AV600CH
Military IP66 Mission GPU Computer
- MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
- IP66 Chassis with D38999 connectors
- Intel® 9th Gen. Coffee Lake (H) Xeon® E-2276ML processor
- Up to 128GB DDR4 SO-DIMM, non-ECC and ECC
- NVIDIA RTX™ A2000, 2560 CUDA® cores, 4GB/8GB GDDR6 memory
- MIL-STD-461 18V~36V DC-Input (Options for MIL-704/1275)
- Extreme Temperature : -40 ~+55 Degree
- Optional with External GPU Turbo Kit
- Dimensions : 246(L) x 313.5 (W) x 88 (H) mm
Special Request :
- Frame Grabber : 4xCH HD-SDI
- Discrete IO : 4xDI 4xDO
- 10GbE : Dual 10GbE (Intel X710) Ethernet Ports
- Dual Redundant MIL-STD-1553 connections
- Dual ARINC 429 input connections
- Technical Profile
- Specifications
- Order Information
- Introduction
-
AV600CH is driven by Intel® 9 Gen. Coffee Lake-H Xeon Processors. These processors are manufactured on Intel's most up-to-date and optimized 14 nm technology, up to 6 CPU cores. It is high computing performance and flexibility for heavier IoT workloads. The H-series processors are ideally suited for space-constrained and purpose-built designs. Multiple offerings for scalable performance, enhanced performance over previous generation with up to 6 cores.
- Designed for Harsh Environment
-
AV600CH highlights on its rugged design and high functionality, the system especially installed MIL-STD Amphenol type connectors and full IP66 protection allow system withstand in any kind of harsh environment. AV600CH supports extended temperature from -40°C to 55°C and MIL-STD-461 18V~36V DC-input Power supply which can protect system from damages caused by sudden surge of voltage, thus further secure the reliability of its critical components and the system itself.
- Block Diagram
|
System |
||||
|---|---|---|---|---|
|
CPU |
Xeon E-2276ML (6 Cores/12 Threads, 12M Cache, up to 4.20 GHz), 25W |
|||
|
Memory type |
4 x 260 Pin DDR4 2400MHz SO-DIMM (up to 128GB, XEON®SKU support ECC) |
|||
|
CHIPSET |
CM246 |
|||
|
GPU |
NVIDIA RTX™ A2000 embedded graphics - Standard MXM 3.1 Type A (82 x 70 mm) - 2560 CUDA® cores, 20 RT Cores, and 80 Tensor Cores - 9.3 TFLOPS peak FP32 performance - 4GB/8GB GDDR6 memory, 128-bit |
|||
|
Expansion Slot |
1 x M.2(M-key,Type: 2280 , SATA/PCIe 3.0 x 4 NVMe) 2 x Mini PCIe Full size (USB / PCIe and 1 x micro SIM Card) 1 x PCIe/104, 1 x FPE |
|||
| TPM | TPM 2.0 (SLB9665) | |||
|
VIDEO INPUT |
4 Channel capture module for 4 x SMA male connectors >(optional) | |||
|
Storage |
||||
| SATA | 2 x 2.5” SSD | |||
|
M.2 |
1 x 2280 M key (SATA only) |
|||
|
Ethernet |
||||
|
Ethernet (Internal) |
2 x 10/100/1000 Ethernet Ports |
|||
|
Front I/O |
||||
|
X1 |
1 x VGA + 2 x COM +USB2.0 , with D38999 connector |
|||
|
X2 |
4 x Giga LAN , with D38999 connector |
|||
|
X3 |
1 x USB3.0 , with D38999 connector |
|||
|
X4 |
1 x USB3.0 , with D38999 connector |
|||
|
X5 |
1 x DC-in , with D38999 connector |
|||
|
LED |
1 x SSD/HDD LED indicator |
|||
|
switch |
1 x IP65 power button , with LED indicator |
|||
|
Power |
||||
|
Power input |
MIL-STD -461 18V~36V DC-Input |
|||
|
Operating System |
||||
|
OS |
Windows® 10 64-bit / Linux (support by request) |
|||
|
Physical |
||||
|
Dimension |
246(L) x 313.5 (W) x 88 (H)mm |
|||
|
Weight |
5.5 Kg |
|||
|
Chassis |
Aluminum Alloy |
|||
|
Heatsink |
Heatsink Aluminum Alloy, Corrosion Resistant |
|||
|
Environmental |
||||
|
Green Product |
RoHS, WEEE compliance |
|||
|
Operating Temp. |
-40 to 55°C |
|||
|
Storage Temp. |
-40 to 85°C |
|||
|
Relative Humidity |
5% to 95%, non-condensing |
|||
|
MIL-STD-810 Specifications (Operating) |
||||
|
Method 502.5 |
Low Temperature |
-20°C, 4 hours, ±3°C |
||
|
Procedure 2 |
||||
|
Method 501.5 |
High Temperature |
+55°C, 4 hours, ±3°C |
||
|
Procedure 2 |
||||
|
Method 507.5 |
Humidity |
85%-95% RH without condensation, 24 hours/ cycle, conduct 10 cycles. |
||
|
Method 514.6 |
Vibration |
5-500Hz, Vertical 2.20Grms, 40mins x 3axis. |
||
|
Method 516.6 |
Shock |
20 Grms, 11ms, 3 axes. |
||
|
MIL-STD-810 Specifications (None-Operating) |
||||
|
Method 502.5 |
Low Temperature Storage
|
-33°C, 4 hours, change rate:≦20°C/ Hour -15°C, 72hours (By request) |
||
|
Procedure 1 |
||||
|
Method 501.5 |
High Temperature Storage |
+71°C, 4 hours, change rate:≦20°C/ Hour +63°C, 240 hours (By request) |
||
|
Procedure 1 |
||||
|
Method 514.6 |
Vibration |
5-500Hz, Vertical 2.20Grms, 40mins x 3axis. |
||
|
Method 516.6 |
Shock |
20 Grms, 11ms, 3 axes. |
||
| MIL-STD-461 | ||||
| Conducted Emissions | CE102 basic curve | 10kHz – 30MHz | ||
| Power Leads | ||||
| Conducted Emissions | RE102-4 | 1.5HMz - 30MHz – 5GHz | ||
| Electric Field | ||||
| Radiated Susceptibility | RS103 | 1.5 MHz – 3GHz, 50 V/m equal for all frequencies | ||
| 2MHz – 80MHz, 50 V/m equal for all frequencies | ||||
| Electric Field | 80MHz – 3GHz, 50 V/m equal for all frequencies | |||
| 3GHz – 5GHz, 50 V/m equal for all frequencies | ||||
| Electrostatic Discharge | EN 61000-4-2 | Air DISCHARGE: 8 Kv, Contact discharge : 6kV | ||
| Electromagnetic compatibility | EN61000-4-4 | Signal and DC Net: 1 kV | ||
| Electromagnetic compatibility | EN61000-4-5 | Lead vs. ground potential 1Kv, ignal und DC Net: 1 kV | ||
| Radio disturbance | EN55022 | Class A | ||
| Electromagnetic compatibility | EN61000-4-3 | 10V/m | ||
| Electromagnetic compatibility | EN 61000-4-5 | Lead vs. ground potential 1Kv, ignal und DC Net: 0.5 kV | ||
| Designed to Meet Items ( Options ) | ||||
| CS101, CS114, CS115, CS116 | ||||
| CE106, RE103, RS101 | ||||
| MIL-STD-1275 | Steady State | 20V-33V | ||
| Surge Low | 18V/500ms | |||
| Surge High | 100V/500ms | |||
