SCH406
2U 19" Smart Grid Fanless System with Intel®10th Gen Xeon W-1290TE / Core i9-10900TE , 10GbE LAN, 1x IPMI Support, 2x 200W AC Redundant Power Supply, Operating Temperature -20°C to 60°C
- Intel 10th Gen Xeon® W-1290TE/ Core i9-10900TE Processor
- 4x DDR4 up to 128GB(Unbuffered ECC/non-ECC UDIMM),2933MHz
- 10GbE LAN (by option), 1x IPMI Support
- 2x RJ45 GbE LAN, 2x RJ45 10GbE ,4x USB3.2, 4x USB2.0,
- 2x DP, 1x VGA, 1x DVI-D
- 4x 2.5” Easy swap SSD/HDD Tray (Support RAID 0,1,5,10)
- 3x PCIe Expansion Slots
- Trusted Platform Module
- FDTI ( Security Module By Options)
- Extended Temperature -20°C to 60°C
- Technical Profile
- Specifications
- Order Information
- Download
- Introduction
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Gateways are rugged communication devices collecting numerous data, such as metering, status, events and fault report from any protection device while sending this information upstream to a control center, transfering commands issued from the control center to other devices. One example of a particular need for gateways is in the energy industry. The energy industry requires specific types of devices using specific protocols. With PLCs/PACs becoming popular in these applications, gateways has grown into a necessary part of Substation Automation Systems, and its reliability may affect the safety of whole system at a station level.
As a leading company specialized in energy related application, 7Starlake’s experienced team designed an extremely reliable Gateway system SCH406, which is powered by Intel 10th Gen Xeon W-1290TE/Core i9-10900TE , enabling highly efficient processing capability to deal with a large amount of data delivering between IEC-61850 devices and the Control Center. In advantage of other outstanding features, such as extended temperature -20~+60°C, 100V~240V AC Input, SCH406 is an undoubtedly best choice for Gateway application in Substation.
- Key Features
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(1)Security Redundancy
Integrating TPM module, operating systems can require an authentication to protect keys, data or systems.
(3)Rich communication Interface
In advantage of SCH406 diverse I/O, 4 x LAN(RJ45), 2 x COM(DB9), 6 x USB, 2 x DP, 1 x VGA, 1 x DVI-D, the SCH400 system can satisfy all our clients.
(5)IEC-61850-3
The standardization of IEC-61850 enables the integration of the equipment and systems from different suppliers, reducing the burden on the configuration and maintenance of these systems. The protocol also meets utilities’ requirements for long-term system expandability. Thus, there are more and more electric companies perform power-system automation by using IEC-61850 protocol with Intelligent electronic devices (IED)
(7)Network Redundancy
PRP/HSR network will be required as an efficient and cost effective solution in order to construct a seamless/bumpless communication infrastructure to ensure maximum system availability.
(2)Power Redundancy
The design of wide power range keeps the system’s reliability and you can expect longer life-span as well. Sudden drop or surge of power posts absolutely no threat to this smart system.
(4)IEEE-1613
The widespread use of multifunctional intelligent electronic devices with advanced communications capabilities has resulted in a new trend in substation automation systems. The intelligent electronic devices exchange messages over the substation local area network. Detail environment and testing requirements for communications networking devices in electric power substations.
(6)Data Redundancy
RAID function supports an assortment to help protect or speed up the performance of a computer's disk storage. RAID 0/1/5/10 function makes SCH406 to archive it.
(8)Extreme Temperature
Copper heat spreader, pure copper heat pipe and aluminum heat sink, with all these benefits of fanless design. To ensure high reliability and stability while SCH406 working under wide range temperature from -20°C up to +60°C. And, with SCH406 special industrial extended range of temperature layout, it can also reduce the potential computer glitches caused by hardware incompatibility and losses of connectivity caused by shock and vibration.
