THOR200-X11-I2
2U Half Military 3G-SDI GPU Computer
- MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC
- Intel® Tiger Lake-H i7-11850HE, Xeon W-11865MLE Processors (up to 8 cores)
- NVidia Quadro MXM A2000 (2560 CUDA)
- Up to 64GB DDR4 SO-DIMM
- Dual CH 3G-SDI support 1080p60 H.264 H/W Encode
- 1 x Swappable SSD Tray
- DC 18V~36V ( Options MIL-STD-461 EMI Filter)
- Extreme Temperature : -40 ~+60 degree
- Technical Profile
- Specifications
- Order Information
- Download
- Introduction
-
THOR200-X11-I2 is driven by Intel 11th Gen. Tiger Lake-H processor. Tiger Lake processor supports outstanding CPU and graphics performance with up to 8 cores and 16 threads. THOR200-X11-I2 highlight on its rugged design and high functionality, the system especially installed MIL-STD D38999 connector and full IP65 protection allow system withstand in any kind of harsh environment. THOR200-X11-I2 supports extended temperature from -40°C to 60°C and wide range 18V~36V DC input can protect system from damages caused by sudden surge of voltage, thus further secure the reliability of its critical components and the system itself
- 3G-SDI(Serial Digital Interface)
-
Maintaining image quality when receiving analog and digital video over extended distances has proved challenging. However, high-definition, real-time image acquisition in wide areas is crucial for automatic intrusion detection, tracking, and classification of an unlimited number of threats.
As new technologies emerge to enable video transmission at lower data rates while preserving image quality, 3G-SDI, with a bitrate of 2.97 Gb/s, can transmit 1080p signals over distances up to 100 meters. This makes it a new star in high-end surveillance and unmanned systems, allowing simple designs or upgrades with full HD cameras.
By transmitting uncompressed video streaming over a single coaxial cable with ultimate low latency, 3G-SDI is particularly valued for its ability to transmit both video and audio signals through a single cable in an uncompressed, raw data format, ensuring high stability and maintaining the original data quality.
Most 3G-SDI connections utilize BNC connectors, known for their secure locking mechanism that prevents loosening and connectivity issues. This further enhances the reliability and stability of the connection, making it suitable for professional applications.
In summary, the 3G-SDI's robustness, ease of deployment, real-time high-resolution monitoring capabilities, and long-distance transmission support make it an indispensable tool in military deployment.
- Frame Grabber Card
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No machine vision system is complete without cameras and sensors. Frame grabber cards come into play to streamline the integration of cameras with computing systems. This crucial component enables the high-speed acquisition of high-resolution images with special synchronization features in real-time. Acting as the bridge between video cameras and computing systems by capturing individual images for analysis, frame grabber cards provide real-time data that can be processed using different machine vision algorithms depending on the application.
The THOR200-X11-I2, with its extremely compact size, enables users to capture up to 4 channels of SD, HD, or 3G-SDI video footage in real-time. It is a flexible solution that allows data to be captured from a wide range of sources, such as multi-faceted cameras and sensors. Designed with 3G-SDI standards, the THOR200-X11-I2 offers uncompressed H.264 digital video signal transmission, including embedded audio, and supports input resolutions up to 1920 x 1080 at 60/50fps. The SDI standard provides a nominal 2.970 Gbit/s interface, specifically suited for applications such as in-vehicle, broadcasting, and surveillance.
- System Diagram
- Appearance
- Block Diagram
| System | |
|---|---|
| Processor |
Intel® Core™ i7-11850HE, 2.6/4.7 GHz, 24MB, 45W, 8C/16T Intel® Xeon® W-11865MLE, 1.5/4.5 GHz, 24MB, 25W, 8C/16T |
| Memory type | Up to 64GB DDR4 SO-DIMM |
| Chioset | Intel® QM580E |
|
Graphic |
Embedded NVIDIA® RTX™ A2000 - Ampere Architecture - 2560 CUDA® cores, 20 RT Cores, and 80 Tensor Cores - 4/8GB GDDR6 memory, 128-bit |
| TPM | Chipset: Infineon, Type:TPM 2.0 |
| BIOS | AMI UEFI BIOS |
|
USB |
4 x USB 3.0 |
|
Ethernet |
2 x 10/100/1000 Ethernet Ports (1 X LAN form mini-PCIE LAN module card) |
| 3G-SDI | Dual CH 3G-SDI support 1080p60 H.264 H/W Encode |
|
Power Type |
18V ~ 36V DC IN MIL-STD 461 EMI DC Module |
|
Storage |
1 x2.5” SATA SSD (1 x Swappable SSD Tray) |
|
COM Port |
1 x RS232/422/485 (function select by jumper) |
|
Operating Temperature |
-40 to +60°C |
|
Dimension |
220mm(W) x 350mm(L)x88mm(H) |
| Front I/O | |
|
LAN(GbE) |
2 |
| USB 3.0 | 4 |
| DP | 2 |
| AUDIO | 1 x Line-in/1 x Mic-out |
| COM | 1 x RS232/422/485 |
| Power Button | 1 x W/LED |
| SSD LED | 1 |
| DC-IN | 1 x D38999 Connector |
| 3G-SDI | Dual CH BNC Connector |
| SSD Tray | 1 x Swappable SSD |
| Environmental | |
|
MIL-STD-810 Test |
Method 500.5, Procedures I and II (Altitude, Operation): 12,192M, (40,000 ft) for the initial cabin altitude (18.8Kpa or 2.73 Psia) Method 500.5, Procedures III and IV (Altitude, Non-Operation): 15,240, (50,000 ft) for the initial cabin altitude (14.9Kpa or 2.16 Psia) Method 501.5, Procedure I (Storage/High Temperature) Method 501.5, Procedure II (Operation/High Temperature) Method 502.5, Procedure I (Storage/Low Temperature) Method 502.5, Procedure II (Operation/Low Temperature) Method 503.5, Procedure I (Temperature shock) Method 507.5, Procedure II (Temperature & Humidity) Method 509.7 Salt Spray (50±5)g/L Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 24,Vibration) Method 514.6, Vibration Category 20/Operating (Category 20 & 24,Vibration) Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock) Method 516.6, Shock-Procedure I Operating (Mechanical Shock) |
| Reliability |
No Moving Parts; Passive Cooling. Designed & Manufactured using ISO 9001 Certified Quality Program. |
| MIL-STD-461 |
CE102 basic curve, 10kHz - 30 MHz CS101, 30 Hz~150 kHz CS114, 10 kHz~200 MHz CS115,50v/m CS116,50v/m RE102 2 MHz -2MHz to 18GHz RS103 2Mhz to 18GHz EN 61000-4-2: Air discharge: 8 kV, Contact discharge: 6kV EN 61000-4-3: 10V/m EN 61000-4-4: Signal and DC-Net: 1 kV EN 61000-4-5: Leads vs. ground potential 1kV, Signal und DC-Net: 0.5 kV CE and FCC |
| MIL-STD-1275 |
Steady State –25V~30V, Surge Low – 15V/500ms, Surge High – 100V/500ms Spikes Low -250/70uS Spikes High +250/70uS |
| Operating Temp. | -40°C to +60°C (ambient with air flow) |
| Storage Temp. | -40°C to +85°C |
| Relative Humidity | 5% to 95%, non-condensing |
| Attachment | Size |
|---|---|
| 7StarLake_System Test Report_THOR200-X11EHG2_20230415_0.pdf (3.22 MB) | 3.22 MB |