ROC286CC
- Intel® Coffee Lake-Refresh 8th/9th Processor (Up to 65W)
- Anti-Corrosion Painting on Aluminium Enclosure
- Conformal Coating on all PCB
- 2 x SO-DIMM DDR4 2400/2666 MHz up to 64GB
- Front IO: 2x 2.5”SATA HDD/SSD easy swap tray,2x USB2.0
- Back IO: 2 x COM, 4 x USB3.1, 2 x DP, 2 x LAN, 1 x Line-out/Mic
- Extended Operating Temperature -30°C to 70°C
- 9V~36V DC-IN with Redundant support
- Technical Profile
- Specifications
- Thermal Solution
- Download
- Introduction
The ROC286CC 1U fanless ruggedized system is powered by the Intel® Coffee Lake 14nm Core™ platform with the Q370 chipset, supporting up to 64 GB of memory for high-performance computing. Its redundant 9–36V DC-DC power design ensures stable power delivery and prevents unexpected shutdowns. The system also features conformal coating for enhanced protection and reliability in harsh environments. With MIL-STD-810-certified shock and vibration resistance, the ROC286CC delivers robust performance and exceptional durability—making it an ideal server solution for demanding applications and mission-critical deployments.
- Key Features
-
1. 1U Fanless System
While most 1U systems depend on active fan modules for thermal management, 7STARLAKE engineered the ROC286CC as a fanless 1U server. By integrating advanced heat-pipe thermal architecture, the system delivers enhanced portability and superior passive heat dissipation.
2. Redundant DC-DC
The ROC286CC is engineered with power redundancy to support the highly automated operations of modern power plants, where any disruption can lead to significant financial loss. Its redundant power design ensures continuous operation by providing a backup source in the event of a power failure. This architecture minimizes the risk of unexpected shutdowns and enhances overall system reliability.
3. Conformal Coating on PCB
Coastal nuclear power plants are exposed to harsh environmental contaminants such as salt, sand, dust, and fog, all of which can degrade system performance and harm internal electronics. To safeguard the hardware, the ROC286CC employs a conformal-coated PCB, providing corrosion resistance and comprehensive protection from moisture ingress, particulate contamination, chemical exposure, and temperature fluctuations.
4. Anti-Corrosion Painting on Aluminium Enclosure
Because many power plants are located near the sea, iron and steel components are prone to rust when exposed to water and air, which can lead to critical power failures. To prevent such deterioration, the ROC286CC features an aluminium enclosure with specialized anti‑corrosion coating, providing essential protection against the damaging effects of moisture and harsh environmental conditions.
ROC286CC I/O Placement
|
System |
||
|---|---|---|
|
CPU |
Socket LGA 1151 for Intel® Core i7/i5/i3/Celeron® (Supports up to 65W) Intel® 8th/9th Processor |
|
| Memory type | 2 x DDR4 SO DIMM up to 64 GB | |
|
Chipset |
Intel® Q370 Chipset |
|
|
Storage Device |
2 x SATAIII, 2.5” SSD |
|
| Expansion Slot |
1 x PCIe x16 1 x M.2 (Key M, 2242/2280) with PCIe and SATA Signal |
|
|
Storage |
||
|
HDD/SDD |
2x 2.5” SATA HDD/SSD easy swap tray |
|
|
Ethernet |
||
|
Ethernet |
Intel® I210 & I219LM GbE LAN (support 10/100/1000 Mbps for x 2 RJ45 ports) |
|
|
Rear I/O |
||
|
Display Port |
2 x |
|
| HDMI | 1 x | |
|
Ethernet |
2 x RJ45 Intel® I210 & I219LM GbE LAN (support 10/100/1000 Mbps) |
|
| Audio | 2 x 3.5mm Audio Jacks (1x MIC, 1x Line-Out) | |
|
COM |
2 x RS232/422/485 ( 422/485 select by BIOS) |
|
|
USB Port |
4 x USB 3.1(10Gb/s) |
|
|
DC-IN |
9V~36V DC-IN (2X 4P Terminal Block) |
|
|
Front I/O |
||
|
Button |
1 x Power Button w/Indicator LED |
|
|
Indicator LED |
1 x HDD |
|
|
USB Port |
2 x USB 2.0 |
|
|
Easy Swap SSD Tray |
2 x |
|
|
Applications, Operating System |
||
|
Applications |
Commercial and Industrial Platforms, Embedded Computing, Process Control Intelligent Automation and manufacturing applications |
|
|
Operating System |
Windows 10 64Bit Ubuntu13.04, Ubuntu13.10, Ubuntu14.04, Fedora 20 |
|
|
Physical |
||
|
Dimension (W x D x H) |
430 x450 x 44 mm |
|
|
Weight |
8.92Kg |
|
|
Chassis |
SECC |
|
|
Heatsink |
Aluminum Alloy, Corrosion Resistant |
|
|
Finish |
Anodic aluminum oxide |
|
|
Environmental |
||
| MIL-STD-810G Test |
Method 507.5, Procedure II (Temperature & Humidity) Method 501.5, Procedure I (Storage/High Temperature) Method 501.5, Procedure II (Operation/High Temperature) Method 502.5, Procedure I (Storage/Low Temperature) Method 502.5, Procedure II (Operation/Low Temperature) Method 503.5, Procedure I (Temperature shock) |
|
|
Green Product |
RoHS compliance |
|
|
Operating Temperature |
w/o Graphic Card (ET: -20 to 60°C; UT: -30 to 70°C) ; w/Graphic Card (0 to 50°C) |
|
|
Storage Temperature |
-30 to 85°C |
|
|
Relative Humidity |
5% to 95%, non-condensing |
|
|
EMC |
CE and FCC compliance |
|
- Dual Side Thermal Solution, Fanless Design for 1U Slim Size
-
With combination of high CPU computing power and graphic GPU performance generate numerous heat, 7STARLAKE emphasizes on providing exceeding thermal design guarantee system offers superior performance under critical environment. Based on our experience, ROC286 adopts dual side thermal solution, with copper heat spreader directly touches the heat source components processor and graphic GPU to absorb the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid which can provide high efficiency heat transmission, the aluminum heat sink dissipates the heat into surrounding air promptly. Both side thermal solution is mainly for processor. With unique thermal design, 7STARLAKE is capable to integrate high power consumption CPU into 1U such slim size fanless system.
| Attachment | Size |
|---|---|
| ROC286 Series System test report.pdf (7.45 MB) | 7.45 MB |