ROC250-D17

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Military 1U Short Depth Xeon DE (Ice Lake) Fanless Server

  • Ultra-High Performance Intel® Xeon® Ice Lake D-1749NT (10xC)
  • MIL-STD 810 Vibration, Shock, Thermal
  • Short Depth 380mm, Fanless Cooled
  • Up to 128GB RDIMM/64GB UDIMM, 2CH DDR4 2933MHz in 2 Slots
  • 4xNVMe (Gen 4.0) U.2 
  • 2 x 25Gigabit Ethernet, 2 x 10Gigabit Ethernet, 1 x IPMI
  • 1 x VGA , 2 x USB 3.0 Ports ,1 x PCIe 4.0 x 8 Expansion Slot
  • Extended Temperature -20 to 60 °C
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  • Technical Profile
  • Specifications
  • Order Information

Introduction

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Intel® Xeon® D-1700 and D-2700 processors are high-performance SoCs with integrated Ethernet in high-density Ball-Grid Array packages. They deliver server-class computing, hardware-based security, and high-bandwidth I/Os for embedded and rugged applications at the edge.​

The Intel® Xeon® D-1700 and D-2700 processors with up to 20 cores, with Integrated AI acceleration, support for hard-real-time workloads, extreme temperature range and industrial use conditions.1 This makes them ideal for demanding applications in high-bandwidth video analytics, as well as manufacturing, aerospace, etc.

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Intel® Xeon® D processors, enhanced for IoT, are a high-density platform that packs server-class computing and I/Os, plus accelerated AI, into compact BGA packages for soldered-down embedded and rugged designs. ​

Extended operating temperature ranges and industrial-class reliability make Intel® Xeon® D-1700 and D-2700 SoCs ideal for high-performance rugged equipment and sealed fanless devices that must run nonstop in the toughest environments.​

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MAIN FEATURE
  • Ultra-High Performance Intel® Xeon® Ice Lake D-1749NT (10xC)
  • MIL-STD 810 Vibration, Shock, Thermal
  • Short Depth 380mm, Fanless Cooled
  • Intel® Xeon® ICELAKE-D LCC D-1749NT 10 Cores Processor
  • Up to 128GB RDIMM/64GB UDIMM, 2CH DDR4 2933MHz in 2 Slots
  • 4xNVMe (Gen 4.0) U.2 
  • 2 x 25Gigabit Ethernet, 2 x 10Gigabit Ethernet, 1 x IPMI
  • 1 x VGA , 2 x USB 3.0 Ports ,1 x PCIe 4.0 x 8 Expansion Slot
  • Extended Temperature -20 to 60 °C
MIL-STD Environment
  • Operating Temperature High: 50°C, MIL-STD-810G, Method 501.5, Procedure I
  • Operating Temp Low: 0°C, MIL-STD-810G, Method 502.5, Procedure I
  • Non-Operating Temperature High: 70°C, MIL-STD-810G, Method 501.5, Procedure II
  • Non-Operating Temperature Low: -40°C, MIL-STD-810G, Method 502.5, Procedure II
  • Operating Altitude: Up to 15,000 ft., MIL-STD-810G, Method 500.5
  • Non-Operating Altitude: Up to 45,000 ft., MIL-STD-810G, Method 500.5
  • Humidity: MIL-STD-810G, Method 507.5, Procedure Ib (Natural Cycle B3)
  • Shock: MIL-STD-810G, Method 516.6, 30 g’s, Saw-tooth, 11ms & MIL-DTL-901E, Grade A, Class II; Type B
  • Vibration: MIL-STD-167, Type I, Deck Mounted Equipment
  • EMI/EMC: MIL-STD-461F, RE101, RE102 (Shipboard Level 1), RS103, CE101, CE102, CS101, CS114, CS116
  • Airborne Noise: MIL-STD-740-1 compliance: 43.7dBA (Idle), 52.5dBA (50%), 54.6dBA (80%).

 

System

High Performance

Processor

Intel® Xeon® ICELAKE-D LCC Processor D-1749NT (Frequency 2.5GHz) 10-Core,20 Thread Support

Memory type

Up to 128GB RDIMM/64GB UDIMM, 2CH DDR4 2933MHz

Chipset

System on Chip

Expansion Slot

1 x PCI-E 4.0 x 8

Display

VGA

Resolution up to 1920×1200@60Hz

Storage

Storage Device

4 x NVMe Gen 4.0 

Ethernet

Ethernet

2 x Intel 25GbE SFP28 (SoC)

2 x 10GBase-T (Intel X550-AT2)

Front I/O

Button

1 x Power Button w/Indicator LED

Indicator LED

1 x HDD LED

SSD Tray

4 x NVMe Gen 4.0

REARI/O

Ethernet

2 x SFP28 25Gigabit Ethernet LAN Interfaces

2 x RJ45 10Gigabit Ethernet LAN Interfaces

1 x IPMI LAN Interface

VGA Port

1 x DB15 connector

USB Port

2 x USB3.0 standard-A connectors

AC-IN

1 x IEC C14 Plug

Power Requirement

Power Input

AC100~240V

MIL-STD-461 EMI 18~36V 300W

DC 12V

Applications, Operating

Applications

Commercial and Military Platforms Requiring Compliance to MIL-STD-810G

Embedded Computing, Process Control, Intelligent Automation and

manufacturing applications where Harsh Temperature, Shock, Vibration,

Altitude, Dust and EMI Conditions.

