Video Frame Grabber Computer - Joint Battle Command Platform (JBC-P) , MIL-STD 810 Fanless Rugged System with Intel® Core™ i7-4700EQ Haswell Processor, IP65 protection, M12-Type Connectors, 18V to 36V DC-in, Wide Temp. -40°C to 70°C
- Intel® Core™ i7-4700EQ (2.4 GHz, up to 3.4 GHz,4-cores，8 threads)
- DDR3 XR-DIMM up to 8GB memory
- Onboard SATAIII NAND Drive up to 64GB
- 2 x mPCIe expansion slot (one co-lay with mSATA)
- M12 Connectors applied
- Full IP65 Classified
- MIL-STD 810G
- MIL-STD 461 18V~36V
- Extended operating temperature. -40°C to 70°C
- Technical Profile
- Thermal Solution
SR700, EBX rugged system is a powerful system driven by Intel® 4th generation Haswell CPU and chipset soldering onboard. Processor i7-4700EQ plus Intel® QM87 chipset supports clock speed 2.4 GHz, up to 3.4 GHz. Quad cores, turbo up to 8 cores to cope with enormous data computing. SR700 highlights on its extreme rugged design, high functionality, and specially installed MIL-STD M12 connectors. Full IP65 protection is guaranteed. What's even more impressive is the fact that SR700 can withstand vibration up to 10 Grms and shock up to 75G. It supports extended temperature operation from -40 to 70℃. MIL-STD 461 18V~36V DC input design can protect system from damages caused by sudden surge of voltage, thus further secure the reliability of its critical components and the system itself. SR700 is the perfect solution to military purposes, such as defense, marine navigation and aviation technology. It also can withstand and survive in the harshest surroundings. Even in fields like mining and offshore drilling, SR700 can provide equally stunning performance.
- Frame Grabber Card (Analog to Digital / PAL )
Frame grabbers may be used in military applications. For instance, when a potential breach of abnormal signal is detected, a frame grabber captures an image or a sequence of images in digital form, and then transmits the data to pilots or command control center. SR700 support frame grabber cards expansion to be better process data promptly to meet front line needs, to collect useful images and help pilots to react promptly on the ever-changing battlefield.
Digital HD-SDI video input
1CH, Mini PCIe HW encode video capture card
Analogic PAL video input
4CH, Mini PCIe Video Capture Card
Analogic PAL video output
1CH, Scan Converter Board
- Thermal solution for fanless system design
The unique design of 7STARLAKE's stack rack series integrate both horizontal and vertical placement. Dual-sided aluminum heat sink further secures extreme heat dissipation. 7STARLAKE incorporates exceptional heat radiating material with exceptional CNC cutting design. Fanless method relies heavily on the precise calculation of the efficiency of each heat dissipating component. Superior fanless design guarantees silent operation that enhances the flexibility of mobility and prevents the intrusion of dust and debris. SR700 supports -40°C up to 70°C extended temperature operation, achieving ultimate reliability and stability.
SR stands for Stack & Rack, which means that our SR series systems are capable of stacking and rack mount cabinet placement. With key components such as CPU, memory, and storage devices all soldered onboard, the possible risk of damages caused by sudden impact of vibration and bumping can be diminished to the minimum. MIL-STD tests are established by the US government to simulate how materials would hold up to harsh environments. SR700 has passed the tests concerning its resistance to extremely high & low temperature, humidity, shock, and vibration. SR700 has complete resistance to dust and water, making it even more ruggedized and reliable. SR700 can stand against the intrusion of dust, accidental contact, and water. Not just commercial grade waterproof and dustproof, it can reach Dust Tight level, which guarantees complete protection against ingression. Even the strong power of water jet won't post a threat to it, now this is true ruggedness embodied.
Rugged Connectors (M12 & other MIL-STD variations)
Robust and reliable M12 connectors are implemented for SR700. Compact design meets rugged capability, M12 connectors can seal the connector area securely, operation can continue uninterrupted even under the most severe conditions. What makes SR700 stand out from standard commercial grade product is the fact that all the connectors can be customized to U.S. Military standard connectors (D38999 series) from the famous connector manufacturer Amphenol.
• D38999 Series
MIL-DTL-38999 is a high-performance cylindrical connector family designed for cable-to-panel I/O applications in military, aerospace and other demanding hazardous situations. Class D38999 connectors are capable of operation within a temperature range -65 to 200℃. They are lightweight and can stand up to environmental challenges. Made with removable crimp or fixed hermetic solder contacts, these connectors provide high-vibration characteristics and are suitable for severe wind and moisture problem areas.
Derived from MIL-D38999 Series, VG96912 incorporates lightweight, scoop proof and high contact density features. The plug and receptacle bodies are manufactured from aluminum alloy and protected by cadmium or nickel plating.
- System main board: EBX SBC-OXY5737A
1. Intel ® Core i7 CPU soldering onboard
SR700 is based on EBX SBC—OXY5737A, powered by Intel Ivy Bridge i7-4700EQ quad core processor plus QM87 chipset soldered onboard. With CPU soldering onboard, there is less conduction of heat and high density interconnection between the motherboard and the components, which reduces the MB from the crisis of overheating. The all-in-one design rugged system guarantees CPU full speed operation at 70℃.
2. Wide voltage power input 9V~36V with power delay on/off
Wide voltage power input design (9~36V) can protect the system from damages caused by sudden surge of voltage, thus further secure the reliability of its critical components and the system itself. Power delay on/off design allows selectable boot-up & shutdown voltage for low power protection. SR700 provides 8-level power on/off delay time, status of ignition and low voltage can also be detected.
