AV710-CU
Military Jetson AGX Orin IP65 Rugged Computer
- Counter UAV Visulation Platform with Multi-Sensors Data Fusion
- NVIDIA Jetson AGX Orin 32G/64G LPDDR5 DRAM
- Data Fusion : 4 CH 3G-SDI NVENC H.264 Low Latency (options)
- Data Input : 1x10G SFP+ 2xLAN , 8xCH GMSL 2.0 (options)
- Connectivity : CAN Bus+1x RS232/422/485 Support
- IP65 Classified with M12/DTL38999 Connector (options)
- DC-DC 12V~30V, Options 18V~36V with MIL-461 EMI Filter
- MIL-STD-810 Vibration Method 514.6 : ◎Acceleration : 5.0 Grms
- MIL-STD-810 Vibration Method 514.6 : ◎PSD : 0.01257 g2/Hz
- MIL-STD-810 Shock Method 516.6 : ◎Wave Form: Half Shine Wave
- MIL-STD-810 Shock Method 516.6 : ◎Acceleration: 40G
- Extended Temperature -20°C to +55°C
- Technical Profile
- Specifications
- Order Information
The AV710-CU, powered by the NVIDIA® Jetson Orin™, is a next-generation military-grade AI computing platform designed for high-precision UAV detection. By integrating multi-sensor fusion technology, it delivers unmatched detection accuracy and efficiency for defense and security operations.
Advanced Multi-Sensor Detection & AI Processing
The AV710-CU supports a wide range of detection methods, including radar, radio frequency (RF), electro-optical (EO), infrared (IR), and acoustic sensors. Using advanced AI-driven sensor fusion, it enables real-time UAV detection, classification, and tracking with exceptional precision.
High-Performance Computing with Jetson Orin
At the core of the AV710 is the NVIDIA® Jetson Orin platform, delivering industry-leading AI processing power with:
- Up to 2,048 CUDA cores for parallel computing
- Up to 64 Tensor cores for accelerated AI workloads
- Up to 275 TOPS (Tera Operations Per Second) of AI performance
- Super-large storage capacity of up to 2×16TB (32TB total) for extensive data logging and long-duration mission recording
Data Input & Integration
The AV710 is designed to handle diverse data sources, ensuring seamless processing from multiple detection methods. Key input capabilities include:
- 10G (SFP+) high-speed connectivity for rapid data transmission
- 4-channel 3G-SDI input for seamless integration of high-resolution video feeds
- Advanced data conversion to process signals from RF, radar, EO, and IR sensors
Built for Harsh Environments
Designed for extreme operational conditions, the AV710 meets stringent military durability standards, including:
- IP65-rated enclosure for protection against dust, water, and harsh environments
- MIL-STD-810 Vibration Method 514.6, withstanding up to 5 grms for high-vibration deployments
- MIL-STD-810 Shock Method 516.6, enduring shocks of up to 40G for battlefield resilience
NVIDIA® Jetson Orin™ AGX
Equipped with an NVIDIA® Ampere® architecture GPU featuring 2048 CUDA® and 64 Tensor Cores, the AV710-CU, integrated with the NVIDIA® Jetson Orin™ AGX module, delivers up to 275 TOPS of AI performance with power configurable between 15W and 60W. This gives you up to 8X the performance of Jetson AGX Xavier in the same compact form factor. Bring your next-gen products to life with the world’s most powerful AI computers for energy-efficient autonomous machines, plus high-speed interface support for multiple sensors, making them the ideal solution for a new age of robotics.
NVIDIA® JetPack™ Support
Compatible with NVIDIA® JetPack™ 5.0 and higher, the AV710-CU enables users to harness a comprehensive library of tools for building top-tier inference models. This enhances application performance by accelerating graphics, data processing, and image classification functions which can be tailored to your specific needs.
