Name: F1-30Q28
Availability: InStock

F1-30Q28

F1-30Q28 100G Airborne Mission Computer

IP66 3/4ATR Mission Computer
NVIDIA^® 5000 Ada GPU, 9728 CUDA Cores
Intel^® Tiger Lake Xeon W-11865MRE Processor, 8C cores, 24MB cache.
Intel^® Ice Lake Xeon® D-1700 processor, Up to 10 cores, 15MB cache
Up to 128GB DDR4 support
100GbE Single-Port QSFP28, Nvidia ConnectX-6
MIL-STD 810 Vibration, Shock, Humility , Temperature
MIL-STD 461 EMI DC-DC 18V~36V
Options for Dual Redundant MIL-STD-1553 connection

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Technical Profile
Specifications
Order Information

Introduction: The purpose of PCIe/104 is to provide a System level Stack-Up Only approach. Specification adopts PCI-Express, Ethernet, SATA, USB as well as LPC, SPI, Field Buses and Common Power Connector to the any stacked architecture.

StackPC Specification defines StackPC, FPE, StackPWR connectors relative position and stacked systems organization common approach. Also specification describes using stack modules in COM applications.

One of the solutions can be to aggregate the main set of input/output interfaces at the stack connectors. This allows to avoid some interface connectors (usually pin headers) and to provide more space on the module for placement of necessary components. This, in turn, leads to reduction of manufacturing cost and adds flexibility in terms of using the module in applications requiring limited functionality. Reducing cabling inside the enclosure improves convection, reduces magnetic noise pickup, and consequently, increases system effectiveness. Interfaces aggregated at the stack connectors can be led out of the enclosure using inexpensive and efficient solution – terminal interface module carrying the necessary set of standard interface connectors.

One of rather important requirements to the new specification is compatibility with family of PC/104 standards. The support for existing and field proven PC/104, PC/104-Plus, PCI/104, PCIe/104 and PCI/104-Express modules is provided. Details about compatibility between StackPC and PC/104 standards can be found in Appendix B.

Structure

StackPC construction example:
SK516: Multi-I/O interface
NIC QSFP28 100GbE
SK231: Nvdia MXM A2000/A4500
Storage: 1x 2.5” SATAIII SSD
COMe T6: Intel Xeon W-11865MRE
COMe T7: Intel Xeon D-1746TER
Memory Up to 128GB SO-DIMM
9V-36V DC-IN

Main Feature

system block diagram

Xeon D-1700 performance: The scalability of the new platform ranges from 2 to 10 (D-1700) cores or 20 (D-2700) cores, with TDPs of 25-90 watts and 65-129 watts, respectively.

Depending on the model, it supports an extended temperature range (up to -40 ° C). Both models come with BGA packaging, but the sizes are slightly larger, measuring 45 ·× 45 mm and 45 ·× 52.5 mm respectively.

The difference is not over yet. The lower Xeon D-1700 is limited to three DDR4-2933 channels, while the D-2700 is limited to four full DDR4-3200 channels.

PCIe/104 & StackPC Peripherals

SK210-GT730M

StackPC and PCIe/104 Complaint Utilizes PCIe x 8 and x 4 Link NVIDIA CUDA technology OpenGL 4.4 support OCL 1.1 support NVIDIA Adaptive Vertical Sync Microsoft DirectX 11 support

SK220

StackPC-FPE form factor Utilizes PCIe x16 and PCIe x4, x1 link MXM 3.0 and 3.1 graphic card support Type A and Type B MXM graphic card and support Operating Temp: -40°C ~ 85°C

SK303

PCI/104-Express, PCI & PCIe connectors (w/StackPC design) PCIe/104 stackable bus structure PCIe to PCI adapter function COM: 4 x RS232/422/485 with 5V/12V selectable and isolation function Extended Temp.: -40°C ~ 85°C

SK401

StackPC form factor PCIe/104 stackable bus structure Supports 1 x 2.5” SSD Supports 2 x mSATA SSD slot, compatible with JEDEC MO-300B SATAII interface supports 1.5Gbps/3.0Gbps Reserve PCI/104 connector for different stacking criteria Extended temperature -40 to 85°C

SK506

StackPC-FPE form factor PCIe/104 stackable bus structure Reliable Ethernet technology from Intel i350-AM4 controllers total 6 independent LAN connections (2 from host board, 4 from Intel controllers) Flexible options for Ethernets through RJ45 or 10 pin-headers High-performing bridgeless design supporting PCI Express Gen 2.1 5GT/s Extended temperature -40 to 85°C

SK231

A PCIe/104(StackPC) carrier module is designed to offer up to 4 independent displays by MXM interface under extended temperature from -40°C ~ 85°C. SK231 is equipped with 4 x mini DP, 1 x VGA (2 x 5 pin header) which can support GPU up to NVIDIA Quadro RTX A4500 / A2000. SK231 Directly output PCIe x 16 signal for multi-graphic processors demand applications.

System
High Power Processor	Intel® Intel® Xeon® W Processor •Xeon® W-11865MRE 2.1/4.7GHz, 24MB, 45W, 8C Intel® Xeon® D-1700 processor (Ice Lake-D LCC) •Xeon® D-1746TER 2.0/3.1GHz, 15MB, 67W, 10C
Memory type	Support up to DDR4-128GB ,ECC for Xeon SKU
GPU	NVIDIA® Quadro® 5000Ada, 115W, 16GB GDDR6, 9728 CUDA Cores NVIDIA® Quadro® MXM A4500, 80/115W, 16GB GDDR6, 5888 CUDA Cores NVIDIA® Quadro® 3500Ada, 115W, 12GB GDDR6, 5120 CUDA Cores NVIDIA® Quadro® MXM A2000, 60W, 8GB GDDR6, 2560 CUDA Cores
BIOS	AMI UEFI BIOS
Display
Display Port	2x Display Port outputs from CPU module
Storage
SSD	1x 2.5" SATA III (up to 6Gb/s)
M.2	1x M.2 M-Key 2280 PCIe x4
Ethernet
Ethernet	Intel® I226-LM GbE LAN (10/100/1000Mbit /2.5G) Ethernet ports
Ethernet	GbE LAN from CPU module
Front I/O
X1	1xUSB3.0 with M20/D38999 connector
X2	1x mDP with M20/D38999 connector
X3	1x mDP with M20/D38999 connector
X4	1x 100G with MPO connector
X5	1x 1GbE LAN with D38999 connector
X6	1x DC-IN with D38999 connector
Power Requirement
Power Input	9V~36V DC-IN
Power Management	ACPI 3.0
Applications, Operating System
Applications	Energy/Smart Grid/Power Plant Management, Intelligent Automation and manufacturing applications
Operating System	Based on CPU module
Mechanical and Environmental
Form Factor	Proprietary
Dimension	190.5mm x 250mm x 325mm
Operating Temp.	-40℃ ~ 85℃
Storage Temp.	-40℃ ~ 85℃