7SL-3500
3U VPX 5-Slot 2xGPU Conduction Cooled ATR System
- 5 Slots –3 Payloads plus 2 Peripherals
- Intel® 11th Tiger Lake W-11865MRE
- NVIDIA MXM RTX 2x A4500(5888 CUDA)
- 1xUSB 3.0, 2xUSB 2.0, 1xLAN, 1xDP (Options for DVI)
- 300W Payload By Forced-Air Cooled
- 600W Payload By Liquid Cooled
- Design to Meet MIL-STD 810, MIL-STD 461/1275
- Custom backplanes with VPX and SOSA aligned slot profiles
- Custom I/O options including MIL-STD Wiring & Connectors
- Hybrid Conduction Cooled & Heat Exchanger Sidewalls
- Extreme Temperature -40°C to 60°C
- Technical Profile
- Specifications
- Order Information
- Introduction
-
7SL-3500 3U-VPX
The 7SL-3500 VPX System is a modular Military Rugged ATR enclosure, geared for 3U OpenVPX designs. The versatile design allows multiple customizable configurations based on proven components and design techniques. 7SL-3500 Hybrid conduction cold plate assisted by forced air sets with aggregate power demands over 300W , assisted by liquid up to 600W. Custom and standard 5 to 6-slot backplanes with VPX and SOSA aligned slot profiles in combinations supporting high speed signal processing applications. Scalable to multi CPU-GPU-FPGA requirements Designed expressly for Gen 4.0 ultra-high wattage military systems.
7StarLake scalable and customizable, rugged VPX ATR System enables compute-intensive, SWaP constrained mission-critical applications for deployment in the world’s most demanding military and aerospace environments.
- 7StarLake Advanced Thermal Solutions
-
From ships at sea to high-altitude Drone, 7StarLake ATS solutions enable
electronics survivability in the harshest environments. As an ever-increasing number of data acquisition methods are utilized in military and aerospace, the need to convert that rising data tide into precise, real-time action only escalates.
Applications like object targeting , ground vehicles tracking, thermal image monitoring, and multiple simultaneous sensors feeds. When a wealth of such sources need aggregation and immediate analysis, potentially with graphical visualization output to any number of displays, VPX-based systems can ensure proven solutions.
- Conduction Cooled_7SL-3500CC
Conduction cooled SBC have traditionally been deployed in applications where heat evacuation with an airflow is impractical.
- As the most common heat-transfer device available, heat pipes can manage the transfer of heat between two solid interfaces effectively. Combining the advantages of thermal-conductivity and phase transition, heat pipes are extremely light-weight compared with traditional cooling methods.
- For the highest thermal dissipation and thermal density, heat pipes can be very effective in conduction cooled environments.
- The heat pipes are embedded in a symmetrical topology from the sidewall, allowing the assembly to be less sensible to gravity or acceleration.
- Force Air Conduction Cooled_7SL-3500FA
-
- 7SL-3500 Hybrid conduction cold plate assisted by forced air sets with aggregate power demands over 300W
- Internal recirculation fans ensure dry air is forced across conduction or air-cooled payload modules, minimizing hot-spots and dissipating heat homogeneously
- Liquid Cooled_7SL-3500LC
-
Advanced conduction liquid cooling systems that enables higher powered, compact electronics in ruggedized military, aerospace applications.
7SL-3500-LC is a VPX-REDI Liquid-cooled enclosure utilizing
side-wall cooling within the enhanced wedge-lock guide rails
(increased 50% contact area) cooling of standard conduction
Liquid Cooling Hardware Implementations. In order to effectively
reduce overall temperature and prevent the leakage of the liquid,
7StarLake innovated a unique heat exchanger which integrating
Conduction Liquid Cold Plate (C.L.C.P.) building in most advanced
" Gun Drilled ", which with 4 pipes (each pipe 10mm x 10mm x
400mm) to dissipate max 1KW heat on the 3/4 ATR system.
- Product Appearance
| System | |
|---|---|
|
CPU |
Intel® Xeon® W-11865MRE processor (formerly Tiger Lake-H) Up to 8 cores (TDP 45W) |
|
Memory type |
Up to 64 GB DDR4-2666 soldered with ECC |
|
GPU |
Option 1 : NVIDIA RTX A4500, 16GB GDDR6, 5,888 CUDA Option 2 : NVIDIA RTX 5000, 16GB GDDR6, 3,072 CUDA |
| BIOS | Dual 256Mbit SPI flash |
| Security | |
| TPM | Discrete TPM 2.0 chip |
| Storage | |
|
SATA |
1 x SATA 6Gb/s |
|
M.2 |
1 x M.2 2242 on top side (M-key) |
| Side I/O (D38999) | |
|
X1 |
1 x USB3.0 |
|
X3/X4 |
2 x GbE |
|
X5 |
1 x Mini DP |
|
X6 |
1 x DC-IN |
|
BNC |
4 x SDI Input (Options) |
|
Secure |
1 x AES KEY (Options) |
|
CMOS |
1 (Options) |
|
GND |
1 |
|
Power Button |
1 |
| OS support list | |
|
OS |
Windows 10, Linux (kernel 5.4 and higher) |
| Application | |
|
Application |
Military Platforms Requiring Compliance MIL-STD-810 Embedded Computing and applications subject to Harsh Temperture, Shock, Vibration, Atitude, Dust and EMI Conditions. |
| Environment | |
|
Power Requirement |
18V~36V DC-IN |
|
Dimension |
192.9 x 389.5 x 269 mm |
|
Weight |
17 KG |
|
Operating Temp. |
-40°C to 60°C |
|
Storage Temp. |
-40°C to 85°C |
|
MIL-STD-810 Test |
Method 500.5, Procedures I and II (Altitude, Operation): 12,192M, (40,000 ft) for the initial cabin altitude (18.8Kpa or 2.73 Psia) Method 500.5, Procedures III and IV (Altitude, Non-Operation): 15,240, (50,000 ft) for the initial cabin altitude (14.9Kpa or 2.16 Psia) Method 501.5, Procedure I (Storage/High Temperature) Method 501.5, Procedure II (Operation/High Temperature) Method 502.5, Procedure I (Storage/Low Temperature) Method 502.5, Procedure II (Operation/Low Temperature) Method 503.5, Procedure I (Temperature shock) Method 507.5, Procedure II (Temperature & Humidity) Method 509.7 Salt Spray (50±5)g/L Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 24,Vibration) Method 514.6, Vibration Category 20/Operating (Category 20 & 24,Vibration) Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock) Method 516.6, Shock-Procedure I Operating (Mechanical Shock) |
|
Reliability
|
No Moving Parts; Passive Cooling. Designed & Manufactured using ISO 9001 Certified Quality Program. |
| Safety & EMC | |
| EMC |
EN 61000-4-2: Air discharge: 8 kV, Contact discharge: 6kV EN 61000-4-3: 10V/m EN 61000-4-4: Signal and DC-Net: 1 kV EN 61000-4-5: Leads vs. ground potential 1kV, Signal und DC-Net: 0.5 kV |
| MIL-STD-461 |
CE102 basic curve, 10kHz - 30 MHz RE102-4, (1.5 MHz) -30 MHz - 5 GHz RS103, 200 MHz - 3.2 GHz, 50 V/m equal for all frequencies |
| MIL-STD-1275 |
Steady State – 20V~33V, Surge Low – 18V/500ms, Surge High – 100V/500ms Emitted spikes Injected Voltage surges Emitted voltage surges Voltage ripple (2V) Voltage spikes Starting Operation Reverse polarity |
