray, 18V-36V DC-IN, support MIL-STD-461, MIL-STD-810. with MIL-DTL-D38999 Connectors, Operating Temp. -40 to +60°C
AV600TH-A20-PA1
Intel® 11th Gen. Tiger Lake(H) W-11865MLE, RTX A2000 MXM, 1x 2.5” SATA SSD Easy Swap Tray, 1x 3D-SDI Capture Card, 18V-36V DC-IN, support MIL-STD-461, MIL-STD-810. with MIL-DTL-D38999 Connectors, Operating Temp. -40 to +60°C
Attachment | Size |
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7StarLake_MIL-STD-461G_Test Report-CE102,RE102,RS103_AV600_1.pdf (3.89 MB) | 3.89 MB |
AV600 MIL-810 514.6 Operation_0.pdf (1.4 MB) | 1.4 MB |
AV600 MIL-810 514.6 None-Operation_0.pdf (1.38 MB) | 1.38 MB |