SR200-X3
Military GPU Computer ,Intel i7-7820EQ , Quadro® RTX A1000 , 9V~36V DC-IN, Extended Temp. -40°C to 60°C
- MIL-STD 810 Thermal, Vibration, Shock
- SFF MIlitary GPU Computer
- Intel 7th Gen. i7-7820EQ Processor
- DDR4 Up to 32GB RAM
- NVIDIA® Quadro® MXM A1000 GPU
- 9V~36V Wide Range DC Input
- Extended Temperature -40°C to 60°C
- Technical Profile
- Specifications
- CPU
- Thermal Solution
- Video
- Download
Introduction
SR200-X3, EBX rugged system is a powerful system that is driven by Intel® 7th generation Kabylake CPU and chipset soldering onboard, integrated with Nvidia GPU 1050Ti CUDA 768 GDDR5-4GB/GTX 1650 CUDA896 GDDR5-4GB/GTX 1660S CUDA1408 GDDR6-6GB GPU that supports 2 independent DisplayPort. Processor i7-7820EQ plus Intel® QM175 chipset supports clock speed 2.8GHz, up to 3.5GHz. Quad cores, turbo up to 8 cores to cope with enormous data computing. Apart from computing power, the system is able to survive in harsh environment from -40 to 60°C, and ruggedness for vibration and shock is proven to pass MIL-810G standard. With the combination of high CPU computing power and rich display inputs, SR200-X3 is a perfect portable solution for rugged consoles & workstations, transportation, defense control room to share instant and accurate information on huge screen for in-time solutions.
- Thermal solution for fanless system design
-
7starlake designs a unique enclosure that is able to stack together both horizontally and vertically. The aluminum heat sink enclosure allows dual-sided heat dissipation. 7starlake exclusively adopts special heat radiating material and combining with special CNC cutting, further forged into a lavish sophisticated metal. Apart from the special heat sink enclosure, SR200-X3 innovatively adopts two kinds of copper heat spreader. The shape and the size of the spreader are tailor-made based on the heat sources placement of CPU module and graphic module. In view of the gap difference between motherboard and heat sink, 7starlake builds two heat spreaders in different thicknesses. Combining all these exclusive thermal designs can alternatively replace traditional fan, and also ensures high reliability and stability while working under wide range temperature from -40°C to 60°C
- System main board: EBX SBC-OXY5739A
-
1. Intel® Core i7 CPU soldering onboard
SR200-X3 is based on EBX SBC—OXY5740A, powered by Intel Kabylake i7-7820EQ quad core processor plus QM175 chipset soldered onboard. With CPU soldering onboard, there is less conduction of heat and high density interconnection between the motherboard and the components, which reduces the MB from the crisis of overheating. Apart from overheating, soldering onboard also provides the best level of shock and vibration protection, removing the unnecessary concern about poor connection that CPU socket type may bring.
2. Two Independent DisplayPort
SR200-X3 has added on NVIDIA graphic card through PCIe/104 interface, supporting 4 independent DisplayPort which is driven by GPU NVIDIA®1050Ti CUDA 768 GDDR5-4GB/GTX 1650 CUDA896 GDDR5-4GB/GTX 1660S CUDA1408 GDDR6-6GB GPU. Representing its high computing performance and consumes power at 55W maximum. Connecting by PCIe/104 interface which enhance the resistance of shock and vibration as the connector allows nearly seamless connecting.
3.Wide Range DC input
For military and heavy duty vehicle applications, instable voltage always brings headaches about damaging the electric components. SR200-X3 supports 9V to 36V DC-in, the flexible acceptance of inconsistent power input makes it capable of surviving tough engine cranks and transient over-voltage situations.
