SK513-T6CH
Mezzanine COM Express Type 6 Carrier Board with MXM , PCI/104 Express Expansion
- COM Express Type 6 Support Intel® 9th Coffee Lake-H Processor
- MXM Type 3.1 Support NVIDIA® Quadro ® and GeForce® GPUs
- GPU Support Up to MXM RTX 5000 Ada (9728 CUDA, 16GB RAM)
- PCI/104 Express Expansion Slot for Modular Open Structure
- Multi-Expansion Slots include Dual Mini PCIe Express Slots, 1x M.2 Slot
- Extreme Temperature Support -40°C to 85°C
- 2x DP, 1x LVDS, 4x COM, 6x USB, 2x miniPCIe, 1x M.2, 2x SATA
- 9V~36V DC-IN
- Technical Profile
- Specifications
- Download
- Introduction
-
Computer-On-Module (COM) is a highly integrated board with CPU, chipset, memory, and peripherals designed into a component module. COM Express Type 6 has become the most versatile and most scalable COM standard supporting everything from small-scaled and cost-sensitive applications up to high-end computing and graphics-intensive solutions.
7StarLake’s SK513-T6CH COM Express defines Open Scalable Modular Architecture and pin-out Type 6 platform which is ensuring amazing computing performance and offering a broad range of I/O interfaces including intense graphics support, Digital Display Interfaces (Display Port, HDMI) and super-fast USB 3.0 to serve all kind of different application requirements.
SK513-T6CH features a range of Intel processors, including Intel 9th Coffee Lake-H. From low power consumption to high performance processing power, SK513-T6CH is built to suit a wide range of computing applications from signal processing to unmanned vehicles.
Additionally, SK513-T6CH is purposely designed to supported wide range temperature from -40°C to 85°C, which is perfectly suitable for withstanding harsh environmental conditions in military, aerospace, and transportation industry.
- Rich Expansion Slot
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SK513-T6CH provides rich expansion to make the whole solutions easier. We could use PCIe 104 related product SK506, SK303 , SK1050 and SK1660：
SK506/SK506P:
StackPC-FPE form factor - PCIe/104 stackable bus structure - Reliable Ethernet technology from Intel i350-AM4 controllers - Total 6 independent LAN connections (2 from host board, 4 from Intel controllers) - Flexible options for Ethernets through RJ45 or 10 pin-headers - High-performing bridgeless design supporting PCI Express Gen 2.1 5GT/s - Extended temperature -40°C to 85°C
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SK401:
- StackPC form factor -
- PCIe/104 stackable bus structure -
- Reserve PCI/104 connector for different stacking criteria -
- Extended temperature -40°C to 85°C
- PCI/104-Express, PCI & PCIe connectors (w/StackPC design)
- PCIe/104 stackable bus structure -
- PCIe to PCI adapter function -
- COM: 4 x RS232/422/485 with 5V/12V selectable and isolation function -
- Extended Temp.: -40°C to 85°C
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NVIDIA® Quadro® RTX5000 MXM 3.1 Graphics Module:
- Powered by NVIDIA® Quadro® RTX5000
- MXM 3.1Type-B Module
- 256-bit, 16GB GDDR6 Memory
- 3072 CUDA cores, 48 RT cores, and 384 Tensor cores
- 9.4 TFLOPS peak FP32 performance
- Support up to 4 DP 1.4b displays, 110W TGP
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NVIDIA® Quadro® RTX3000 MXM 3.1 Graphics Module:
- Powered by NVIDIA® Quadro® RTX3000
- MXM 3.1Type-B Module
- 192-bit, 6GB GDDR6 Memory
- 1920 CUDA cores, 30 RT cores, and 240 Tensor cores
- 5.3 TFLOPS peak FP performance
- Support up to 4 DP 1.4a displays, 80W TGP
NVIDIA® GTX 1050 Ti(CUDA Cores: 768)/GTX1060 (CUDA Cores: 1280) GPU. Designed for Driverless Vehicle
- Intel® 7th Gen. Core i7-7820EQ
- 2 x DDR4 SO-DIMM up to 32GB
- MXM Graphic Card support
- 2 x RJ45 LAN, 6 x USB
- 2 x 2.5" Easy swap SSD/HDD Tray
- 2 x I/O Expansion Design
- Extended Temperature -20°C to 60°C
- NVIDIA® GTX950M (CUDA Cores: 640)/GTX1050(CUDA Cores: 640)/GTX 1050 Ti(CUDA Cores: 768)/GTX1060 (CUDA Cores: 1280) GPU
