SK517-T7LCC
SK517-T7LCC
COM Express Type 7 Carrier Board w/PCIe 104, MXM, 9V~36V DC-IN, Extended Temp. -40°C to 85°C
- COM Express Type 7 Support Intel Ice Lake D-LCC Family Processor
- Support CPU D-1848TER, 10C, 57W with 1TB NVMe on board.
- Standard MXM Type 3.1 Support NVIDIA® Quadro® RTX/ Intel® Arc™
- Support NVIDIA® RTX PRO Blackwell 2000/5000, 3328/10496 CUDA cores
- Support NVIDIA® Lovelace RTX™, ADA 5000, 9728 CUDA cores.
- PCIe/104 Express Expansion Slot for Modular Open Structure
- Multi-Expansion Slots include Dual Mini PCIe Express Slots, 1x M.2 Slot
- Extreme Temperature Support -40°C to 85°C
- GPU supports 4 Displayport outputs
- Technical Profile
- Specifications
- Order Information
- Introduction
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A Computer-On-Module (COM) is a highly integrated computing board that consolidates the CPU, chipset, memory, and peripheral interfaces into a compact, modular component. COM Express Type 7 has emerged as one of the most versatile and scalable COM standards, supporting applications ranging from small-scale, cost-sensitive systems to high-end computing and data-intensive server-class solutions.
7StarLake’s SK517 COM Express module is designed around an open, scalable modular architecture, delivering exceptional computing performance and a comprehensive set of I/O interfaces. It supports high-bandwidth connectivity, advanced expansion capabilities, and is optimized to meet the diverse requirements of modern embedded and edge computing applications.
The SK517 Type 7 pin-out replaces traditional graphics support with multiple 10GbE-KR Ethernet ports and provides up to 32 PCIe lanes. This configuration makes Type 7 an ideal foundation for designing server-grade platforms that demand high data throughput and robust networking performance.
The SK517 supports a wide range of Intel® processors, including the Ice Lake D-LCC processor series, which feature advanced hybrid architectures combining performance and efficiency cores for optimized power utilization. In addition, the SK517 is engineered for operation in harsh environments, supporting an extended temperature range from –40°C to +85°C. With strong computing capability and an efficient thermal design, the SK517 is well suited for industrial, military/aerospace, and transportation applications.
- Edge Performance in a Compact, Secure Design
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Designed for high-performance edge computing, networking, and secure edge AI deployments, the Intel® Xeon® D-1700 and D-1800 processors deliver server-class compute capabilities, hardware-based security, and high-bandwidth I/O for embedded and rugged edge applications. Built on the Ice Lake-D architecture, these processors support high-bandwidth networks and peripherals, offer up to 10 cores, and are integrated into compact Ball Grid Array (BGA) packages, making them ideal for soldered-down designs in space-constrained and harsh environments.
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AI workloads acceleration
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Integrated Time Coordinated Computing (Intel® TCC)
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Server-grade performance and accelerated AI in rugged applications
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Support high-bandwidth networks and peripherals
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- Blackwell GPU for Next-Level AI Performance
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NVIDIA RTX PRO 2000 Blackwell Graphic Module:
- Blackwell architecture
- High-speed 16 GB GDDR7 Memory with ECC, 128-bit, 288 GB/s
- 4,352 CUDA® Cores CUDA, RT Core performance 52 TFLOPS
- Outputs 4 Channel Support
- Support mini DisplayPort 2.1
- Support DirectX 12, Shader Model 6.7, OpenGL 4.65, Vulkan 1.45, CUDA 12.8, OpenCL 3.0
NVIDIA RTX PRO 5000 Blackwell Graphic Module:
- Blackwell architecture
- High-speed 48 GB GDDR7 with ECC, 512-bit, 1,344 GB/s
- 14,080 UDA Cores, RT Core Performance 196 TFLOPS
- Outputs 4 Channel Support
- DisplayPort 2.1b Ready
- Support DirectX 12, Shader Model 6.6, OpenGL 4.63, Vulkan 1.33, CUDA 12.8, OpenCL 3.0
- Rich Expansion Slots
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SK517 provides rich expansion to make the whole solutions easier. We could use PCIe 104 related product SK506, SK303, SK1050 and SK1660S:
- StackPC-FPE form factor
- PCIe/104 stackable bus structure
- Reliable Ethernet technology from Intel i350-AM4 controllers
