AV600X-CH

AV600X-CH IP65 GPU Mission Computer
AV600X-CH Military GPU Computer
AV600X-CH SFF Military GPU Computer
AV600X-CH ilitary GPU Computer
AV600X-CH Military GPU Computer

Military Mission GPU Computer, Data Recorder

  • MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions
  • Data Recorder up to 32TB storage with RAID 0/1/5
  • Intel® 9th Gen. Coffee Lake (H) Xeon® E-2276ML processor
  • Up to 128GB DDR4 SO-DIMM, non-ECC and ECC
  • NVIDIA RTX™ A1000/A2000, 2048/2560 CUDA® cores, 4/8GB GDDR6
  • NVMe 3.0 512GB.(MB/sec, Max.) 3,400/3,200 MB
  • MIL-STD-461 18V~36V DC-Input (Options for MIL-704/1275)
  • Extreme Temperature : -40°C to +60°C
  • Optional with External GPU Turbo Kit
  • Dimensions : 250(W) x 325 (L) x 100 (H) mm

 Special Request :

  • Frame Grabber Card: 4CH 3G-SDI Input
  • Discrete IO : 4xDI 4xDO
  • Dual Redundant MIL-STD-1553 connections 
  • Dual ARINC 429 input connections 
  • Data Recorder: Up to 32TB SATA III SSD

 Intel Gold

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Introduction

AV600X-CH is driven by Intel® 9 Gen. Coffee Lake-H Xeon Processors. These processors are manufactured on Intel's most up-to-date and optimized 14 nm technology, up to 6 CPU cores. It is high computing performance and flexibility for heavier IoT workloads. The H-series processors are ideally suited for space-constrained and purpose-built designs. Multiple offerings for scalable performance, enhanced performance over previous generation with up to 6 cores.

AV700CH
Designed for Harsh Environment

AV600X-CH highlights on its rugged design and high functionality, the system especially installed MIL-STD Amphenol type connectors and full IP65 protection allow system withstand in any kind of harsh environment. AV600X-CH supports extended temperature from -40°C to 55°C and MIL-STD-461 18V~36V DC-input Power supply which can protect system from damages caused by sudden surge of voltage, thus further secure the reliability of its critical components and the system itself. 

Block Diagram
AV600X-CH Block Diagram
Appearance

System Diagram

4CH 3G-SDI Input(Option)

Video Distribution FPGA_Intel Xeon 4CH 3G-SDI

 

CE Verification
CE Verification

 

 

System

CPU

Intel® Xeon® E-2276ME, 45W Coffee Lake 9th Gen, 6C , Freq. 2.8 /4.5 GHz, 12MB cache

Intel® Xeon® E-2276ML, 25W Coffee Lake 9th Gen, 6C , Freq. 2.0 / 4.2 GHz, 12MB cache

Memory type

4 x 260 Pin DDR4 2400MHz SO-DIMM (up to 128GB, XEON®SKU support ECC)

CHIPSET

CM246

GPU

NVIDIA RTX™ A1000/A2000 embedded graphics

- Standard MXM 3.1 Type A (82 x 70 mm)

- 2048/2560 CUDA® cores, 16 RT Cores, and 64 Tensor Cores

- 6.66TFLOPS peak FP32 performance

- 4GB/8GB GDDR6 memory, 128-bit
On board Storage NVMe 3.0 512GB.(MB/sec, Max.) 3,400/3,200 MB

Expansion Slot

1 x M.2(M-key,Type: 2280 , SATA/PCIe 3.0 x 4 NVMe)

2 x Mini PCIe Full size (USB / PCIe and 1 x micro SIM Card)

1 x PCIe/104, 1 x FPE
TPM TPM 2.0 (SLB9665)

VIDEO INPUT

 4 Channel capture module for 4 x SMA male connectors >(optional)

Storage
SATA 1x 2.5” SSD, Up to 4x SSD for Data recorder

M.2

1x 2280 M key (SATA only)

Front I/O
DC-in 1x DC-in , with D38999 connector   
X1 1x DVI , with D38999 connector 
X2 1x DVI , with D38999 connector 
X3 2x GLAN + 3 x USB 2.0, with D38999 connector 
X4 4x RS232/422/485 + 4 BIT DIO, with D38999 connector  
LED 1x SSD/HDD LED indicator
switch 1x IP65 power button , with LED indicator

Power

Power input

MIL-STD -461 18V~36V DC-Input

Application, Operating System
Application Military Platforms Requiring Compliance to MIL-STD-810 Where Harsh Temperature, Shock, Vibration, Altitude, Dust and MIL-461 EMI Conditions.
Operating System Windows® 10 64-bit / Linux (support by request)

Physical

Dimension

250(W) x 325 (L) x 100 (H)mm, (L=395mm for Data recorder, Options)

Weight

10.5 Kg

Chassis

Aluminum Alloy

Heatsink

Heatsink Aluminum Alloy, Corrosion Resistant

Environmental

Green Product

RoHS, WEEE compliance

Operating Temp.

-40°C to +60°C

Storage Temp.

-40°C to +85°C

Relative Humidity

5% to 95%, non-condensing
MIL-STD-810 Method 507.5, Procedure II ( Temperature & Humidity )
Method 516.6 Shock-Procedure V Non-Operating ( Mechanical Shock )
Method 516.6 Shock-Procedure I Operating ( Mechanical Shock )
Method 514.6 Vibration Category 24/Non-Operating ( Category 20 & 24, Vibration )
Method 514.6 Vibration Category 20/Operating ( Category 20 & 24, Vibration )
Method 501.5, Procedure I ( Storage/High Temperature )
Method 501.5, Procedure II ( Operation/High Temperature )
Method 502.5, Procedure I ( Storage/Low Temperature )
Method 502.5, Procedure II ( Operation/Low Temperature )
Method 503.5, Procedure I ( Temperature shock )
Reliability No Moving Parts; Passive Cooling.
Designed & Manufactured using ISO 9001 / 2000 Certified Quality Program.
MIL-STD-461
CE102  :   10 KHz - 10 MHz
RE102-4 : 1.5 MHz -30 MHz - 5 GHz
RS103 :    200 MHz - 3.0 GHz - 5.0 GHz, 50 V/m equal for all frequencies
Designed to Meet Items ( Options )
CS101, CS114, CS115, CS116
CE106, RE103, RS101  
MIL-STD-1275 Steady State 20V-33V
  Surge Low 18V/500ms
  Surge High 100V/500ms

VERIFICATION of COMPLIANCE

Verification of Compliance