7SL-XR7620

7SL-XR7620 Dell Rugged 2U Server
7SL-XR7620 Dell Rugged 2U Server

Intel 4/5th XEON SP 2U, 2-socket, short-depth Military Rugged HPC

  • Dual Intel® 4/5th XEON® SP Processor   Silver, Gold
  • Up to 7 PCIe slots - Full - Height, Half-Lenth and low profile,◎4x Single-width Full-Height/Half-Length (PCIe x 16) 75W, ◎2x Double-width Full-Height/Full-Length (PCIe x 16) 350W, ◎1x Low Profile 75W
  • 4 x 2.5" Swappable SATA SSD up to (RAID 0,1,5,10)
  • 1 x USB 2.0, 1 x iDAC Direct (Micro-AB USB 2.0), 1 x iDRAC dedicated, 1 x USB 3.0, 1 x Serial port (optional on slot 5), 1 x VGA
  • MIL-STD-810 Vibration Method  514.6 : ◎Acceleration : 5.0 Grms
  • MIL-STD-810 Vibration Method  514.6 : ◎ PSD : 0.01257 g2/Hz
  • MIL-STD-810 Shock Method 516.6 : ◎ Wave From : Half Shine Wave
  • MIL-STD-810 Shock Method 516.6 : ◎ Acceleration : 20G
  • MIL-STD-810 Temperature Method 501.5 502.5 : ◎ Operating Temp High 55°C
  • MIL-STD-810 Temperature Method 501.5 502.5 : ◎ Operating Temp Low -30°C
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Dell Tier 1 Server maker partnering with 7Starlake

 

Powered by 7StarLake, Dell takes rugged computing to the next level, delivering OEM servers with unparalleled resilience in vibration, shock, extreme temperatures, and ruggedization. Engineered for unmanned systems, military, defense, AI-enabled applications, and mission-critical industries, Dell’s partnership with 7StarLake ensures hardened reliability, seamless performance, and battlefield-ready durability—empowering edge AI, situational awareness, and autonomous operations in the harshest environments. Mission success starts with Dell’s ruggedized OEM solutions.

 

Dell Partner

 

Product Highlight
Technical Specification

5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E)

Up to 16/32 Cores per Processor

Up to 1TB memory with 8 DIMM slots

Storage Internal Controllers: PERC H965i, PERC H965e, PERC H755, PERC H355, HBA355i

(BOSS-N1): HWRAID 1, 2 x M.2 NVMe SSDs

Management and Operating System

Windows®, VMWARE, Ubuntu Server LTS, Windows Server with Hyper-V, Red Hat Enterprise Linux, SUSE Linux Enterprise Server, VMware ESX

AMI UEFI BIOS type

iDRAC9, iDRAC Direct, iDRAC RESTful API with Redfish, iDRAC Service Module, NativeEdge Endpoint Orchestrator

TPM 2.0 support

Expansion

Up to 5 PCIe slots (4 x16 Gen4/Gen5, 1 x 16 LP Gen4)

4x 2.5-inch SATA III, SAS, or NVMe SSDs max 61.44 TB, Up to 8 x E3.S NVMe direct drives, 51.2TB max

Input/Output Versatility

1x Power Button

1x SSD Status LED

2x AC-IN Jack

(Front)

1x iDRAC Direct (Micro-AB USB 2.0) port, 1 x USB 2.0

(Rear)

1 x iDRAC dedicated port, 1 x USB 3.0, 1 x Serial (Micro- AB USB 2.0) port, 1 x Mini-DisplayPort, 1 x RJ45 for dry contact, 2 x 10 GbE SFP+ LOM

Power Supply Options

Redundant 1400 W Platinum 100/240V VAC

1100 W -48 ~ (-60) VDC (Optional)

Thermal Solution

Air Cooling 6 x Standard cold swap fans

Environmental
Operating

Temperature: -10°C to 55°C

Humidity: 5%to 95%, non-condensing

Shock: 3 axis, 25g

Vibration: 5Grms

Non-Operating

Temperature: -20°C to 60°C

Humidity: 5%to 95%, non-condensing

MIL-STD-810 Test

Method 500.5, Procedures I and II (Altitude, Operation):

12,192M, (40,000 ft) for the initial cabin altitude (18.8Kpa or 2.73 Psia)

Method 500.5, Procedures III and IV (Altitude, Non-Operation):