Used in all aspects of the military

Operating System

Windows 10 64Bit, Windows Server 2008 R2, Windows Server 2012 R2

Ubuntu14.04, Fedora 20/23, RedHat Linux EL 7.1/7.2, Vmware ESXi 6.0, ESXi 6.5

Physical

Dimension (W x D x H)

430 x 380 x 44.6mm

Weight

5.75kg(12.68lbs)

Chassis

SECC

Finish

Anodic aluminum oxide (Black)

Cooling

Natural Passive Convection/Conduction. No Moving Parts

Ingress Protection

Dust Proof (Similar to IP40)

Environmental

MIL-STD-810G

Test

Method 507.5, Procedure II (Temperature & Humidity)

Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)

Method 516.6 Shock-Procedure I Operating (Mechanical Shock)

Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)

Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration)

Method 501.5, Procedure I (Storage/High Temperature)

Method 501.5, Procedure II (Operation/High Temperature)

Method 502.5, Procedure I (Storage/Low Temperature)

Method 502.5, Procedure II (Operation/Low Temperature)

Method 503.5, Procedure I (Temperature shock)

Operating Temperature

-10 to 60°C (ambient with 0.7m/s airflow)

Storage Temperature

-40 to 85°C

EMC

CE and FCC compliance

ROC250-D17-10C-12V-4N

MIL-STD-810G 19" 1U Short Depth Fanless Server with Intel® Xeon® ICELAKE-D LCCD-1749NT Processor, 1 x VGA, 1 x IPMI , 2 x25 Gigabit Ethernet, 2 x10 Gigabit Ethernet, 2 x USB 3.0 Port, DC 12V, 4NVMe

ROC250-D17-10C-18V-2N

MIL-STD-810G 19" 1U Short Depth Fanless Server with Intel® Xeon® ICELAKE-D LCCD-1749NT Processor, 1 x VGA, 1 x IPMI , 2 x25 Gigabit Ethernet, 2 x10 Gigabit Ethernet, 2 x USB 3.0 Port, MIL-STD-461 EMI 18 ~36V, 2NVMe

ROC250-D17-10C-AC-2N

MIL-STD-810G 19" 1U Short Depth Fanless Server with Intel® Xeon® ICELAKE-D LCCD-1749NT Processor, 1 x VGA, 1 x IPMI , 2 x25 Gigabit Ethernet, 2 x10 Gigabit Ethernet, 2 x USB 3.0 Port, AC 100~240V, 2NVMe

ROC250-D17-8C-12V-4N

MIL-STD-810G 19" 1U Short Depth Fanless Server with Intel® Xeon® ICELAKE-D LCCD-1736NT Processor, 1 x VGA, 1 x IPMI , 2 x25 Gigabit Ethernet, 2 x10 Gigabit Ethernet, 2 x USB 3.0 Port, DC 12V, 4NVMe

ROC250-D17-8C-18V-2N

MIL-STD-810G 19" 1U Short Depth Fanless Server with Intel® Xeon® ICELAKE-D LCCD-1736NT Processor, 1 x VGA, 1 x IPMI , 2 x25 Gigabit Ethernet, 2 x10 Gigabit Ethernet, 2 x USB 3.0 Port, MIL-STD-461 EMI 18 ~36V, 2NVMe

ROC250-D17-8C-AC-2N

MIL-STD-810G 19" 1U Short Depth Fanless Server with Intel® Xeon® ICELAKE-D LCCD-1736NT Processor, 1 x VGA, 1 x IPMI , 2 x25 Gigabit Ethernet, 2 x10 Gigabit Ethernet, 2 x USB 3.0 Port, AC 100~240V, 2NVMe

ROC250-D17-4C-12V-4N

MIL-STD-810G 19" 1U Short Depth Fanless Server with Intel® Xeon® ICELAKE-D LCCD-1718T Processor, 1 x VGA, 1 x IPMI , 2 x25 Gigabit Ethernet, 2 x10 Gigabit Ethernet, 2 x USB 3.0 Port, DC 12V, 4NVMe

ROC250-D17-4C-18V-2N

MIL-STD-810G 19" 1U Short Depth Fanless Server with Intel® Xeon® ICELAKE-D LCCD-1718T Processor, 1 x VGA, 1 x IPMI , 2 x25 Gigabit Ethernet, 2 x10 Gigabit Ethernet, 2 x USB 3.0 Port, MIL-STD-461 EMI 18 ~36V, 2NVMe

ROC250-D17-4C-AC-2N

MIL-STD-810G 19" 1U Short Depth Fanless Server with Intel® Xeon® ICELAKE-D LCCD-1718T Processor, 1 x VGA, 1 x IPMI , 2 x25 Gigabit Ethernet, 2 x10 Gigabit Ethernet, 2 x USB 3.0 Port, AC 100~240V, 2NVMe