ROC250-D17
Military 1U Short Depth Xeon DE (Ice Lake) Fanless Server
- Ultra-High Performance Intel® Xeon® Ice Lake D-1749NT, 10 Cores
- MIL-STD 810 Vibration, Shock, Thermal
- Short Depth 380mm, Fanless Cooled
- Up to 128GB RDIMM/64GB UDIMM, 2CH DDR4 2933MHz in 2 Slots
- 4x NVMe (Gen 4.0) U.2
- 2x 25Gigabit Ethernet, 2x 10Gigabit Ethernet, 1 x IPMI
- 1x VGA , 2x USB 3.0 Ports ,1x PCIe 4.0 x 8 Expansion Slot
- Extended Temperature -20°C to 60 °C
- Technical Profile
- Specifications
- Order Information
Introduction
Intel® Xeon® D-1700 and D-2700 processors are high-performance SoCs with integrated Ethernet in high-density Ball-Grid Array packages. They deliver server-class computing, hardware-based security, and high-bandwidth I/Os for embedded and rugged applications at the edge.
The Intel® Xeon® D-1700 and D-2700 processors with up to 20 cores, with Integrated AI acceleration, support for hard-real-time workloads, extreme temperature range and industrial use conditions.1 This makes them ideal for demanding applications in high-bandwidth video analytics, as well as manufacturing, aerospace, etc.
Intel® Xeon® D processors, enhanced for IoT, are a high-density platform that packs server-class computing and I/Os, plus accelerated AI, into compact BGA packages for soldered-down embedded and rugged designs.
Extended operating temperature ranges and industrial-class reliability make Intel® Xeon® D-1700 and D-2700 SoCs ideal for high-performance rugged equipment and sealed fanless devices that must run nonstop in the toughest environments.
- MAIN FEATURE
-
- Ultra-High Performance Intel® Xeon® Ice Lake D-1749NT (10xC)
- MIL-STD 810 Vibration, Shock, Thermal
- Short Depth 380mm, Fanless Cooled
- Intel® Xeon® ICELAKE-D LCC D-1749NT 10 Cores Processor
- Up to 128GB RDIMM/64GB UDIMM, 2CH DDR4 2933MHz in 2 Slots
- 4xNVMe (Gen 4.0) U.2
- 2 x 25Gigabit Ethernet, 2 x 10Gigabit Ethernet, 1 x IPMI
- 1 x VGA , 2 x USB 3.0 Ports ,1 x PCIe 4.0 x 8 Expansion Slot
- Extended Temperature -20 to 60 °C
- MIL-STD Environment
-
- Operating Temperature High: 50°C, MIL-STD-810G, Method 501.5, Procedure I
- Operating Temp Low: 0°C, MIL-STD-810G, Method 502.5, Procedure I
- Non-Operating Temperature High: 70°C, MIL-STD-810G, Method 501.5, Procedure II
- Non-Operating Temperature Low: -40°C, MIL-STD-810G, Method 502.5, Procedure II
- Operating Altitude: Up to 15,000 ft., MIL-STD-810G, Method 500.5
- Non-Operating Altitude: Up to 45,000 ft., MIL-STD-810G, Method 500.5
- Humidity: MIL-STD-810G, Method 507.5, Procedure Ib (Natural Cycle B3)
- Shock: MIL-STD-810G, Method 516.6, 30 g’s, Saw-tooth, 11ms & MIL-DTL-901E, Grade A, Class II; Type B
- Vibration: MIL-STD-167, Type I, Deck Mounted Equipment
- EMI/EMC: MIL-STD-461F, RE101, RE102 (Shipboard Level 1), RS103, CE101, CE102, CS101, CS114, CS116
- Airborne Noise: MIL-STD-740-1 compliance: 43.7dBA (Idle), 52.5dBA (50%), 54.6dBA (80%).
System |
|
---|---|
High Performance Processor |
Intel® Xeon® ICELAKE-D LCC Processor D-1749NT (Frequency 2.5GHz) 10-Core,20 Thread Support |
Memory type |
Up to 128GB RDIMM/64GB UDIMM, 2CH DDR4 2933MHz |
Chipset |
System on Chip |
Expansion Slot |
1x PCI-E 4.0 x 8 |
Display |
|
VGA |
Resolution up to 1920×1200@60Hz |
Storage |
|
Storage Device |
4x NVMe Gen 4.0 |
Ethernet |
|
Ethernet |
2x Intel 25GbE SFP28 (SoC) 2x 10GBase-T (Intel X550-AT2) |
Front I/O |
|
Button |
1x Power Button w/Indicator LED |
Indicator LED |
1x HDD LED |
SSD Tray |
4x NVMe Gen 4.0 |
REARI/O |
|
Ethernet |
2x SFP28 25Gigabit Ethernet LAN Interfaces 2x RJ45 10Gigabit Ethernet LAN Interfaces 1x IPMI LAN Interface |
VGA Port |
1x DB15 connector |
USB Port |
2x USB3.0 standard-A connectors |
AC-IN |
1x IEC C14 Plug |
Power Requirement |
|
Power Input |
100V~240V AC-IN MIL-461 18V~36V DC-IN |
Applications, Operating | |
Applications |
Commercial and Military Platforms Requiring Compliance to MIL-STD-810G Embedded Computing, Process Control, Intelligent Automation and manufacturing applications where Harsh Temperature, Shock, Vibration, Altitude, Dust and EMI Conditions. Used in all aspects of the military |
Operating System |
Windows 10 64Bit, Windows Server 2008 R2, Windows Server 2012 R2 Ubuntu14.04, Fedora 20/23, RedHat Linux EL 7.1/7.2, Vmware ESXi 6.0, ESXi 6.5 |
Physical | |
Dimension (W x D x H) | 430 x 380 x 44.6 mm |
Weight | 5.75kg(12.68lbs) |
Chassis | SECC |
Finish | Anodic aluminum oxide (Black) |
Cooling | Natural Passive Convection/Conduction. No Moving Parts |
Ingress Protection | Dust Proof (Similar to IP40) |
Environmental | |
MIL-STD-810G Test |
Method 507.5, Procedure II (Temperature & Humidity) Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock) Method 516.6 Shock-Procedure I Operating (Mechanical Shock) Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration) Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration) Method 501.5, Procedure I (Storage/High Temperature) Method 501.5, Procedure II (Operation/High Temperature) Method 502.5, Procedure I (Storage/Low Temperature) Method 502.5, Procedure II (Operation/Low Temperature) Method 503.5, Procedure I (Temperature shock) |
Operating Temperature | -10 to 60°C (ambient with 0.7m/s airflow) |
Storage Temperature | -40 to 85°C |
EMC | CE and FCC compliance |
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ROC250-D17-4C-AC-2N
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