SCH4X2-RAC

SCH4X2_1_IEC-61850-3
SCH4X2_2_IEEE-1613
SCH4X2_3_Substation
SCH4X2_4_Micro Grid

IEC-61850-3 ,IEEE-1613 Micro-Grid Fanless Computer, with Intel® Core™ 13/12th Gen. i9/i7/i5/i3 Processors, expansion 2 x PCIe Gen4 x 8, AC-IN 110~240 with Redundant,operating Temperature -20°C to 60°C

  • Intel® 13th/12th Gen Raptor Lake-S / Alder Lake-S Core™ i9/i7/i5/i3 up to TDP 65W
  • Up to 64G DDR4 SO-DIMM 3200 MHz
  • 2 x DP, 2 x LAN, 2 x USB
  • 2x 2.5”Easy swap SSD Tray
  • 2 x PCIe Gen4 x 8 slot
  • AC-IN 110~240V with redundant
  • Operation Temp.-20 °C to 60°C
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  Introduction

SCH4X2_AC

As a leading company specialized in energy related application, 7StarLake’s experienced team designed an extremely reliable Gateway system SCH4X2-AC/RAC. Powered by Intel 12th/13th Gen. Core i9/i7/i5/i3 processor. SCH4X2-AC/RAC owns highly efficient processing capability to deal with a large amount of data delivering between IEC-61850 devices and the Control Center. In advantage of other outstanding features, such as 2 x LAN portt. SCH4X2-AC/RAC is an undoubtedly best choice for Micro-Grid application in Substation.

Key Feature

(1)Power Redundancy

 The design of wide power range keeps the system’s reliability and you can expect longer life-span as well. Sudden drop or surge of power posts absolutely no threat to this smart system.

(3)Rich communication Interface

In advantage of SCH4X2_AC/RAC diverse I/O, 2 x LAN(RJ45), 6 x USB,  2 x DP,  the SCH4X2-AC/RAC system can satisfy all our clients.

(5)IEC-61850-3

The standardization of IEC-61850 enables the integration of the equipment and systems from different suppliers, reducing the burden on the configuration and maintenance of these systems. The protocol also meets utilities’ requirements for long-term system expandability. Thus, there are more and more electric companies perform power-system automation by using IEC-61850 protocol with Intelligent electronic devices (IED)

 

 

(2)IEEE-1613

The widespread use of multifunctional intelligent electronic devices with advanced communications capabilities has resulted in a new trend in substation automation systems. The intelligent electronic devices exchange messages over the substation local area network. Detail environment and testing requirements for communications networking devices in electric power substations. 

(4)Extreme Temperature

Copper heat spreader, pure copper heat pipe and aluminum heat sink, with all these benefits of fanless design. To ensure high reliability and stability while SCH4X2_AC/RAC working under wide range temperature from -20°C up to +60°C.  And, with SCH4X2_AC/RAC special industrial extended range of temperature layout, it can also reduce the potential computer glitches caused by hardware incompatibility and losses of connectivity caused by shock and vibration.

Apperance
SCH3X2_Front IO

 

 

Rear IO

 

Dimension

 

System
CPU Intel® 13th / 12th Gen Raptor Lake-S / Alder Lake-S LGA1700 Socket Processor / Core i9/i7/i5/i3 Processor up to TDP 65W
Memory Capacity Up to 64G DDR4 SO-DIMM 3200MHz
Chipset Q670
Display
GPU Intel® UHD Graphics
Display Port DisplayPort 1.4, DP++ Max resolution up to 4K( 4096 x 2304@60Hz)
2nd Display Port DisplayPort 1.4, DP++ Max resolution up to 4K( 4096 x 2304@60Hz)
Expansion
PCIe Slot 2 x PCIe Gen 4 x 8 Slot
M.2 1 x M.2 2280 M-Key (PCIe Gen3 x 4, SATAIII)
Storage
SATA Up to 4TB SATAIII
M.2 Up to 2TB NVMe & SATAIII
Ethernet
Ethernet

1 x Intel® I219-LM Giga LAN

1 x Intel® I225V 2.5 Giga LAN
Front I/O
Power Button 1 x Power Button
Indicator 1 x HDD backlight / 1 x Power backlight
USB3.0 2 x USB3.0
Rear I/O
Power Input

1 x C14 Plug 110~240V AC-IN

(2 x C14 Plug 110~240V AC-IN with Redundant)
LAN 2 x RJ45 GbE LAN ( 1 x GbE / 1 x 2.5 GbE)
USB3.2 2 x USB3.2
USB2.0 2 x USB2.0
Display Port 2 x DP
Storage 2 x 2.5" Swap SSD Tray
Power Requirement
Power Input AC-IN 110~240V with redundant
OS support list
OS Window® 11 64 bit, / Window® 10 IoT LTSC 64 bit (LTSC 2021) / Ubuntu 22.04 / Linux (support by request)
Mechanical and Environment
Dimension 220 x 315 x 167 mm (W x D x H)
Operating Temp -20°C to 60°C
Storage Temp. -40°C to 85°C
Relative Humidity 5% to 95%, non-condensing
System Design  Fanless
Certification
IEC-61850-3 / IEEE-1613 / UL 62368-1 / EN60945 / CE/FCC

Ordering Information _ AC