Operating Temp. |
|
---|---|
-40°C to 60°C |
|
System |
|
CPU |
Intel® Core™ i7-7820EQ Processor (8M Cache, up to 3.70 GHz), 45W |
GPU |
Quadro® A1000 CUDA 2048 GDDR6-4GB |
Chipset |
Intel® QM175 |
Memory Type |
DDR4 Up to 32GB RAM |
NAND Flash |
mSATA Up to 1TB |
BIOS |
AMI® UEFI BIOS |
Super I / O |
ITE8786 |
Watchdog |
1-255 sec. or 1-255 min. software programmable, can generate system reset |
Expansion Slot |
1x Full-size mPCIe ( w/ SIM card and mSATA supported ) |
Display |
|
Chipset |
NVIDIA RTX A1000 |
Display Type |
Resolution up to 3840 x 2160@60Hz |
DVI-I |
Resolution up to 1920 x 1200@60Hz |
Ethernet |
|
Chipset |
Intel® I210-IT & I219-LM GbE LAN |
WOL |
Yes |
Boot from LAN |
Yes for PXE |
Rear I/O |
|
Ethernet |
2x RJ45 Gigabit Ethernet LAN Interfaces |
DisplayPort |
2x 20Pin DisplayPort connectors ( Female ) |
USB |
2x USB3.0 standard-A connectors |
DVI-I |
1x DVI-I connector ( Female ) |
Audio |
2x 3.5mm Audio Jacks ( 1 x MIC, 1 x Line-Out ) |
Serial Port |
1x RS-232 / 422 / 485 |
Front I/O |
|
Button |
1x Power Button |
Indicator LED |
Power, HDD, LAN ( Link / Active / Speed ) |
DisplayPort |
2x 20 Pin DisplayPort connectors ( Female ) |
USB |
2x USB3.0 standard-A connectors |
DC-IN |
1x 4P Rugged Terminal connectors |
OS support list |
|
Windows |
Windows 8 x32 / x64、Windows 8.1 x32 / x64、Windows 10 x32 / x64 |
Linux |
Fedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04 |
Mechanical and Environment |
|
Form Factor |
EBX |
Power Type |
9V~36V DC-IN |
Weight |
4.3 Kg (9.47 lbs) |
Dimension |
308 x 149 x 76mm |
Operating Temp. |
-40°C to 60°C ( ambient with air flow ) |
Storage Temp. |
-40°C to 85°C |
|
|
The SR200-X3 offers highly effectively heat conductive and heat convective thermal solutions to meet the demands of customers' extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.
Device Model |
SR200-X3 |
Tester |
Robin Chang |
Test Result |
Pass |
Test Temperature |
High 0°C~60°C / Low -40°C~0°C |
Test Time |
11.5 Hours / 3 Hours |
Test Standard |
Reference IEC60068-2 |
Test Software |
Burnin test v6.0 |
Criteria |
After testing, system can't halt |
- Test Configuration
-
Device
Configuration
CPU Type
Intel® Core i7-7820EQ 3.0GHz 45W
PCH
Q170
Memory
1 x DDR4 2400 XR-DIMM up to 16GB w/ECC
Memory
1 x DDR4 2400 SO-DIMM up to 16GB w/ECC
Graphic
NVIDIA 1050Ti 75W
LAN1
Intel® I219 GbE LAN
LAN2
Intel® I210 GbE LAN
Test Software
Burnin test v6.0、AS SSD、 Intel Extreme Tuning Utility、
iperf GPU-Z、FurMark v1.9.2Chamber
KSON THS-b4t-150
Chipeng SMO-3
- Thermal Measurement
-
7starlake provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus 7starlake conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, 7starlake is able to analyses the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 9 hours which at each temperature point we burn in SR200-X3 for two hour, from 40°C to 60°C.
SR200-X3 MB HeatSink - IO Performance
OXY5740+NV1050Ti
CPU
i7-7820EQ 3.0GHz 45W
GPU
NVIDIA 1050Ti 75W
Ambient temperature
25°C
50°C
55°C
60°C
CPU Temp.
97°C
100°C
100°C
100°C
CPU Frenquency (GHz)
3.34GHz
2.84GHz
2.84GHz
2.46GHz
GPU Temp.
82°C
90°C
96°C
96°C
GPU Frenquency (GHz)
1.57GHz
1.3GHz
1.2GHz
835MHz
Effective cooling solution for maximum heat dissipation:
7STARLAKE implements unique cooling solution with heat spreader and aluminum heat sink for maximum heat dissipation. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of aluminum, the heat spreader touches the heat source - processor and chipset and absorbs the heat rapidly, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, SR200-X3 can ensure high reliability and stability while working under wide range temperature from -40 up to 60°C.
Attachment | Size |
---|---|
SR200_CE_Verification_ Of_Compliance.pdf (721.5 KB) | 721.5 KB |
SR200_FCC_Verification_ Of_Compliance.pdf (363.65 KB) | 363.65 KB |
SR200&SR700_Vibration_Test_Report_7.pdf (1.24 MB) | 1.24 MB |
SR200_Shcok_Test Report_8.pdf (1.22 MB) | 1.22 MB |