3. Expandable by Extension Storage Module, the SK401
SR700 features stackable PCIe 104 and FPE expansion slot. Optional module connection can be achieved for a variety of devices. Stacking with the storage module – SK401, 2 x 2.5" SSD or HDD and 2 x mSATA can be supported. The SK401 suppports Win 7 OS, XP, Linux, and DOS.
|CPU||Intel® Core™ i7 Haswell , BGA type
Intel® Core i7-4700EQ (4C x 3.4/2.4 GHz), 6M Cache (47W)
|Chipset||Intel® QM87 Chipset (Intel® DH82QM87 PCH)|
|Memory Type||1 x DDR3 1600 XR-DIMM up to 8 GB with ECC|
|Expansion Slot||2 x mPCIe (1 x colay with mSATA) for GEN2|
|Storage Device||64GB Onboard SSD
1 x mSATA
1 x 2.5" HDD/SSD
1 x SatckPC Slot
|Power Button||Waterproof Power Button with LED backlight|
|Power Input||1 x DC input (4-pin Rugged M12 connector)|
|X1||2 x USB2.0 (8-pin Rugged M12 connector)|
|X2||1 x GbE LAN (8-pin Rugged M12 connector)|
|X3||1 x GbE LAN (8-pin Rugged M12 connector)|
|X4||1 x VGA (12-pin Rugged M12 connector)|
|X5||1 x RS232, 1 x RS485 (12-pin Rugged M12 connector)|
OS support list
|Windows||Windows 7 x32/x64、Windows 8 x32/x64、Windows 8.1 x32/x64、Windows 10 x32/x64|
|Linux||Fedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04、Open SUSE 12.2|
Mechanical and Environment
|Power Requirement||MIL-STD 461 18V~36V power supply|
|Dimension||350 x 230 x 76 mm|
|Weight||8.6 kg (18.9 lbs)|
|Operating Temp.||-40°C to 70°C(ambient with air flow)|
|Storage Temp.||-40°C to 85°C|
|Relative Humidity||5% to 95%, non-condensing|
|MIL-STD-810G Test||Method 507.5, Procedure II (Temperature & Humidity)
Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)
Method 516.6 Shock-Procedure I Operating (Mechanical Shock)
Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)
Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration)
Method 501.5, Procedure I (Storage/High Temperature)
Method 501.5, Procedure II (Operation/High Temperature)
Method 502.5, Procedure I (Storage/Low Temperature)
Method 502.5, Procedure II (Operation/Low Temperature)
Method 503.5, Procedure I (Temperature shock)
|EMC||CE and FCC compliance
MIL-STD 461F (With Optional Power Module)
|Green Product||RoHS, WEEE compliance|
The SR700 offers highly effectively heat conductive and heat convective thermal solutions to meet the demands of customers' extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.
Device Model SR700-ET-i7-4700EQ Tester Ian Huang Test Result Pass Test Temperature High 0~75°C / Low -40~0°C Test Time 9 Hours / 1.5 Hours Test Standard Reference IEC60068-2 Test Software Burnin test v6.0 Criteria After testing, system can't halt.
- Test Configuration
Device Configuration Manufacturer Part Number CPU Intel® Core i7-4700EQ 2.40GHz Intel i7-4700EQ PCH Mobile Intel QM87 Express Chipset Intel QM87 Memory Swissbit XR-DIMM 8 GB DDR3-1600 Swissbit SGV08G72B1BB2SA-DCWRT port3 SATAII Innodisk 256G SATA SSD Innodisk port4 SATA II Innodisk SATAIII 128GB mSATA Innodisk 64GB-AP-USDC64GE429-BTM PCI Express Mini Card Innodisk PCIeDOM 1ME3 Innodisk DEEDM-32GD09SW1DC-D26 LAN1 Intel(R) I210 Gigabit Network Connection Intel I210 LAN2 Intel(R) I217-LM Ethernet Connection Intel I217-LM Test Software Burnin test v6.0、AS SSD Benchmark
Intel Extreme Tuning Utility 126.96.36.199
Chamber KSON THS-b4t-150 Chipeng SMO-3 KSON Chipeng THS-b4t-150 SMO-3
- Thermal Measurement
7STARLAKE provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus 7STARLAKE conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, 7STARLAKE is able to analyse the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5 hours which at each temperature point we burn in SR700-ET-i7-4700EQ for one hour, from +50 to +85°C.
SR700 System - IO Performance
Point -40°C 25°C 40°C 45°C 50°C 55°C 60°C 70°C 75°C CPU T-J 0 81 87 94 99 100 100 100 100 CPU Die -19.9 59.5 65.2 75.3 80.3 84.6 88.2 92.6 96.4 Heatsink -34.2 44.5 51.3 59.2 64.3 70.0 74.6 82.4 86.3 Δ1=(TJ-Die) 19.9 21.5 21.8 18.7 18.7 15.4 11.8 7.4 3.6 Δ2=(Die-Sink) 14.3 15.0 13.9 16.1 16.0 14.6 13.6 10.2 10.1 CPU Frenquency (GHz) 2.79 2.79 2.79 2.79 2.59 2.49 2.19 1.50 1.00
- Effective cooling solution for maximum heat dissipation:
7STARLAKE implements unique cooling solution with copper heat spreader, pure copper heat pipe and aluminum heat sink for maximum heat dissipation. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of copper and aluminum, the copper heat spreader touches the heat source - processor and chipset and absorbs the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, SR700 can ensure high reliability and stability while working under wide range temperature from -40°C up to 70°C.