AV600TH
Military IP66 Mission GPU Computer
- MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
- IP66 Chassis with D38999 connectors
- Intel® 11th Gen. Tiger Lake(H) W-11865MLE Processors, up to 8 cores
- Up to 96GB DDR4 SO-DIMM, non-ECC and ECC
- Soldered 64 GB NVMe
- NVIDIA RTX™ A1000 4GB GDDR6 memory 2048 CUDA cores
- IP65 2 x 2.5” SATA SSD Easy Swap Tray
- MIL-STD 461 18V~36V DC-Input (Options for MIL-704/1275)
- Extreme Temperature : -40 ~+70 Degree
- Dimensions : 246(L) x 313.5 (W) x 100 (H) mm
Special Request :
- Frame Grabber : 4xCH HD-SDI
- Discrete IO : 4xDI 4xDO
- 10GbE : Dual 10GbE (Intel X710) Ethernet Ports
- Dual Redundant MIL-STD-1553 connections
- Dual ARINC 429 input connections
- Conformal coating on electronics
Download
- Technical Profile
- Specifications
- Video
- Download
- Introduction
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AV600TH is driven by Intel® 11 Gen. Tiger Lake-H Processors, integrated Intel® UHD Graphics (Xe architecture). Tiger Lake H processor is built on 10nm SuperFin Technology, up to 8 CPU cores and 4.5 GHz frequency. It is high computing performance and flexibility for heavier IoT workloads, the platform posts significant performance gains gen-over-gen with up to 32 percent gain in single-thread performance. It also features in high-bandwidth, high speed I/Os for expansion and peripherals.
AV600TH highlights on its rugged design and high functionality, the system especially installed MIL-STD Amphenol type connector and full IP66 protection allow system withstand in any kind of harsh environment. AV600TH supports extended temperature from -40°C to 70°C and MIL-STD-461 18V~36V DC-input Power supply which can protect system from damages caused by sudden surge of voltage, thus further secure the reliability of its critical components and the system itself.
- ARINC 429
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ARINC 429 is the worldwide standard for data transmission in aircraft electronics. It is adopted mostly for commercial aircraft and transport aircraft network protocol standard. Communications, guidance, altitude, altitude reference, flight management, and more are all needed to work together to accomplish a successful flight. The physical connection wires are twisted pairs carrying balanced differential signaling.
- Block Diagram
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- Appearance
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System |
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CPU |
Intel® 11 Gen. Tiger Lake-H Processors, up to 8 cores, integrated Intel® UHD Graphics - Intel® Xeon® W-11865MLE, 1.5(4.5) GHz, 24MB, 25W(35W cTDP), 8C/16T |
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Memory type |
Up to 96GB DDR4 SO-DIMM, non-ECC and ECC |
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CHIPSET |
Intel® RM590E (support ECC, with Xeon CPU) /QM580E |
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GPU |
NVIDIA RTX™ A1000 4GB GDDR6 memory, 2048 CUDA cores |
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Expansion Slot |
2 x Full-size mini PCIe (1 with mSATA supported) -1 with mSATA/USB2.0/PCIeX1 support -1 with SIM/USB2.0/PCIeX1 support 1 x 2280 M key (SATA only) |
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Storage |
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SATA |
2 x 2.5” SSD, Hot Swappable SSD/HDD slot |
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M.2 |
1 x 2280 M key (SATA only) |
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Ethernet |
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Ethernet (Internal) |
2 x 10/100/1000 Ethernet Ports |
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Front I/O |
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X1 |
1 x DVI + 2 x COM +USB2.0 , with D38999 connector |
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X2 |
4 x Giga LAN , with D38999 connector |
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X3 |
1 x USB3.0 , with D38999 connector |
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X4 |
1 x USB3.0 , with D38999 connector |
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X5 |
1 x DC-in , with D38999 connector |
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LED |
1 x SSD/HDD LED indicator |
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switch |
