AV710-X4
Military Jetson AGX Orin IP65 Rugged Computer
- NVIDIA® Jetson AGX Orin with 2048 CUDA and 64 Tensor Cores
- 1x 10G LAN , 2x USB 3.0, 2x GbE LAN, 1x CAN, 1x RS232/422/485
- 12 Core Arm® Cortex® , 64GB 256-Bit LPDDR5
- On board 64GB eMMC 5.1
Options for additional 2TB SSD - Extended Temperature -20°C to +55°C
- DC-IN 12V~32V , Options for MIL-461 EMI Filter
- 8x GMSL Input - Options
- 4/8x CH SDI/HD/3G-SDI Input - Options
- Technical Profile
- Specifications
- Order Information
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AV710-X4 is an ultra-small-form-factor (USFF) MIL-SPEC rugged edge compute solution. Designed using a Modular Open Systems Approach (MOSA) with a modular chassis and architecture design, integrating either the NVIDIA Jetson Orin AGX edge AI system on module (SOM), AV710-X4 provides the performance and flexibility demanded by emerging autonomous and uncrewed missions, in an ultra-compact and lightweight form factor. AV710-X4 is engineered to withstand austere environments and is SWaP-optimized for integration and deployment in highly space-constrained platforms.
NVIDIA® Jetson Orin™ AGX
Equipped with an NVIDIA Ampere architecture GPU featuring 2048 CUDA® and 64 Tensor Cores, the AV710-X4, integrated with the NVIDIA Jetson Orin™ AGX module, delivers up to 275 TOPS of AI performance with power configurable between 15W and 60W. This gives you up to 8X the performance of Jetson AGX Xavier in the same compact form factor. Bring your next-gen products to life with the world’s most powerful AI computers for energy-efficient autonomous machines, plus high-speed interface support for multiple sensors, making them the ideal solution for a new age of robotics.
NVIDIA JetPack™ Support
Compatible with NVIDIA JetPack™ 5.0 and higher, the AV710-X4 enables users to harness a comprehensive library of tools for building top-tier inference models. This enhances application performance by accelerating graphics, data processing, and image classification functions which can be tailored to your specific needs.
Edge AI Platform
SFF & SWaP
Open Modular Architecture
MIL-STD 810 Rugged
Can integrate the NVIDIA Jetson Orin AGX (32GB or 64GB), delivering up to 275 TOPS of AI performance for next-gen autonomous and uncrewed mission-critical applications
Ultra-compact and lightweight, SWaP-optimized for integration and deployment in highly space-constrained vehicles. Orin NX and SMARC x86-based architecture/processor options. Robust IO and configuration options, including multiple USB 3.0, GbE, serial, display, video capture, GPS, GPIO. Engineered for austere environments. -40C to +55C operating temp, passive cooled. Fully sealed. MIL-STD-810H, MIL-STD-461G, MIL-STD-1275E/704F.
Block Diagram
Appearance
Dimensions
| System | |||
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| AI Performance | 200/275 TOPS | ||
| CPU Module |
Ampere GPU + Arm Cortex-A78AE CPU + 64GB LPDDR5 + 64GB eMMC 5.1 Ampere GPU + Arm Cortex-A78AE CPU + 32GB LPDDR5 + 64GB eMMC 5.1 |
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| GPU |
NVIDIA Ampere architecture with 2048 NVIDIA® CUDA® cores and 64 Tensor Cores, max freq. 1.3GHz NVIDIA Ampere architecture with 1792 NVIDIA® CUDA® cores and 56 Tensor Cores, max freq. 930MHz |
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CPU |
12-core Arm® Cortex®-A78AE v8.2 64-bit CPU, 3MB L2 + 6MB L3, max freq. 2.2GHz 8-core Arm® Cortex®-A78AE v8.2 64-bit CPU, 2MB L2 + 4MB L3, max freq. 2.2GHz |
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Memory |
64GB 256-bit LPDDR5, 204.8 GB/s 32GB 256-bit LPDDR5, 204.8 GB/s |
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Storage |
64GB eMMC 5.1 |
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| Expansion Slot |
2x M.2 2280 M key (PCIe x4) 1x MIPI Camera connector(6 CSI camera support) 1x Micro SD 1x I2C 2x SPI 1x I2S 2x UART 1x CAN 1x SIM Options : 4/8x CH SDI/HD/3G-SDI Input |
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Display |
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Display |
1x HDMI 2.0(max resolution 3840x2160) |
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Front I/O |
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| X1 | 1x 1GbE LAN , with M12 waterproof connector | ||
| X2 | 1x 1GbE LAN , with M12 waterproof connector | ||
| X3 | 1x 10GbE LAN, with M12 waterproof connector (Options) | ||
| X4 | 1x USB 3.0, with M12 waterproof connector | ||
| X5 | 1x USB 3.0, with M12 waterproof connector | ||
| X6 | 1x CAN+5x GPIO+1x RS232/422/485, with M12 waterproof connector | ||
| X7 |
1x HDMI, with M12/D38999 waterproof connector |
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| Switch | 1x IP65 power button w/LED | ||
| LED | 1x HDD/SSD Indicator Light | ||
| BNC | 4/8 Channel 3G-SDI For Options | ||
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Rear I/O |
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DC-IN |
DC-IN 12V-32V |
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| Antenna | 2x SMA connector ( up to 5x) | ||
| Debug Access Panel | 1x Reset Button | ||
| 1x Recover Button | |||
| 1x USB type-C for Debug | |||
| 1x USB Type-C for Recovery | |||
| 1x Reboot LED | |||
| 1x Nano SIM Slot | |||
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Operating System |
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OS |
NVIDIA Jetpack™ 5.X (5.02/5.1) |
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| Physical | |||
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Dimension |
250 (W) x 325 (D) x 100 (H) mm |
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Weight |
3.3Kg |
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Environmental |
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| Operating Temp. | -20 to 55°C | ||
| Storage Temp. | -40 to 85°C | ||
| Relative Humidity | 5% to 95%, non-condensing | ||
| MIL-STD-810 | Method 507.5, Procedure II ( Temperature & Humidity ) Method 516.6 Shock-Procedure V Non-Operating ( Mechanical Shock ) Method 516.6 Shock-Procedure I Operating ( Mechanical Shock ) Method 514.6 Vibration Category 24/Non-Operating ( Category 20 & 24, Vibration ) Method 514.6 Vibration Category 20/Operating ( Category 20 & 24, Vibration ) Method 501.5, Procedure I ( Storage/High Temperature ) Method 501.5, Procedure II ( Operation/High Temperature ) Method 502.5, Procedure I ( Storage/Low Temperature ) Method 502.5, Procedure II ( Operation/Low Temperature ) Method 503.5, Procedure I ( Temperature shock ) |
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| Reliability | No Moving Parts; Passive Cooling. Designed & Manufactured using ISO 9001 / 2000 Certified Quality Program. |
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| MIL-STD-461 (Option) | CE102 : 10 KHz - 10 MHz RE102-4 : 1.5 MHz -30 MHz - 5 GHz RS103 : 200 MHz - 3.0 GHz - 5.0 GHz, 50 V/m equal for all frequencies |
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