AV600-TH-A45

AV600 IP66 Military GPU Computer
AV600 IP66 Military GPU Computer
AV600 IP66 Military GPU Computer

AV600-TH-A45

Military IP66 Mission GPU Computer

  • MIL-STD-810 Thermal, shock, vibration, Humidity/EMI/EMC conditions
  • IP66 Chassis with D38999 connectors
  • Intel® 11th Gen Tiger Lake(H) W-11865MRE Processors, up to 8 cores
  • Up to 96GB DDR4 SO-DIMM, non-ECC and ECC
  • NVIDIA RTX A4500 8GB/16GB GDDR6 memory 5,888 CUDA cores
  • Soldered 64 GB NVMe
  • IP65 2 x 2.5” SATA SSD Easy Swap Tray
  • MIL-STD-461 18V~36V DC-Input (Options for MIL-704/1275)
  • Extreme Temperature: -40°C to +60°C
  • Dimensions: 250 x 325 x 100 mm (W x L x H)

 Special Request :

  • Optional IP66
  • Frame Grabber: 4 CH HD-SDI
  • Discrete I/O: 4 x DI, 4 x DO
  • Conformal coating on electronics 

Intel Partner 7STARLAKE

Download
Datasheet
e-DM
Get A Quote
  • Technical Profile
  • Specifications
  • Thermal Solution
  • Video
  • Download
Introduction

AV600X-TH-A45 is driven by Intel® 11 Gen. Tiger Lake-H Processors, integrated Intel® UHD Graphics (Xe architecture). Tiger Lake H processor is built on 10nm SuperFin Technology, up to 8 CPU cores and 4.7 GHz frequency. It is high computing performance and flexibility for heavier IoT workloads, the platform posts significant performance gains gen-over-gen with up to 32 percent gain in single-thread performance. It also features in high-bandwidth, high speed I/Os for expansion and peripherals.

AV600X-TH-A45 highlights on its rugged design and high functionality, the system especially installed MIL-STD Amphenol type connector and full IP66 protection allow system withstand in any kind of harsh environment. AV600X-THT supports extended temperature from -40°C to 70°C and MIL-STD-461 18V~36V DC-input Power supply which can protect system from damages caused by sudden surge of voltage, thus further secure the reliability of its critical components and the system itself.

AV700TH-T2

ARINC 429

 

Block Diagram
Appearance

 

System

CPU

Intel® 11 Gen Tiger Lake-H Processors, up to 8 cores, integrated Intel® UHD Graphics

Intel® Xeon® W-11865MRE, 45W Tiger Lake 11th Gen, 8C, Freq. 2.6/4.7 GHz, 24MB cache

Memory Type

Up to 96GB DDR4 SO-DIMM, non-ECC and ECC

Chipset

Intel® RM590E (support ECC, with Xeon CPU) /QM580E

GPU

NVIDIA RTX A4500 GA104-955 GPU

8GB/16GB GDDR6 memory, 5,888 CUDA cores
On Board Storage Soldered 64 GB NVMe

Expansion Slot

2 x Full-size mini PCIe (1 with mSATA supported)

-1 with mSATA/USB2.0/PCIeX1 support

-1 with SIM/USB2.0/PCIeX1 support

1 x 2280 M key (SATA only)

Storage

SATA

2 x 2.5” SSD, Swappable SSD/HDD slot

M.2

1 x 2280 M key (SATA only)

Front I/O

X1

2 x GbE LAN + 2 x USB 2.0 + 1 x COM (RS232) with D38999 connector 

X2

1 x VGA + 4 x DI/4x DO + 3 x RS422 with D38999 connector

X3

1 x USB 3.0, with D38999 connector  

X4

1 x USB 3.0, with D38999 connector  

X5

1 x DC-in, with D38999 connector   

LED

1 x SSD/HDD LED indicator

switch

1 x IP65 power button , with LED indicator

SSD

2 x 2.5”Easy swap SSD Tray

Power

Power input

MIL-STD-461 18-36V DC-Input

Application, Operating System
Application Military Platforms Requiring Compliance to MIL-STD-810 Where Harsh Temperature, Shock, Vibration, Altitude, Dust and MIL-461 EMI Conditions.
Operating System Windows® 10 64-bit /Linux (by request)

Physical

Dimensions

250 x 325 x 100 mm (L x W x H)

Weight

9 kg

Chassis

Aluminum Alloy

Heatsink

Heatsink Aluminum Alloy, Corrosion Resistant

Environmental

Green Product

RoHS, WEEE Compliance

Operating Temp.

-20°C to +60°C

Storage Temp.

-40°C to +85°C

Relative Humidity

5% to 95%, non-condensing
MIL-STD-810 Method 507.5, Procedure II (Temperature & Humidity)
Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)
Method 516.6 Shock-Procedure I Operating (Mechanical Shock)
Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)
Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration)
Method 501.5, Procedure I (Storage/High Temperature)
Method 501.5, Procedure II (Operation/High Temperature)
Method 502.5, Procedure I (Storage/Low Temperature)
Method 502.5, Procedure II (Operation/Low Temperature)
Method 503.5, Procedure I (Temperature shock)
Reliability No Moving Parts; Passive Cooling.
Designed & Manufactured using ISO 9001 / 2000 Certified Quality Program
MIL-STD-461 CE102: 10 KHz-10 MHz
RE102-4: 1.5 MHz -30 MHz -5 GHz
RS103:  200 MHz -3.0 GHz -5.0 GHz, 50 V/m equal for all frequencies
Designed to Meet Items ( Optional )
CS101, CS114, CS115, CS116
CE106, RE103, RS101  
MIL-STD-1275 Steady State 20-33V
Surge Low 18V/500ms
Surge High 100V/500ms