1 x IP65 power button , with LED indicator |
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SSD |
2 x 2.5”Easy swap SSD Tray |
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Power |
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Power input |
MIL-STD -461 18V~36V DC-Input |
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Operating System |
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OS |
Windows® 10 64-bit / Linux (support by request) |
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Physical |
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Dimension |
246(L) x 313.5 (W) x 100 (H)mm |
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Weight |
11 KG |
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Chassis |
Aluminum Alloy |
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Heatsink |
Heatsink Aluminum Alloy, Corrosion Resistant |
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Environmental |
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Green Product |
RoHS, WEEE compliance |
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Operating Temp. |
-20 to 55°C |
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Storage Temp. |
-40 to 85°C |
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Relative Humidity |
5% to 95%, non-condensing |
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MIL-STD-810 Specifications (Operating) |
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Method 502.5 |
Low Temperature |
-20°C, 4 hours, ±3°C |
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Procedure 2 |
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Method 501.5 |
High Temperature |
+55°C, 4 hours, ±3°C |
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Procedure 2 |
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Method 507.5 |
Humidity |
85%-95% RH without condensation, 24 hours/ cycle, conduct 10 cycles. |
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Method 514.6 |
Vibration |
5-500Hz, Vertical 2.20Grms, 40mins x 3axis. |
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Method 516.6 |
Shock |
20 Grms, 11ms, 3 axes. |
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MIL-STD-810 Specifications (None-Operating) |
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Method 502.5 |
Low Temperature Storage
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-33°C, 4 hours, change rate:≦20°C/ Hour -15°C, 72hours (By request) |
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Procedure 1 |
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Method 501.5 |
High Temperature Storage |
+71°C, 4 hours, change rate:≦20°C/ Hour +63°C, 240 hours (By request) |
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Procedure 1 |
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Method 514.6 |
Vibration |
5-500Hz, Vertical 2.20Grms, 40mins x 3axis. |
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Method 516.6 |
Shock |
20 Grms, 11ms, 3 axes. |
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| MIL-STD-461 Test | ||||
| Conducted Emissions | CE102 basic curve | 10kHz – 30MHz | ||
| Power Leads | ||||
| Conducted Emissions | RE102-4 | 1.5HMz - 30MHz – 5GHz | ||
| Electric Field | ||||
| Radiated Susceptibility | RS103 | 1.5 MHz – 3GHz, 50 V/m equal for all frequencies | ||
| 2MHz – 80MHz, 50 V/m equal for all frequencies | ||||
| Electric Field | 80MHz – 3GHz, 50 V/m equal for all frequencies | |||
| 3GHz – 5GHz, 50 V/m equal for all frequencies | ||||
| Electrostatic Discharge | EN 61000-4-2 | Air DISCHARGE: 8 Kv, Contact discharge : 6kV | ||
| Electromagnetic compatibility | EN61000-4-4 | Signal and DC Net: 1 kV | ||
| Electromagnetic compatibility | EN61000-4-5 | Lead vs. ground potential 1Kv, ignal und DC Net: 1 kV | ||
| Radio disturbance | EN55022 | Class A | ||
| Electromagnetic compatibility | EN61000-4-3 | 10V/m | ||
| Electromagnetic compatibility | EN 61000-4-5 | Lead vs. ground potential 1Kv, ignal und DC Net: 0.5 kV | ||
| Designed to Meet Items ( Options ) | ||||
| CS101, CS114, CS115, CS116 | ||||
| CE106, RE103, RS101 | ||||
| MIL-STD-1275 | Steady State | 20V-33V | ||
| Surge Low | 18V/500ms | |||
| Surge High | 100V/500ms | |||
| Attachment | Size |
|---|---|
| AV600 MIL-810 514.6 Operation.pdf (1.4 MB) | 1.4 MB |
| AV600 MIL-810 514.6 None-Operation.pdf (1.38 MB) | 1.38 MB |