- Total 6 independent LAN connections (2 from host board, 4 from Intel controllers)
- Flexible options for Ethernets through RJ45 or 10 pin headers
- High-performing bridgeless design supporting PCI Express Gen 2.1 5GT/s
- Extended temperature -40 to 85°C
SK517 provides rich expansion to make the whole solutions easier. We could use PCIe 104 related product SK506, SK303, SK1050 and SK1660S：
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SK401:
- Stack PC form factor
- PCIe/104 stackable bus structure
- Reserve PCI/104 connector for different stacking criteria
- Extended temperature -40 to 85°C
- PCI/104-Express, PCI & PCIe connectors (w/StackPC design)
- PCIe/104 stackable bus structure
- PCIe to PCI adapter function
- COM: 4 x RS232/422/485 with 5V/12V selectable and isolation function
- Extended temperature -40 to 85°C
| System | |
|---|---|
| COM Express CPU Options (Type7) |
Intel® Xeon® D-1700/1800 processor (Ice Lake-D LCC) Xeon® D-1848TER 2.0/3.1GHz 15MB, 57W, 10C, with NVMe 1TB Xeon® D-1746TER 2.0/3.1GHz 15MB, 67W, 10C Xeon® D-1735TR 2.2/3.4GHz 15MB, 59W, 8C Xeon® D-1732TE 1.9/3.0GHz 15MB, 52W, 8C |
|
GPU Module Options |
NVIDIA® Quadro™ MXM A2000, 60W, 8GB GDDR6, 2560 CUDA Cores NVIDIA® Quadro™ MXM A4500, 80/115W, 16GB GDDR6, 5888 CUDA Cores NVIDIA® RTX PRO 2000 Blackwell, 60/100W, 8GB GDDR7, 3328 CUDA Cores NVIDIA® RTX™ MXM ADA 5000, 80/115W, 16GB GDDR6, 9728 CUDA Cores NVIDIA® RTX PRO 5000 Blackwell,95/115W, 24GB GDDR7, 10496 CUDA Cores |
|
COM Express Compatibility |
COM Express® Type 7 |
| Expansion | |
| Mini PCIe Expansion | 2 x Full-size Mini PCIe |
| M.2 Expansion | 1 x M.2 2280 M-key (PCIe Gen3, x4 NVMe) |
| MXM | 1 x MXM3.1 Type-B, PCIe3.0 support |
| PCIe/104 Expansion | 1 x Type 2: 2x PCIe x1+ 2x PCIe x4 |
| SIM slot | 2 x |
| Display | |
| Display port | 2 x DP (Each DP from MXM DP output) |
| Ethernet | |
| LAN1 | 1 x GbE from CPU module |
| LAN2 | 1x GbE (Intel i210IT) |
| LAN3~6 | 4 x 10GbE SFP+ (Intel C827 10G Retimer) |
| Internal I/O | |
| Display Port | 1 x Header with 2x DP ports |
| MXM_VGA | 1 x Header (By MXM GPU support) |
| SATA Port | 2 x SATA connector (Standard 7Pin) |
| SATA Power | 2 x SATA power connector |
| RJ45 LAN | 1 x Header with 2x LAN ports |
| COM | 4 x RS232/422/485 Header |
| USB | 2 x USB3.0 Header, each with 2x USB3.0 ports |
| DIO | 1 x DI/DO (4in/4out) Header |
| LPC | 1 x Header |
| I2C | 1 x Header |
| CPU FAN | 1 x CPU FAN connector |
| MXM FAN | 1 x MXM FAN connector |
| Battery | 1 x Battery connector |
| Front Panel | 1 x Header |
| Power System | |
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Input Power_SYS |
9V~36V (1x 4P Terminal Block) |
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Input Power_MXM |
12V (ATX 4P) |
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Power Consumption |
Varies per COM Express /MXM with different CPU and GPU models |
|
RTC Battery |
3V CR2032 |
| Mechanical and Environment | |
|
Dimensions |
190 mm x 210 mm |
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Operating Temperature |
-40°C to 85°C |
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Storage Temperature |
-40°C to 85°C |
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Relative Humidity |
10% to 90%, non-condensing |
| Standard Compliance | |
| Standard Compliance | CE/FCC |
| OS | |
| OS Support |
Windows®10 64-bit Linux (Support by request) |
COMe Type 7
|
Model Name |
Configurations |
|
SK517-D1848-BW50 |
CPU Board: D-1848TER /10C/ MXM GPU: Blackwell 5000 |
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SK517-D1848-Ad50 |
CPU Board: D-1848TER /10C/ MXM GPU: Lovelace Ada5000 |
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SK517-D1848-BW20 |
CPU Board: D-1848TER /10C/ MXM GPU: Blackwell 2000 |
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SK517-D1746-A45 |
CPU Board: D-1746TER/10C / MXM GPU: Quadro A4500 |
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SK517-D1746-A20 |
CPU Board: D-1746TER/10C / MXM GPU: Quadro A2000 |
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SK517-D1735-A45 |
CPU Board: D-1735TR /8C/ MXM GPU: Quadro A4500 |
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SK517-D1735-A20 |
CPU Board: D-1735TR /8C/ MXM GPU: Quadro A2000 |
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SK517-D1732-A45 |
CPU Board: D-1732TE/8C / MXM GPU: Quadro A4500 |
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SK517-D1732-A20 |
CPU Board: D-1732TE /8C/ MXM GPU: Quadro A2000 |