15,240, (50,000 ft) for the initial cabin altitude (14.9Kpa or 2.16 Psia)

Method 501.5, Procedure I (Storage/High Temperature)

Method 501.5, Procedure II (Operation/High Temperature)

Method 502.5, Procedure I (Storage/Low Temperature)

Method 502.5, Procedure II (Operation/Low Temperature)

Method 503.5, Procedure I (Temperature shock)

Method 507.5, Procedure II (Temperature & Humidity)

Method 509.7 Salt Spray (50±5)g/L(Optional for Conformal Coating)

Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)

Method 514.6, Vibration Category 20/Operating (Category 20 & 24, Vibration)

Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock)

Method 516.6, Shock-Procedure I Operating (Mechanical Shock)

Mechanical

Height: 3.41 inches (86.8mm)

Width: 19 inches (482.6mm)

Depth: 22 inches (572mm) with bezel

18.57inches (471.8mm) without bezel

Weight: 46.64 pounds (21.16kg)

Appearance
7SL-XR76207SL-XR7620

 

System
Processor Two 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors, Socket E (LGA-4677)
CPU Core Count Up to 16 Cores/32 Cores
Memory Type DDR5-5600MT/s RDIMM ECC, up to 1TB in 8 DIMM slot, up to 1TB in 8 DIMM slot
GPU Options Up to 5 x 75W (Single Width Full Height/Half Length, Low Profile) GPU or Up to 2 x 300W (Double Width Full Height/Full Length)
TPM Chipset: Infineon, Type: TPM 2.0
IPMI iDRAC RESTful API with Redfish
BIOS AMI UEFI BIOS
USB 1x USB3.0 +1x USB2.0 ports
Ethernet 4x 25G Ethernet SFP+ Ports
Power Type 100V~240V AC IN Redundant
Storage 4x 2.5” Swappable SATA SAS
Operating Temp. -10°C to +55°C
Dimension 482mm(W) x 572mm(D) x 86mm(H)
Front I/O
Power Button 1x
SSD LED indicator 1x
Swappable SSD Tray 4x
iDAC 1x iDRAC Direct (Micro-AB USB 2.0) port, 1 x USB 2.0
StorageRear I/O
iDAC 1x iDRAC dedicated Direct port
USB3.0 1x
Serial 1x (Micro-AB USB 2.0)
1G LAN1 1x
10 LAN 2x
Display port 1x Mini-DP or VGA
Environmental
MIL-STD-810 Test

Method 500.5, Procedures I and II (Altitude, Operation):

12,192M, (40,000 ft) for the initial cabin altitude (18.8Kpa or 2.73 Psia)

Method 500.5, Procedures III and IV (Altitude, Non-Operation):

15,240, (50,000 ft) for the initial cabin altitude (14.9Kpa or 2.16 Psia)

Method 501.5, Procedure I (Storage/High Temperature)

Method 501.5, Procedure II (Operation/High Temperature)

Method 502.5, Procedure I (Storage/Low Temperature)

Method 502.5, Procedure II (Operation/Low Temperature)

Method 503.5, Procedure I (Temperature shock)

Method 507.5, Procedure II (Temperature & Humidity)

Method 509.7 Salt Spray (50±5)g/L(Optional for Conformal Coating)

Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 24,Vibration)

Method 514.6, Vibration Category 20/Operating (Category 20 & 24,Vibration)

Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock)

Method 516.6, Shock-Procedure I Operating (Mechanical Shock)
Operating Temp. -10°C to +55°C
Storage Temp. -20°C to +60°C
Relative Humidity 5% to 95%, non-condensing
 

7SL-XR7620-AC

 7SL-XR7620-DC

CPU

Two 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors, Socket E (LGA-4677)

 Two 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors, Socket E (LGA-4677)

RAM

DDR5-5600MT/s RDIMM ECC, up to 1TB in 16 DIMM slot

 DDR5-5600MT/s RDIMM ECC, up to 1TB in 16 DIMM slot

Storage

4x 2.5” Swappable SATA SAS, or NVMe SSD or 8 x E3.S NVMe direct drive

 4x 2.5” Swappable SATA SAS, or NVMe SSD or 8 x E3.S NVMe direct drive

Power

1800W 100V~240V AC IN Redundant

 1100W DC 48V~60V

Thermal

Active Smart Fan Cooling

 Active Smart Fan Cooling