SK517-T7LCC

SK517 Top Right view
SK517 Bottom Right view
SK517+CPU+MXM_GPU_前視圖.png
SK517+CPU+MXM_GPU_左前視圖.png

COM Express Type 7 carrier board w/PCIe 104, MXM, 9V~36V DC-IN, Extended Temp. -40 to 85°C

  • COM Express Type 7 Support Intel Ice Lake D-LCC Family Processor
  • Standard MXM Type 3.1 Support NVIDIA® Quadro® RTX/ Intel® Arc™
  • PCIe/104 Express Expansion Slot for Modular Open Structure
  • Multi-Expansion Slots include Dual Mini PCIe Express Slots, 1x M.2 Slot
  • Extreme Temperature Support -40 to 85°C
  • GPU can be targeted for 4 Displayport outputs
  • Intel Gold

 

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  • Technical Profile
  • Specifications
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 Introduction

Computer-On-Module (COM), is a highly integrated board with CPU, chipset, memory, and peripherals designed into a component module.

COM Express Type 7 has also become the most versatile and most scalable COM standard supporting everything from small-scaled and cost-sensitive applications up to high-end computing and graphics-intensive solutions.

7StarLake’s SK517 COM Express defines Open Scalable Modular Architecture platform which is ensuring amazing computing performance and offering a broad range of I/O interfaces including intense graphics support, Digital Display Interfaces (Display Port, HDMI) and super-fast USB 3.0 to serve all kind of different application requirements.

SK517 pin-out Type 7 is replacing the graphics support by offering multiple 10GbE-KR ports and defining 32 PCIe lanes. The Type 7 is an ideal definition to design server-grade platforms for applications requesting high data and network throughput.

SK517 support a wide range of Intel processors, from Ice Lake D-LCC porcessors series, feature advanced hybrid architecture with Performance and Efficient cores for optimized power usage. What’s more, SK517 has the capability to operate in harsh environment. It accepts the extend range of temperature from -40 to 85°C. With outstanding computing capability and efficient thermal design, SK517 is very suitable for industrial, military/aerospace and transportation.

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Rich Expansion Slot

SK517 provides rich expansion to make the whole solutions easier. We could use PCIe 104 related product SK506, SK303, SK1050 and SK1660S：

12

 

 

  1. StackPC-FPE form factor 
  2. PCIe/104 stackable bus structure 
  3. Reliable Ethernet technology from Intel i350-AM4 controllers 
  4. Total 6 independent LAN connections (2 from host board, 4 from Intel controllers) 
  5. Flexible options for Ethernets through RJ45 or 10 pin headers 
  6. High-performing bridgeless design supporting PCI Express Gen 2.1 5GT/s 
  7. Extended temperature -40 to 85°C

 

  • SK401:
  1. Stack PC form factor 
  2. PCIe/104 stackable bus structure 
  3. Reserve PCI/104 connector for different stacking criteria 
  4. Extended temperature -40 to 85°C

 

401

3
  1. PCI/104-Express, PCI & PCIe connectors (w/StackPC design)
  2. PCIe/104 stackable bus structure 
  3. PCIe to PCI adapter function 
  4. COM: 4 x RS232/422/485 with 5V/12V selectable and isolation function 
  5. Extended temperature -40 to 85°C

 

 

  • NVIDIA Ampere RTXA A4500 MXM 3.1 Graphics Module:
  1. Powered by NVIDIA Quadro® A4500 
  2. MXM 3.1Type-B Module  
  3. High-speed 16GB GDDR6 Memory, 256-bit, 512GB/s
  4. 5,888 new-gen. Pascal architecture CUDA cores, 17.66TFLOPS
  5. Outputs 4 Channel Support
  6. Display Port 1.4 Ready
  7. Support NVIDIA CUDATM, OptimusTM, DirectX® 12, OpenGL® 4.6
MXM A2000

 

MXM A2000
  • NVIDIA Ampere RTXA2000 MXM 3.1 Graphic Module:
  1. Powered by NVIDIA Quadro® A2000 
  2. MXM 3.1 Type-A Graphics Module 
  3. High-speed 8GB GDDR6 Memory, 128-bit, bandwidth 224GB/s
  4. 2,560 new-gen. Pascal architecture CUDA cores, 8.25TFLOPS
  5. Outputs 4 Channel Support
  6. Display Port 1.4 Ready
  7. Support NVIDIA CUDATM, OptimusTM, DirectX® 12, OpenGL® 4.6

 

 

 

System
COM Express CPU Options(Type7)

Intel® Xeon® D-1700 processor (Ice Lake-D LCC)

•Xeon® D-1746TER 2.0/3.1GHz 15MB, 67W, 10C

•Xeon® D-1735TR 2.2/3.4GHz 15MB, 59W, 8C

•Xeon® D-1732TE 1.9/3.0GHz 15MB, 52W, 8C

GPU Module Options

NVIDIA® Quadro® A4500, 80/130W, 16GB GDDR6 256bit, 5,888 CUDA Cores

NVIDIA® Quadro® A2000, 35/60/80W, 8GB GDDR6 128bit, 2,560 CUDA Cores

COM Express Compatibility

COM Express® Type 7
Expansion
Mini PCIe Expansion 2x Full-size Mini PCIe
M.2 Expansion 1x M.2 2280 M-key (PCIe Gen3, x4 NVMe)
MXM 1x MXM3.1 Type-B, PCIe3.0 support
PCIe/104 Expansion 1x Type 2: 2x PCIe x1+ 2x PCIe x4
SIM slot 2x 
Display
Display port 2x DP (Each DP from MXM DP output)
Ethernet
LAN1 1x GbE from CPU module
LAN2 1x GbE (Intel i210IT)
LAN3~6 4x 10GbE SFP+ (Intel C827 10G Retimer)
Internal I/O
Display Port  1x Header with 2x DP ports
MXM_VGA 1x Header (By MXM GPU support)
SATA Port  2x SATA connector (Standard 7Pin)
SATA Power 2x SATA power connector
RJ45 LAN 1x Header with 2x LAN ports
COM  4x RS232/422/485 Header
USB 2x USB3.0 Header, each with 2x USB3.0 ports
DIO 1x DI/DO (4in/4out) Header 
LPC 1x Header
I2C 1x Header
CPU FAN 1x CPU FAN connector
MXM FAN 1x MXM FAN connector
Battery 1x Battery connector
Front Panel 1x Header
Power System

Input Power_SYS

9V~36V (1x 4P Terminal Block)

Input Power_MXM

12V (ATX 4P)

Power Consumption

Varies per COM Express /MXM with different CPU and GPU models

RTC Battery

3V CR2032
Mechanical and Environment

Dimensions

190mm x 210mm

Operating Temperature

-40°C to 85°C

Storage Temperature

-40°C to 85°C

Relative Humidity

10% to 90%, non-condensing
Standard Compliance
Standard Compliance CE/FCC
OS
OS Support

Windows®10 64-bit

Linux(Support by request)

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