- Drawing
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System |
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CPU |
10th Generation Intel® Xeon® W-1200 Processors Intel® Xeon® W-1290TE Processor (20M Cache, up to 4.50 GHz) Intel® Xeon® W-1250TE Processor (12M Cache, up to 3.80 GHz)
10th Generation Intel® Core™ i9/i7/i5 Processors Intel® Core™ i9-10900TE(20M Cache, up to 4.60 GHz) Intel® Core™ i7-10700TE(16M Cache, up to 4.50 GHz) Intel® Core™ i5-10500TE(12M Cache, up to 3.70 GHz) |
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Memory type |
4x DDR4 up to 128GB |
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Expansion Slot |
1x PCI-E 3.0 x16 2x PCI-E 3.0 x4 |
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Storage Device |
4x 2.5” Easy swap HDD/SSD Tray (Support RAID 0,1,5,10) |
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Rear I/O |
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Power Button |
1x with backlight |
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USB |
2x USB 2.0 |
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Front I/O |
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Power Input |
2x 100V~240V AC-IN |
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LAN |
2x RJ45 GbE LAN ; 2x RJ45 10GbE LAN (by option) ; 1x IPMI |
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USB |
4x USB 3.2 |
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DisplayPort |
2x DP |
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DVI |
1x DVI-D |
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VGA |
1 VGA |
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Optional |
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Dual 10GbE SFP+ Module |
INTEL X710 Dual 10GbE SFP+ LAN card |
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Power |
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Power Input |
100V~240V AC-IN, 2x 200W AC/DC Redundant Power Supply |
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OS support list |
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Windows |
Windows 10 x64 |
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Linux |
Ubuntu, Red Hat |
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Mechanical and Environmental |
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Dimension |
430 x 450 x 88 mm ( W x D x H ) |
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Operating Temp. |
-20°C to 60°C |
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Storage Temp. |
-40°C to 85°C |
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Relative Humidity |
5% to 95%, non-condensing |
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Standards |
CE, FCC, MIL-STD 810 Compliance |
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System Design |
Fanless |
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Mounting |
2U Rackmount |
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MIL-STD-810 |
Method 507.5, Procedure II (Temperature & Humidity) |
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Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock) |
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Method 516.6 Shock-Procedure I Operating (Mechanical Shock) |
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Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration) |
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Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration) |
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Method 501.5, Procedure I (Storage/High Temperature) |
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Method 501.5, Procedure II (Operation/High Temperature) |
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Method 502.5, Procedure I (Storage/Low Temperature) |
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Method 502.5, Procedure II (Operation/Low Temperature) |
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Method 503.5, Procedure I (Temperature shock) |
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EMC |
CE, FCC compliant |
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Green Product |
RoHS, WEEE compliance |
SCH-401
2U 19” Smart Grid Fanless Rackmount Server with Intel® 10th Gen. XEON W-1200 ; Core i Processor up to 35W ,2 x GbE, 6 x USB, 2 x DP, 1 x VGA, 1 x DVI-D, 1 x IPMI, 125V DC-IN, 2 x 200W DC/DC Redundant Power Supply, TPM/FTDI support, Operating Temperature -20~+60°C
SCH400-AA
2U 19” Smart Grid Fanless Rackmount Server with Intel® 10th Gen. XEON W-1200 ; Core i Processor up to 35W ,2 x GbE, 6 x USB, 2 x DP, 1 x VGA, 1 x DVI-D, 1 x IPMI, 9V~36V DC-IN, 2 x 150W DC/DC Redundant Power Supply, Operating Temperature -20~+60°C
SCH-406
2U 19” Smart Grid Fanless Rackmount Server with Intel® 10th Gen. XEON W-1200 ; Core i Processor up to 35W ,2 x GbE,2 x 10GbE, 6 x USB, 2 x DP, 1 x VGA, 1 x DVI-D, 1 x IPMI, 100~240V AC-IN, 2 x 200W AC/DC Redundant Power Supply, Operating Temperature -20~+60°C
| Attachment | Size |
|---|---|
| T210722D10-D (SCH-401) FCC Part 15 B.pdf (734.69 KB) | 734.69 KB |
| T210722D10-E (SCH-401) EN 55032&35.pdf (1.65 MB) | 1.65 MB |
| Verification - CE_0.pdf (146.8 KB) | 146.8 KB |
| Verification - FCC_0.pdf (146.23 KB) | 146.23 KB |
| SCH400 Series_System test report_2.pdf (7.98 MB) | 7.98 MB |