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Edge AI Platform |
SFF & SWaP |
Open Modular Architecture |
MIL-STD 810 Rugged |
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Can integrate the NVIDIA Jetson Orin AGX (32GB or 64GB), delivering up to 275 TOPS of AI performance for next-gen autonomous and uncrewed mission-critical applications |
Ultra-compact and lightweight, SWaP-optimized for integration and deployment in highly space-constrained vehicles. | Orin NX and SMARC x86-based architecture/processor options. Robust IO and configuration options, including multiple USB 3.0, GbE, serial, display, video capture, GPS, GPIO. | Engineered for austere environments. -40C to +55C operating temp, passive cooled. Fully sealed. MIL-STD-810H, MIL-STD-461G, MIL-STD-1275E/704F. |
- Block Diagram
- Appearance
Dimensions
TBA
| System | |||
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| AI Performance | 200/275 TOPS | ||
| CPU Module |
Ampere® GPU + Arm® Cortex-A78AE CPU + 64GB LPDDR5 + 64GB eMMC 5.1 Ampere® GPU + Arm® Cortex-A78AE CPU + 32GB LPDDR5 + 64GB eMMC 5.1 |
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| GPU |
NVIDIA® Ampere® architecture with 2048 NVIDIA® CUDA® cores and 64 Tensor Cores, max freq. 1.3GHz NVIDIA® Ampere® architecture with 1792 NVIDIA® CUDA® cores and 56 Tensor Cores, max freq. 930MHz |
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| CPU |
12-core Arm® Cortex®-A78AE v8.2 64-bit CPU, 3MB L2 + 6MB L3, max freq. 2.2GHz 8-core Arm® Cortex®-A78AE v8.2 64-bit CPU, 2MB L2 + 4MB L3, max freq. 2.2GHz |
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Memory |
64GB 256-bit LPDDR5, 204.8 GB/s 32GB 256-bit LPDDR5, 204.8 GB/s |
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Storage |
64GB eMMC 5.1 |
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| Expansion Slot |
2x M.2 2280 M key (PCIe x4), 1x M.2 3042/3052 B key 1x MIPI Camera connector(6 CSI camera support) 1x Micro SD 1x I2C 2x SPI 1x I2S 2x UART 1x CAN 1x SIM Options : 4/8x CH SDI/HD/3G-SDI Input |
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Display |
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| Display | 1x HDMI 2.0 (max resolution 3840x2160) | ||
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Front I/O |
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| Power in | 1x DC-IN 12V~30V, with M12 waterproof connector | ||
| X1 | 1x 1GbE LAN , with M12 waterproof connector | ||
| X2 | 1x 1GbE LAN, with M12 waterproof connector | ||
| X3 | 1x RS232, with M12 waterproof connector(Options) | ||
| X4 | 1x USB 3.0, with M20 waterproof connector | ||
| X5 | 1x HDMI, with M20 waterproof connector | ||
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Rear I/O |
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| X6: Antenna | 4x SMA connector for WiFi/4G/5G/LTE (up to 5x) | ||
| Debug Access Panel | 1x Reset Button | ||
| 1x Recover Button | |||
| 1x USB type-C for Debug | |||
| 1x USB Type-C for Recovery | |||
| 1x Reboot LED | |||
| X7 | 2x 3G-SDI with BNC connectors | ||
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Operating System |
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| OS | NVIDIA Jetpack™ 6.0 | ||
| Physical | |||
| Dimension | 250x325x100 mm (WxDxH) | ||
| Weight | 3.3Kg | ||
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Environmental |
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| Operating Temp. | -20 to 55°C | ||
| Storage Temp. | -40 to 85°C | ||
| Relative Humidity | 5% to 95%, non-condensing | ||
| MIL-STD-810 | Method 507.5, Procedure II ( Temperature & Humidity ) Method 516.6 Shock-Procedure V Non-Operating ( Mechanical Shock ) Method 516.6 Shock-Procedure I Operating ( Mechanical Shock ) Method 514.6 Vibration Category 24/Non-Operating ( Category 20 & 24, Vibration ) Method 514.6 Vibration Category 20/Operating ( Category 20 & 24, Vibration ) Method 501.5, Procedure I ( Storage/High Temperature ) Method 501.5, Procedure II ( Operation/High Temperature ) Method 502.5, Procedure I ( Storage/Low Temperature ) Method 502.5, Procedure II ( Operation/Low Temperature ) Method 503.5, Procedure I ( Temperature shock ) |
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| Reliability | No Moving Parts; Passive Cooling. Designed & Manufactured using ISO 9001 / 2000 Certified Quality Program. |
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| MIL-STD-461 (Option) | CE102 : 10 KHz - 10 MHz RE102-4 : 1.5 MHz -30 MHz - 5 GHz RS103 : 200 MHz - 3.0 GHz - 5.0 GHz, 50 V/m equal for all frequencies |
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