OXY5741A
- 9th / 8th Gen Intel® Xeon® / Core™ processor with up to 6 Intel® Xeon® E-2276ME / Xeon® E-2276ML / Core™ i7-9850HE / Core™ i7-9850HL / Core™ i5-8400H
- PCIe/104 stackable bus structure(Type 2)
- FPE connector ( 1*PCIe x16 or 2*PCIe x8 or 1*PCIe x8+2*PCIe x4)
- 4x DDR4-2666MHz SO-DIMM , up to 128GB, ECC for Xeon® SKU
- Multi display” Triple simultaneous displays with 48-bit LVDS+DP
- 1x M.2 2280 M-key, 2x Full size mPCIe, 1x PCIe/104, 1x FPE
- Dual GbE, 4x SATA III, 2x RS232/422/485
- 6x USB3.0, 4x USB2.0
- Extended operating temp. -40 to 85°C
- Technical Profile
- Specifications
- Video
- Download
- Introduction
-
7STARLAKE, the leading pioneer in ruggedised and embedded systems, introduces the latest EBX SBC OXY5741A. The EBX SBC measures 243*146 mm, providing extraordinary computing performance under extreme environment. It is powered by 9th / 8th Gen Intel® Xeon® / Core ™. Featuring Intel’s Xeon E-2276ME and ruggedised open-standard EBX architecture, 7STARLAKE EBX series is built tentatively and triumphs on environmental testing. It still operates effectively under harsh environments ranging from -40°C to 85°C so that it is a perfect solution for defence, transportation, and automation applications. More key functions such as stackable PCIe/104 expansion ability, flexible I/O, and NVMe Gen 3.0 PCIex4 for fast and large capacity storage, all contribute to this versatile architecture that can meet clients’ needs.
- Key Features
-
- 9th / 8th Gen Intel® Xeon® / Core ™ processor with up to 6 cores and 45W/25W TDP
- EBX SBC Dedicates PCIe/104 Type 2
- Dual channel DDR4-2666MHz with up to 128GB *, ECC for Xeon SKU
- Three simultaneous displays with 48 bit LVDS + HDMI + DP
- USB 3.0, TPM 2.0 and NVMe / PCIe Gen3x4 SSD
- Dual GbE, SATA III, RS-232/422/485
- M.2 M-Key 2280 and Full size mPCIe(one support SIM card)
- What is Small Form Factor (S.F.F)?
-
Small form factor computer is the crucial component that drives the entire system operation as they can fit into smaller spaces and consume less power. They can be packaged and mounted in diverse ways than larger boards. The reduction of size, weight, and cost (SWaP) has been continuously emphasised as more computer systems demand smaller processor and network connectivity solutions. As a result, application such as automation and transportation which demand more differently stackable ways often employ small form factors architecture.
- DDR4 2666 128GB Optimised Performance
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Since speed and power matters most in computing performance, OXY5741A is built in 4 x SO-DIMMs up to 128GB to deliver optimisation of the performance. Adding DDR4-128GB not only maximises CPU and computing performance, but also enables more robust and responsive virtual machines and applications. Taking advantage from the cutting edge DRAM technology, OXY5741A EBX XEON SBC can optimise system performance by accelerating the memory capacities of servers.
- Ruggedised Open Standard PCIe/104 Facilitate Flexible Expansion
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Choosing an embedded architecture for computer systems can be a formidable task. This kind of stackable and mezzanine architecture often results in tradeoffs that include off-the-shelf or custom design requirements. PCIe/104 compact, ruggedised, easily expandable traits support a lot of expansion flexibility in systems. This architecture evolved to address these resulting issues by keeping the common background while eliminating limitations. OXY5741A employs PCIe/104 technology to reduce constraints and create flexibility of expansion. Its M.2 extension offers M-key 2280, and PCIe 3.0 x 4 NVMe. Additionally, OXY5741A provides 3.0 ports for data redundancy by supporting RAID 0/1.