1.5 U Fanless Rugged GPU Server Intel® Xeon® D Processor, MXM Graphic Card, 9~36V DC-IN, Operating Temp -20°C to 50°C.
NVIDIA® GTX950M (CUDA Cores: 640)/GTX1050(CUDA Cores: 640)/GTX 1050 Ti(CUDA Cores: 768)/GTX1060 (CUDA Cores: 1280) GPU- MIL-STD 810G Compliance
- Intel® Xeon® D-1548 Processor
- 2 x DDR4 SO-DIMM up to 32GB RAM
- MXM Graphic Card support
- 4 x Intel® Gigabit Ethernet
- 2 x CAN bus
- 4 x USB, 1 x COM
- 9~36V DC-IN
- Operating Temp. -20°C to 50°C
- NVIDIA® GTX 1050 Ti(CUDA 768 GDDR5-4GB) / GTX1650 (CUDA 896 GDDR5-4GB) / GTX1660 Super (CUDA 1408 GDDR6-6GB)
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| System | |
|---|---|
|
COM Express CPU Options(Type6) |
Intel® Xeon® E-2276ME, 45W Coffee Lake 9th Gen, 6C , Freq. 2.8 /4.5 GHz, 12MB cache Intel® Xeon® E-2276ML, 25W Coffee Lake 9th Gen, 6C , Freq. 2.0 / 4.2 GHz, 12MB cache Intel® Core™ i7-9850HE, 45W Coffee Lake 9th Gen, 6C, Freq. 2.7 / 4.4 GHz, 9MB cache Intel® Core™ i7-9850HL, 25W Coffee Lake 9th Gen, 6C, Freq. 1.9 / 4.1 GHz, 9MB cache |
| GPU Module Options |
NVIDIA® GeForce™ GTX 1050Ti, 60W, 4GB GDDR5, 768 CUDA Cores |
| COM Express Compatibility | COM Express® Type 6 |
| Expansion | |
|
MiniPCIe Expansion |
2x Full-size mini PCIe (1 with mSATA supported) |
|
M.2 Expansion |
1x 2280 M-key (SATA only) |
| PCIe/104 Expansion | 4x PCIe x1、1x PCIe x4、5x USB2.0、1x LPC、1x SPI |
| SATAIII | 2x SATAIII |
| Display | |
|
Display Port |
2 x Display Port outputs from COM Express® , 4 x outputs from GPU, 6 total |
|
VGA |
1x output from COM Express® , 1x output from GPU |
|
LVDS |
1x dual channel 18/24-bit LVDS |
| DVI | 1x |
| Ethernet | |
|
Gigabit Ethernet |
2x 10/100/1000 Ethernet Ports |
| I/O | |
|
USB |
4x USB3.0; 2x USB2.0 |
|
COM Port |
4x RS232/422/485 |
|
Audio |
1x Line-out, 1x MIC-In |
| Power System | |
|
Input Power_SYS |
9V~36V (4P Terminal Block) |
|
Input Power_MXM |
12V (ATX 4P) |
|
Power Consumption |
Varies per COM Express /MXM with different CPU and GPU models |
|
RTC Battery |
3V CR2032 |
| Mechanical and Environment | |
|
Dimensions |
190 x 185 mm |
|
Operating Temperature |
-40 to 85°C |
|
Storage Temperature |
-40 to 85°C |
|
Relative Humidity |
10% to 90%, non-condensing |
| Standard Compliance | |
| Standard Compliance | CE/FCC |
| OS | |
| OS Support |
Windows®10 64-bit Linux(Support by request) |
| Attachment | Size |
|---|---|
| SK513_COMe CPU Board_MXM GPU 3D PDF.pdf (5.68 MB) | 5.68 MB |