IV320-RS-X

IP66 Tactical Maritime Edge Computer

AI Optimized IP66 Rugged Computer
Enabling Persistent Maritime ISR with Autonomous, Coordinated USVs
Support Intel^® 14/13th Gen Raptor Lake-R/S, Core i9/i7
Up to 64GB DDR5 5200 MHz SO-DIMM, non-ECC and ECC
Rugged waterproof M20/M12 connectors
2 x LAN(2.5GbE), 1 x COM ; 1 x miniDP ; 1 x USB3.0
Extended Operating Temperature -20°C to +60°C
MIL-STD-810 Anti Vibration, Shock

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Technical Profile
Specifications
Order Information

Full IP65 Sealed Enclosure: Dirt, dust, and moisture in outdoor environments can adversely affect system performance. Exposure to high humidity or dusty conditions may lead to operational failures. The IV320-RS-X features a fully IP65-rated sealed enclosure, specifically designed to meet the protection requirements of electrical and electronic systems. It provides reliable protection against dust ingress, condensation, water spray, and low-pressure water jets from any direction, making it suitable for most outdoor enclosure applications.

Intel CPU Features: To enable Edge AI capabilities, the IV320-RS-X is powered by Intel® 13th Gen Raptor Lake processors. This generation enhances overall performance through increased core counts—primarily via additional E-Cores—expanded L2 cache capacity, and higher clock speeds. Flagship configurations support up to 8 Performance Cores (P-Cores) and 16 Efficient Cores (E-Cores), delivering a total of 24 cores for demanding workloads.

The x86 hybrid architecture includes two distinct core types, dynamically allocating workloads to optimize performance and power efficiency based on application requirements:

P-Cores (Performance Cores): Built on the Golden Cove architecture, optimized for high-performance and compute-intensive tasks.

E-Cores (Efficient Cores): Based on the Gracemont architecture, designed for low-power operation and efficient multitasking.

Appearance

System
CPU	Intel^® 14th Raptor Lake-R Core i9-14900T, 24C(8P+16E), 32T, 1.1/5.5GHz, 36M Cache, TDP 35W(Turob mode 106W) Intel^® 13th Raptor Lake Core i9-13900TE, 24C(8P+16E), 32T, 1.0/5.0GHz, 36M Cache, TDP 35W
Memory type	Up to 64GB DDR5 5200 MHz SO-DIMM, non-ECC and ECC
Chipset	Intel^® Q670E/R680E Chipset
Expansion Slot	1 x PCIe 4.0 x 16 1 x M.2 2242/2280 M-Key PCIe 3.0 x 4
Storage
SATA	2 x 2.5” SSD SATAIII Internal
TPM
TPM	Onboard TPM2.0
Front I/O
X1	1 x DC-IN w/M12 waterproof connector
X2	1 x 2.5Giga LAN w/M12 waterproof connector
X3	1 x 2.5Giga LAN w/M12 waterproof connector
X4	1 x RS232/422/485 w/M12 waterproof connector
X5	1 x USB3.0, with M20 waterproof connector
X6	1 x miniDP w/M20 waterproof connector
X7	(reserve)
X8	(reserve)
SSD LED	1 x SSD LED
Switch	1 x IP65 power button
Rear I/O
Others	Antenna(Option)
GND	1 x GND
Power
Power input	18V~36V DC-IN
Operating System
OS	Windows^® 10 IoT Enterprise 2021 LTSC (64-bit, 21H2) Windows^® 11 IoT Enterprise 24H2 LTSC (64-bit) Linux (Support by request)
Physical
Dimension	325 x 250 x 100 mm (W x L x H)
Chassis	Aluminum Alloy
Heatsink	Heatsink Aluminum Alloy, Corrosion Resistant
FAN Kit	W/GPU SKU
Environmental
Green Product	RoHS, WEEE compliance
Operating Temp.	-20°C to +60°C
Storage Temp.	-40°C to +85°C
Relative Humidity	5% to 95%, non-condensing
MIL-STD-810 (Design To Meet)	MIL-STD-810 Design to meet : Method 501, Operational Temperature, high / Procedure II: +50°C, two-hour dwell, four cycles Method 501, Storage Temperature, high / Procedure I: +70°C, two-hour dwell, four cycles Method 502, Operational Temperature, low / Procedure II: -20°C, two-hour dwell, four cycles Method 502, Storage Temperature, low / Procedure I: -40°C, two-hour dwell, four cycles Method 514, Vibration / Category 24/Non-Operating (Category 20 & 24, Vibration) Method 514, Vibration / Category 20/Operating (Category 20 & 24, Vibration) Method 516, Shock / Procedure V Non-Operating (Mechanical Shock) Method 516, Shock / Procedure I Operating (Mechanical Shock)