- High Performance and Fast Storage
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Today, ruggedised systems or computers are expected to possess speedy and smooth response times. In light of making these systems render high performance, NVMe protocol delivers a high-bandwidth and low-latency user experience. Moreover, via accessing a PCIe bus that supports a huge number of parallel command queues, NVMe can effortlessly access flash storage. This platform incorporates Intel® Xeon E-2276ME with 4 cores. OXY5741A supports up to 128GB of dual-channel DDR4 2400MHz memory and features an M.2 M-Key 2280 slot for NVMe / PCIE Gen3x4 high-speed PCIe SSD storage, thus offering extremely high data speeds for processing. The above features make OXY5741A an outstanding solution for applications that demand high performance in a EBX form factor.
- Board Placement
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|
System |
|
|---|---|
|
CPU |
Intel® Core™ i7-9850HE Processor (6 Cores/12 Threads, 9M Cache, up to 4.40 GHz), 45W Intel® Core™ i7-9850HL Processor (6 Cores/12 Threads, 9M Cache, up to 4.10 GHz), 25W Intel® Xeon® E-2276ME Processor (6 Cores/12 Threads, 12M Cache, up to 4.50 GHz), 45W Intel® Xeon® E-2276ML Processor (6 Cores/12 Threads, 12M Cache, up to 4.20 GHz), 25W Intel® Core™ i5-8400H Processor (6 Cores/12 Threads, 8M Cache, up to 4.20 GHz), 45W |
|
Memory Type |
4 x 260 Pin DDR4 2400MHz SO-DIMM (up to 128GB, XEON®SKU support ECC) |
|
Chipset |
CM246 |
|
BIOS Core |
AMI UEFI BIOS |
|
BIOS Flash |
SPI Flash |
|
TPM |
TPM 2.0(SLB9665) |
|
iAMT |
iAMT 12.0 |
|
Watchdog |
1-255 sec. or 1-255 min. software programmable and can be generate system reset |
|
Expansion slot |
|
|
M.2 |
1x M.2(M-key,Type: 2280 , SATA/PCIe 3.0 x4 NVMe) |
|
Mini PCIe |
2x Full size (USB / PCIe and 1x micro SIM Card) |
| FPE | 1x |
|
PCIe/104 |
1x TYPE 2 |
|
Display |
|
|
Chipset |
Intel® UHD Graphics 630 |
| LVDS | Dual channel 24-bit LVDS, up to 1920 x 1080 @ 60Hz |
|
Display Port |
Up to 4096 x 2304 @ 60Hz |
|
Multi-Display |
Triple simultaneous displays with 48-bit LVDS+DP |
|
Ethernet |
|
|
Chipset |
Intel® I210 & I219LM GbE LAN(10/100/1000 Mbps supported) |
|
WOL |
Yes |
|
Boot from LAN |
Yes for XPE |
|
Audio |
|
|
Codec |
ALC888S |
|
Rear I/O |
|
|
Display Port |
2x |
|
USB |
4x USB3.0 |
|
LAN |
2x |
|
Front I/O |
|
|
PW Button |
1x |
|
USB |
2x USB3.0 |
|
Internal I/O |
|
|
USB2.0 |
4x |
|
GPIO |
4x DI/4x DO |
|
SATAIII |
4x (0,1,5 RAID) |
|
DP |
1x |
|
Audio |
1x Line-out /1x Mic-in) |
|
Serial |
2x RS232/422/485 autoflow control |
|
DC connector |
1x |
|
LVDS Inverter |
1x |
|
LVDS connector |
1x |
|
LPC |
1x |
|
System Fan |
1x |
|
Front Panel Control |
1x Power LED, HD LED, Reset, Power Switch, Buzzer |
|
Mechanical and Environmental |
|
|
Form Factor |
EBX |
|
Power Type |
12V DC-IN |
|
Power Consumption |
180W |
|
Dimension |
146mm X 243mm |
|
Operating Temperature |
-40℃ to 85℃ |
|
Storage Temperature |
-40℃ to 85℃ |
|
Relative humidity |
10% to 90%, non-condensing |
| Standard Compliance | |
| Standard Compliance | CE/FCC |
| OS | |
| OS Support |
Windows®10 64-bit Linux(Support by request) |
| Attachment | Size |
|---|---|
| OXY5741A_Class A.pdf (749.57 KB) | 749.57 KB |