SCH-X401
Micro-Grid Computer with Intel® 10th Gen (Cometlake-S) i9-10900TE processor, Extended range of Temperature Support from -20°C to 60°C
- 10th Gen Core i Comet Lake-S
- DDR4 SODIMM up to 64GB
- 2x Swap SSD – Support RAID 0/1
- TPM2.0 Security on Board
- Multi Display with DisplayPort, HDMI
- 2 x COM, 2 x LAN, 6 x USB
- 110V AC-IN with Redundant
- Technical Profile
- Specifications
- CPU
- Order Information
-
A.Introduction
-
A Microgrid is a small scale, a type of local electric subsystem that combines power from distributed energy generation sources, connected to the general grid at a single point. A Microgrid is a self-contained power system that has the ability to locally generate, distribute, and store energy. It also is a localised energy grid, which is generally linked to the main grid but can disconnect automatically and function as its own independent grid when necessary. This connection also can be acted as a switch that makes it possible to disconnect a Microgrid from the public grid (should anything happen to the main grid such as a blackout.) and operate it temporarily in island mode.
A Microgrid can be powered by distributed generators, batteries, and/or renewable resources like solar panels. Depending on how its requirements are managed, a Microgrid might run indefinitely.
How does Micro-Grid work?
Microgrid is including three essential sections:
- Local energy (such as photovoltaic panels, wind turbines, heat pumps, biomass plants, hydroelectric turbines, etc.) and an additional back-up supply of energy (power generators).
- Storage system: batteries, a supply of water for pumped-storage hydroelectricity.
- Smart management system to ensure the continuous balance between electricity generation and demand.
A fully functioning Microgrid computer system is important for ensuring all processes work correctly and that energy is always being distributed in an efficient manner. 7Starlake provides state-of-the-art solutions for substation automation and Micro-Grid applications for both public utilities and enterprises. Our rich experience in this industry, coupled with our innovative work on the latest technologies, enables us to develop market-specific solutions for computing and communication applications in this domain.
SCHX4 is designed especially for Microgrid customer such as SCHNEIDER with a highly efficient and powerful computing performance driven by the Intel 10th Gen, Cometlake-S i9-10900TE, in addition, SCHX4 system also supports a wide range DC-in from 12V to 24V, and accepts the extend range of temperature from -20°C to 60°C (CPU Full Speed with no throttling @ 50°C). SCHX4 passes the MIL-STD 810G compliance which can operate successfully in any harsh environments.
-
B.Architecture
-
Grid Connected:
The microgrid operates in parallel with the grid, making your community more sustainable and reducing your energy consumption from the grid.
Grid Islanded:
In this mode, the microgrid will power all the critical loads in the community on the utility distribution network when there is no grid power. All of the facilities will stay powered during these extreme events.
Grid Connected:
The microgrid operates in parallel with grid and has the ability to import and export to the grid in response to appropriate price signals. This configuration requires sophisticated controls, testing, and integration to manage interaction with grid.
Grid Islanded:
- C. Drawing
-
System |
|
---|---|
CPU | 10th Generation Intel® Core™ i9/i7/i5 Processors Intel® Core™ i9-10900TE(20M Cache, up to 4.60 GHz) Intel® Core™ i7-10700TE(16M Cache, up to 4.50 GHz) Intel® Core™ i5-10500TE(12M Cache, up to 3.70 GHz) |
Memory | DDR4 SO-DIMM up to 64GB |
Chipset | Q470E |
Display |
|
GPU | Intel® UHD Graphics |
Display Port | DisplayPort 1.4, DP++ Max resolution up to 4096x2160@60Hz |
HDMI | HDMI 2.0a, Max resolution up to 4096x2160@60Hz |
Expansion |
|
Expansion | 1 x M.2 (Key E, 2230) with PCIe x1, USB 2.0 and CNVi for Wireless 1 x M.2 (Key B, 3042 / 3052) with PCIe x1 / USB 3.0 / USB2.0 and SIM for 4G / 5G |
Storage |
|
Storage | 1 x M.2 (Key M, 2242 / 2260 / 2280) with PCIE x4 or SATA3 |
Ethernet |
|
Ethernet | 1 x Intel Gigabit Ethernet LAN Interfaces (10/100/1000 Mbps) 1 x Intel 2.5Gigabit Ethernet LAN Interfaces (10/100/1000/2500 Mbps) |
Rear I/O |
|
Power Button | 1 x with backlight |
Indicator | 1 x HDD backlight |
USB | 2 x USB2.0 |
Storage | 2 x SSD Tray |
Front I/O |
|
Power Input | 2 x 3P C14 Plug |
LAN |
1 x GbE RJ45 LAN 1 x 2.5GbE RJ45 LAN |
DisplayPort | 2 x DP |
HDMI | 1 x HDMI |
Audio | 1 x Mic-in ; 1 x Line out |
COM | 2x RS232/422/485 |
Power |
|
Power Input | AC-IN 110V with Redundant |
OS Support List |
|
Windows | Windows 10 x 64 |
Linux | Linux Support by request |
Mechanical and Environmental |
|
Dimension (WxDxH) | 430 x 300 x 74 mm |
Operating Temperature | -20°C to 60°C |
Storage Temperature | -40°C to 85°C |
Relative Humidity | 5% to 95%, non-condensing |
EMC | CE and FCC Certification |
Green Product | RoHS, WEEE compliance |
System Design | Fanless |
Mounting | 2U Rackmount |
Intel® Core™ i7-10700TE/i9-10900TE Processor
Thermal Point \ Testing Temp. |
-20°C |
0°C |
+25°C |
+40°C |
+50°C |
+55°C |
+60°C |
---|---|---|---|---|---|---|---|
CPU Frequency (GHz) |
3.69 |
3.69 |
3.69 |
3.69 |
1.99~3.69 |
1.99~3.69 |
1.99~3.69 |
CPU Heatsink |
19.2 |
20.1 |
60 |
66.4 |
71.1 |
75 |
81.9 |
CPU Die |
24.5 |
25.6 |
70 |
71.7 |
75.5 |
78 |
77.3 |
CPU T-J (℃) |
39℃ |
42℃ |
89℃ |
90℃ |
78~98℃ |
80~99℃ |
83~100℃ |
- Test Configuration
-
Device
Configuration
CPU Type
Intel® Core™ i7-10700TE Processor 2.0 GHz
PCH
Intel Q470E
Memory
Innodisk 8GB SOD DDR4 2666 X2
SATA port 1
InnDisk 3MG2-P SSD 64G
DP
Dell U2312
LAN1 ~ LAN2
LAN (Loopback)
USB1~USB4
1A cement resistor
COM Com port loopback Test Software
Burnin test v9.0 XTU CPU STRESS,FU MARK
Chamber
KSON THS-b4t-150
Chipeng SMO-3Test Equipment FSP060-DBAE1、PROVA 11_AC/DC mA clamp meter、Agilent U1252B
SCH-X401
Micro-Grid 10th CPU Fanless Computer with Intel. 10th Gen. Core i3/i5/i7/i9 up to 65W Processor, up to 64G SO-DIMM DDR4, 2 × RJ45 GbE, 4 x USB3.0, 2 x USB2.0, 2 x COM, 2 x DP, 1 x HDMI, 2 x SSD Tray, AC–IN 110~240C with redundant, Operating Temperature -20~+60°C