ROC288B
1U 19” AC-DC Fanless Server With Intel 14th/13th Processor
- Intel® Raptor Lake -S/R 14th/13th Gen Processor (Up to 65W)
- PCH Q670E/R680E
- 2 x SO-DIMM DDR5 5200 MHz up to 64GB
- 3 x LAN, 6 x USB3.1 , 2 x USB2.0, 2 x DisplayPort, 2 x HDMI, 1 x Line-out/Mic-in
- 2 x 2.5”SATA HDD/SSD Easy Swap Tray
- AC-IN 100~240V
- Operation Temp. ET: -20°C~ 60°C ; UT: -30°C~ 70°C
- Technical Profile
- Specifications
- Order Information
- Thermal Solution
- Introduction
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The ROC288B is a rugged industrial 1U 19” fanless server built on the Intel® Q670E/R680E Chipset. It delivers essential system functions including high-performance connectivity, modern manageability, and advanced security technologies. Powered by Intel® Raptor Lake-R/S 13th/14th Gen processors (up to 65W), the ROC288B supports DDR5 memory up to 64GB and offers versatile connectivity: 2 x DisplayPort, 2 x HDMI, 3 x 2.5GbE RJ45, 6 x USB 3.1 (10Gb/s), 2 x USB 2.0, and 2 x 2.5” SATA HDD/SSD easy-swap trays. It also features dual 3.5mm audio jacks (Mic-in, Line-out) and a wide AC input range of 90–260V.
Built for reliability in demanding environments, the ROC288B supports extended temperatures from -30°C to 70°C, making it ideal for industrial, commercial, and mission-critical applications requiring durable, high-performance computing.
- Intel® Raptor Lake-Refresh/ Raptor Lake-S processors
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Leveraging a fully upgraded hybrid performance architecture—combining high-performance and efficiency cores—along with the new LGA1700 socket and advanced chipsets, the ROC288B intelligently allocates computing power for demanding tasks. This design maximizes core performance, optimizes graphics and machine vision, and enhances AI inference, bringing advanced AI computing capabilities to the edge.
Equipped with an HDD/SSD easy-swap tray and multiple expansion slots, the ROC288B is the perfect choice for commercial and industrial platforms, process control, intelligent automation, and manufacturing applications.
- Appearance
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System |
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High Performance Processor |
14th/13th Gen Intel® Raptor Lake-R/Raptor Lake-S LGA1700 Socket Processor / Core i9/i7/i5/i3 Processor / TDP 65W |
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Memory type |
DDR5 5200 MHz / 2 x 262-pin SO-DIMM / Max. 64 GB (Non-ECC/ECC) |
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Chipset |
Intel® Q670E/R680E Chipset |
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| Expansion | 1 x PCIe expansion slot (PCIe x 16 HHHL) | |
| Display | ||
| DP | Resolution up to 4096 x 2304 @60Hz | |
| HDMI | Resolution up to 4096 x 2304 @60Hz | |
| Storage | ||
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HDD/SDD |
2 x 2.5” Solid State Disk (SSD) |
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| Ethernet | ||
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Ethernet |
Intel® I226-LM 2.5Giga LAN Intel® I226-V 2.5Giga LAN |
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| Front I/O | ||
| Easy Swap SSD Tray | 2 | |
| Button | 1 x Power Button w/Indicator LED | |
| Indicator LED | SSD | |
| Rear I/O | ||
| DisplayPort | 2 x DP | |
| HDMI | 2 x HDMI | |
| Ethernet | 3 x 2.5GbE RJ45 | |
| Audio | 1x MIC, 1x Line-Out | |
| USB Port | 6 x USB 3.1(10Gb/s) | |
| PCIe expansion | 1 x PCIe expansion slot (PCIe x 16 HHHL) | |
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AC-IN |
1 x AC-IN plug |
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| Power Requirement | ||
| Power Input | AC-IN 100~240V | |
| Applications, Operating System | ||
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Applications |
Commercial and Industrial Platforms, Embedded Computing, Process Control, Intelligent Automation and manufacturing applications |
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Operating System |
Windows 10/11 64Bit |
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Physical |
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Dimension (W x D x H) |
430 x400 x 44.4 mm |
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Chassis |
SECC |
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Heatsink |
Aluminum Alloy, Corrosion Resistant |
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Finish |
Anodic aluminum oxide |
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Environmental |
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Green Product |
RoHS design to meet |
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| Operating Temperature | ET : -20 to 60°C UT : -30 to 70°C |
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Storage Temperature |
-40 to 85°C |
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Relative Humidity |
5% to 95%, non-condensing |
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EMC |
CE and FCC design to meet |
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ROC288B-ET
1U 19” AC-DC Fanless System withIntel® Raptor Lake-R/S 14th/13th Processor(Up to 65W), Q670E/R680E, 2 x DDR5 SO-DIMM up to 64GB, 2 x DisplayPort, 2 x HDMI,6 x USB, 2 x USB2.0, 100~240V AC-IN , Operating Temp. -20~+60°C
ROC288B-UT
1U 19” AC-DC Fanless System withIntel® Raptor Lake-R/S 14th/13th Processor(Up to 65W), Q670E/R680E, 2 x DDR5 SO-DIMM up to 64GB, 2 x DisplayPort, 2 x HDMI,6 x USB, 2 x USB2.0, 100~240V AC-IN , Operating Temp. -30~+70°C
- Dual side thermal solution, fanless design for 1U slim size
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With combination of high CPU computing power and graphic GPU performance generate numerous heat, 7STARLAKE emphasizes on providing exceeding thermal design guarantee system offers superior performance under critical environment. Based on our experience, ROC286 adopts dual side thermal solution, with copper heat spreader directly touches the heat source components processor and graphic GPU to absorb the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid which can provide high efficiency heat transmission, the aluminum heat sink dissipates the heat into surrounding air promptly. Both side thermal solution is mainly for processor. With unique thermal design, 7STARLAKE is capable to integrate high power consumption CPU into 1U such slim size fanless system.
