CPU

Ampere^® Altra^® Q64-22 SoC, 64cores, 2.2 GHz

Memory type

16x DIMM sockets with individual memory channels
Up to 4TB  (16 x 256 GB) DDR4 RDIMM memory, up to 3200 MT/s

Graphics Card

RTX MXM A 500 (2048 CUDA Cores)

SSD

TBD

Ethernet

2x 1 Gigabit Ethernet with RJ45
2 x 10G SFP+

GLAN

2 

10 GbE SFP+

2

COM

5

USB3.0

3

VGA

1

DC-IN

1

Power Requirement

1 x Power Button with LED backlight

OS

Linux RedHat ,Ubuntu

Power Requirement

28V DC IN (18V 36V)

Dimension

TBD

Weight

10 KG

Operating Temp.

0 C to 60°C

Storage Temp.

-40°C to 85°C

Relative Humidity

5% to 95%, non condensing

MIL-STD-810 Test

Method 500.5, Procedures I and II (Altitude, Operation):
12,192M, (40,000 ft) for the initial cabin altitude (18.8Kpa or 2.73 Psia)
Method 500.5, Procedures III and IV (Altitude, Non-Operation):
15,240, (50,000 ft) for the initial cabin altitude (14.9Kpa or 2.16 Psia)
Method 501.5, Procedure I (Storage/High Temperature)
Method 501.5, Procedure II (Operation/High Temperature)
Method 502.5, Procedure I (Storage/Low Temperature)
Method 502.5, Procedure II (Operation/Low Temperature)
Method 503.5, Procedure I (Temperature shock)
Method 507.5, Procedure II (Temperature & Humidity)
Method 509.7 Salt Spray (50±5)g/L
Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 24,Vibration)
Method 514.6, Vibration Category 20/Operating (Category 20 & 24,Vibration)
Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock)
Method 516.6, Shock-Procedure I Operating (Mechanical Shock)

Reliability

Conduction Cooling.
Designed & Manufactured using ISO 9001 Certified Quality Program.

EMC

EN 61000-4-2: Air discharge: 8 kV, Contact discharge: 6kV
EN 61000-4-3: 10V/m
EN 61000-4-4: Signal and DC-Net: 1 kV
EN 61000-4-5: Leads vs. ground potential 1kV, Signal und DC-Net: 0.5 kV